Patents by Inventor Chin-Wu SHIEH

Chin-Wu SHIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130166028
    Abstract: A composite layer intervertebral retrieving device implantable between two vertebrae is provided, including a main carrier having a middle layer, and a securing groove on respective surfaces; multiple securing pieces stably coupled to the securing grooves; wherein the middle layer is a macromolecular material having an elastic modulus of between 2 to 22 GPa, close to the original elastic modulus of the spine of between 12 to 18 GPa. The securing pieces are affinitive to and easily fused with osteocytes, and capable of medically imaging. The securing pieces are coupled to the securing grooves, and when the device is implanted between vertebrae, the securing pieces come into direct contact with the osteocytes of the neighboring vertebrae, with securing bulges thereof pressing against the osteocyes, and the middle layer has an elastic modulus similar to that of the vertebrae to prevent the stress shielding effect.
    Type: Application
    Filed: May 11, 2012
    Publication date: June 27, 2013
    Applicant: A-Spine Asia Co., Ltd.
    Inventors: Chin-Wu SHIEH, Sheng-Fa Hsu, Chien-Ming Lee