Patents by Inventor CHIN-WEI YANG
CHIN-WEI YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250070046Abstract: An integrated circuit includes a semiconductor substrate, an interconnection structure, a first dielectric layer, conductive pads, a second dielectric layer, conductive connectors, and an anti-stress layer. The interconnection structure is disposed on the semiconductor substrate. The first dielectric layer is disposed on the interconnection structure. The conductive pads are disposed on the first dielectric layer and are electrically connected to the interconnection structure. The second dielectric layer is disposed on the first dielectric layer to laterally surround the conductive pads. The conductive connectors are disposed on and electrically connected to the conductive pads. The anti-stress layer is disposed over the conductive pads and laterally surrounds some of the conductive connectors.Type: ApplicationFiled: August 23, 2023Publication date: February 27, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cong-Wei Yang, Yu Chen Lee, Chin-Hua Wang, Shin-Puu Jeng
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Publication number: 20250071935Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Chin-Ting Chen, Chih-Wei Yang, Shu-Cheng Yang, Che-Wei Chang, Wen-Cheng Huang, Chin-Hung Lee, Chih-Wei Chan
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Publication number: 20250062176Abstract: A device structure includes: an interposer including interposer dielectric material layers having formed therein interposer metal interconnect structures and die-side interposer bonding pads; at least one semiconductor die having formed therein in-die bonding pads that are bonded to a respective one of the die-side interposer bonding pads by metal-to-metal bonding; and a composite die frame laterally surrounding the at least one semiconductor die. The composite die frame includes a molding compound die frame portion including a molding compound material and frame edge reinforcement structures located at corners of the composite die frame and including a material having a lower coefficient of thermal expansion at 20 degrees Celsius than the molding compound material.Type: ApplicationFiled: August 14, 2023Publication date: February 20, 2025Inventors: Chin-Hua Wang, Tsung-Yen Lee, Cong-Wei Yang, Shin-Puu Jeng
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Patent number: 12217530Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.Type: GrantFiled: April 18, 2023Date of Patent: February 4, 2025Assignee: QUALCOMM IncorporatedInventors: Shiang-Chi Lin, Hrishikesh Vijaykumar Panchawagh, Jessica Liu Strohmann, Yipeng Lu, Chin-Jen Tseng, Kostadin Dimitrov Djordjev, Min-Lun Yang, Chia-Wei Yang
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Patent number: 12094244Abstract: A method for recognizing masked faces includes: obtaining a face image to be recognized; detecting whether the face image to be recognized has a mask; extracting feature vectors of a whole face in the face image to be recognized when the face image to be recognized does not have a mask; comparing the feature vectors of the whole face with face images in a first database, and outputting a face recognition result; extracting feature vectors of an upper half face in the face image to be recognized when the face image to be recognized has a mask; comparing the feature vectors of the upper half face with face images in a second database, and outputting the face recognition result. The method of the present disclosure processes images of faces with and without masks, expanding application scenario of face recognition and improving the accuracy of recognition.Type: GrantFiled: December 20, 2021Date of Patent: September 17, 2024Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.Inventor: Chin-Wei Yang
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Patent number: 11922724Abstract: A device and a method and a non-transitory readable storage medium, for face recognition are provided, the method comprise: extracting a face sample image from a predetermined face sample library and performing feature point detection to obtain multiple face feature points; obtaining multiple mask images; selecting first to fourth face feature points from the multiple face feature points; defining a distance between the first and second face feature point as a mask image height, and defining a distance between the third and fourth face feature point as a mask image width; adjusting a size of each mask image according to the mask image height and the mask image width; fusing each adjusted mask image with the face sample image to obtain multiple face mask images to save into the predetermined face sample library; training a face recognition model based on the predetermined face sample library for face recognition.Type: GrantFiled: October 12, 2020Date of Patent: March 5, 2024Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.Inventor: Chin-Wei Yang
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Publication number: 20220327862Abstract: A method for detecting whether a face is masked includes acquiring a face image to be recognized; performing face detection on the face image to be recognized to determine a first face area; preprocessing the first face area to obtain a first square face image; performing face recognition on the first square face image using a face recognition model and outputting a result of recognition or non-recognition. The method of the present disclosure obtains a square face area by preprocessing face detection results, optimizing the process flow of masked-face recognition, and improves the accuracy of recognition.Type: ApplicationFiled: December 20, 2021Publication date: October 13, 2022Inventor: CHIN-WEI YANG
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Publication number: 20220327861Abstract: A method for recognizing masked faces includes: obtaining a face image to be recognized; detecting whether the face image to be recognized has a mask; extracting feature vectors of a whole face in the face image to be recognized when the face image to be recognized does not have a mask; comparing the feature vectors of the whole face with face images in a first database, and outputting a face recognition result; extracting feature vectors of an upper half face in the face image to be recognized when the face image to be recognized has a mask; comparing the feature vectors of the upper half face with face images in a second database, and outputting the face recognition result. The method of the present disclosure processes images of faces with and without masks, expanding application scenario of face recognition and improving the accuracy of recognition.Type: ApplicationFiled: December 20, 2021Publication date: October 13, 2022Inventor: CHIN-WEI YANG
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Publication number: 20220327864Abstract: A device and a method and a non-transitory readable storage medium, for face recognition are provided, the method comprise: extracting a face sample image from a predetermined face sample library and performing feature point detection to obtain multiple face feature points; obtaining multiple mask images; selecting first to fourth face feature points from the multiple face feature points; defining a distance between the first and second face feature point as a mask image height, and defining a distance between the third and fourth face feature point as a mask image width; adjusting a size of each mask image according to the mask image height and the mask image width; fusing each adjusted mask image with the face sample image to obtain multiple face mask images to save into the predetermined face sample library; training a face recognition model based on the predetermined face sample library for face recognition.Type: ApplicationFiled: October 12, 2020Publication date: October 13, 2022Inventor: CHIN-WEI YANG
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Patent number: 11036971Abstract: A method for recognizing, identifying, and authenticating persons to be identified from their faces in a preset scenario, includes uploading a first image of users to a server, and receiving the first image on which first facial rectangles and user information have been imposed, and capturing a second image and detecting second facial rectangles therefrom. The method determines whether a number of faces of the second image is equal to a number of faces of the first image, and uploading the second image to the server for identifying third facial rectangles of the second image. A plurality of distances is obtained by calculating at least one distance between third and second facial rectangles of each user shown in the second image and determining whether the users shown in the second image are the same as users shown in the first image based on the plurality of distances.Type: GrantFiled: October 11, 2019Date of Patent: June 15, 2021Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Chin-Wei Yang
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Patent number: 10915739Abstract: A face recognition method applied to establish authentic or artificial faces before searching for a person match in a database includes establishing a deep network model, obtaining training data and training the deep network model using the training data. An original image of a human face and a depth image corresponding to the original image are obtained, and authenticity or artificiality is determined by preset methods including use of cosine similarity algorithm. Matching an original image determined as authentic against face images pre-stored in an image database and outputting any match, when the original image is the image of a real person. A face recognition device is also provided.Type: GrantFiled: April 11, 2019Date of Patent: February 9, 2021Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Chin-Wei Yang
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Publication number: 20200387694Abstract: A method for recognizing, identifying, and authenticating persons to be identified from their faces in a preset scenario, includes uploading a first image of users to a server, and receiving the first image on which first facial rectangles and user information have been imposed, and capturing a second image and detecting second facial rectangles therefrom. The method determines whether a number of faces of the second image is equal to a number of faces of the first image, and uploading the second image to the server for identifying third facial rectangles of the second image. A plurality of distances is obtained by calculating at least one distance between third and second facial rectangles of each user shown in the second image and determining whether the users shown in the second image are the same as users shown in the first image based on the plurality of distances.Type: ApplicationFiled: October 11, 2019Publication date: December 10, 2020Inventor: CHIN-WEI YANG
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Publication number: 20200210687Abstract: A face recognition method applied to establish authentic or artificial faces before searching for a person match in a database includes establishing a deep network model, obtaining training data and training the deep network model using the training data. An original image of a human face and a depth image corresponding to the original image are obtained, and authenticity or artificiality is determined by preset methods including use of cosine similarity algorithm. Matching an original image determined as authentic against face images pre-stored in an image database and outputting any match, when the original image is the image of a real person. A face recognition device is also provided.Type: ApplicationFiled: April 11, 2019Publication date: July 2, 2020Inventor: CHIN-WEI YANG
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Patent number: 10083899Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.Type: GrantFiled: January 23, 2017Date of Patent: September 25, 2018Assignee: Infineon Technologies AGInventors: Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos, Chiew Li Tai, Chin Wei Yang
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Publication number: 20180211907Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.Type: ApplicationFiled: January 23, 2017Publication date: July 26, 2018Inventors: Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos, Chiew Li Tai, Chin Wei Yang
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Publication number: 20080124485Abstract: Method of successively depositing a multi-film is disclosed. An electric charge removing process is performed after a deposition process of the last film of the multi-film or between the two neighboring film deposition processes. The electric charge removing process includes introducing an inert gas into a reaction chamber of the deposition system and pumping out the inert gas from the reaction chamber.Type: ApplicationFiled: November 27, 2006Publication date: May 29, 2008Applicant: UNITED MICROELECTRONICS CORP.Inventors: CHAO-SHENG CHIANG, PING-WEI LIN, CHIN-WEI YANG