Patents by Inventor Chin-Yao Hsu
Chin-Yao Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973001Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.Type: GrantFiled: May 5, 2023Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng
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Publication number: 20240135043Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.Type: ApplicationFiled: October 19, 2022Publication date: April 25, 2024Inventors: Yong-Teng Lin, Bradford Edward Vier, Chun-Kai Tzeng, Chin-Yao Hsu, Yu-Lin Tsai
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Publication number: 20240096731Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
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Publication number: 20240083201Abstract: A vehicle tire cloud computing management system and an application method thereof are provided. A vehicle tire cloud computing management system is formed by combining a vehicle tire management device including tire sensors, a setting tool, and radio frequency identification (RFID) tags with a cloud server, and a car computer. By using the tire sensors to detect tire-related data, and then by outputting the tire-related data to the setting tool, the cloud server, or the car computer for data computation, result judging and/or data storage, so that the function of the tire sensors is more focused on detecting tire conditions, and power consumption of the tire sensors is reduced, while the setting tool, the cloud server, and the car computer are used efficiently to perform computation, management, and application for data related to the tire sensors.Type: ApplicationFiled: June 11, 2023Publication date: March 14, 2024Applicant: ORANGE ELECTRONIC CO., LTD.Inventors: Chin-yao HSU, Jian-zhi WANG, Ming-yung HUANG
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Patent number: 11915992Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.Type: GrantFiled: February 24, 2022Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
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Patent number: 11734652Abstract: A vehicle message managing method includes: providing an operation message of a tire through a tire sensor; receiving the operation message through the tire sensor setting tool, or receiving at least one outer message through the tire sensor setting tool; transmitting at least one of the operation message and the outer message to a remote server; storing and analyzing at least one of the operation message and the outer message and generating an analyzing result.Type: GrantFiled: August 19, 2018Date of Patent: August 22, 2023Assignee: ORANGE ELECTRONIC CO., LTD.Inventors: Chin-Yao Hsu, Hung-Chih Yu, Jia-Hao Bai
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Patent number: 10613592Abstract: A bendable device includes a base housing, a first housing, a second housing, a third housing, and a plurality of first resilient members. The base housing has two sides that are symmetrical to each other. The first housing is pivotally connected to one of the two sides of the base housing by a first pivot. The second housing is pivotally connected to the base housing and the first housing by the first pivot. The third housing is pivotally connected to the base housing, the first and second housings by the first pivot. The first resilient members are pivotally connected to any adjacent two of the base housing, the first, second, and third housings respectively. The first, second, and third housings rotate about the first pivot relative to the base housing to have the bendable device into a folded state or an expanded state selectively.Type: GrantFiled: December 11, 2018Date of Patent: April 7, 2020Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Pin-Chang Chu, Chin-Yao Hsu, Chia-Chen Chen, Cheng-Tai Ho
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Patent number: 10607051Abstract: A method for setting tire pressure measurement device applicable for a detection device electrically couple to an image code scanner is provided. The method comprises the steps of: providing a look-up table (LUT) recording a plurality of image codes, each of the plurality of image codes corresponding to at least one piece of manufacture information, and the at least one piece of manufacture information corresponding to a vehicle; capturing one of the plurality of image codes by the image code scanner so as to generate a scanning result; and based on the scanning result, the detection device selecting one of a plurality of communication protocols.Type: GrantFiled: November 10, 2017Date of Patent: March 31, 2020Assignee: Orange Electronic Co., LtdInventors: Chin-Yao Hsu, Min-Hsuan Chang
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Publication number: 20200057999Abstract: A vehicle message managing method includes: providing an operation message of a tire through a tire sensor; receiving the operation message through the tire sensor setting tool, or receiving at least one outer message through the tire sensor setting tool; transmitting at least one of the operation message and the outer message to a remote server; storing and analyzing at least one of the operation message and the outer message and generating an analyzing result.Type: ApplicationFiled: August 19, 2018Publication date: February 20, 2020Inventors: Chin-Yao HSU, Hung-Chih YU, Jia-Hao BAI
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Publication number: 20190147209Abstract: A method for setting tire pressure measurement device applicable for a detection device electrically couple to an image code scanner is provided. The method comprises the steps of: providing a look-up table (LUT) recording a plurality of image codes, each of the plurality of image codes corresponding to at least one piece of manufacture information, and the at least one piece of manufacture information corresponding to a vehicle; capturing one of the plurality of image codes by the image code scanner so as to generate a scanning result; and based on the scanning result, the detection device selecting one of a plurality of communication protocols.Type: ApplicationFiled: November 10, 2017Publication date: May 16, 2019Applicant: ORANGE ELECTRONIC CO.,LTDInventors: Chin-Yao HSU, Min-Hsuan CHANG
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Publication number: 20170309557Abstract: This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.Type: ApplicationFiled: July 11, 2017Publication date: October 26, 2017Inventors: Chin-Yao HSU, Shih-Ping HSU
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Patent number: 9741646Abstract: This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.Type: GrantFiled: August 5, 2014Date of Patent: August 22, 2017Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.Inventors: Chin-Yao Hsu, Shih-Ping Hsu
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Patent number: 9527351Abstract: A tire detection data transmission system and the setting method thereof include at least one monitoring device, for detecting the condition of vehicle tires and generating tire information, which is transmitted via a RF signal to a transfer device. The transfer device then uses a Bluetooth signal to transmit the received tire information to a mobile communication device. The RF signal emitted by the monitoring device includes at least the tire information and the identification code of the monitoring device. The identification code makes subsequent updates to the settings of the monitoring device simpler and more convenient.Type: GrantFiled: July 24, 2015Date of Patent: December 27, 2016Assignee: ORANGE ELECTRONIC CO., LTD.Inventors: Chin-Yao Hsu, Chang-Hsuan Chan
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Patent number: 9381777Abstract: A signal transponder transceiving signals using different communication protocols has a control module, a receiving module and a transmitting module. The control module is electrically connected to the receiving module and the transmitting module, is built in with multiple communication protocols, decodes a tire pressure signal transmitted from and encoded by an external tire pressure sensor with one of the communication protocols, encodes the decoded information to a new tire pressure signal, and further transmits the new tire pressure signal to a tire pressure receiver. Accordingly, there is no failure in decoding and transmissions and cost increase when the signal transponder communicates with tire pressure sensors and a tire pressure receiver using two different communication protocols.Type: GrantFiled: July 28, 2014Date of Patent: July 5, 2016Assignee: Orange Electronics Co., Ltd.Inventors: Hung-Chih Yu, Shih-Hsin Chang, Chin-Yao Hsu
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Publication number: 20160043025Abstract: This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.Type: ApplicationFiled: August 5, 2014Publication date: February 11, 2016Inventors: CHIN-YAO HSU, SHIH-PING HSU
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Publication number: 20150328943Abstract: A tire detection data transmission system and the setting method thereof include at least one monitoring device, for detecting the condition of vehicle tires and generating tire information, which is transmitted via a RF signal to a transfer device. The transfer device then uses a Bluetooth signal to transmit the received tire information to a mobile communication device. The RF signal emitted by the monitoring device includes at least the tire information and the identification code of the monitoring device. The identification code makes subsequent updates to the settings of the monitoring device simpler and more convenient.Type: ApplicationFiled: July 24, 2015Publication date: November 19, 2015Inventors: Chin-Yao HSU, Chang-Hsuan CHAN
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Publication number: 20150042464Abstract: A signal transponder transceiving signals using different communication protocols has a control module, a receiving module and a transmitting module. The control module is electrically connected to the receiving module and the transmitting module, is built in with multiple communication protocols, decodes a tire pressure signal transmitted from and encoded by an external tire pressure sensor with one of the communication protocols, encodes the decoded information to a new tire pressure signal, and further transmits the new tire pressure signal to a tire pressure receiver. Accordingly, there is no failure in decoding and transmissions and cost increase when the signal transponder communicates with tire pressure sensors and a tire pressure receiver using two different communication protocols.Type: ApplicationFiled: July 28, 2014Publication date: February 12, 2015Inventors: Hung-Chih Yu, Shih-Hsin Chang, Chin-Yao Hsu
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Publication number: 20140011455Abstract: A tire detection data transmission system and the setting method thereof include at least one monitoring device, for detecting the condition of vehicle tires and generating tire information, which is transmitted via a RF signal to a transfer device. The transfer device then uses a Bluetooth signal to transmit the received tire information to a mobile communication device. The RF signal emitted by the monitoring device includes at least the tire information and the identification code of the monitoring device. The identification code makes subsequent updates to the settings of the monitoring device simpler and more convenient.Type: ApplicationFiled: July 3, 2012Publication date: January 9, 2014Inventors: Chin-Yao HSU, Chang-Hsuan Chan
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Publication number: 20060196259Abstract: A wireless tire pressure monitoring device has a detecting device and an air tap bonded to the detecting device. The detecting device has a flat box, in which an emitting circuit board is received, and a lid to close the box, and the air tap has a tube, a cover on a free end of the tube and a bolt, in which air flows, to secure an end the tube on a middle section of the box of the detecting device, such that the detecting device and the air tap are mounted between a rim and a tire. An aerial is embedded in the box of the detecting device to combine the aerial and the box as a single element.Type: ApplicationFiled: March 2, 2005Publication date: September 7, 2006Inventors: Chin-Yao Hsu, Hung-Chih Yu, Feng-Yi Chang, Yu-Hsing Hsiao