Patents by Inventor Chin Yee Loong

Chin Yee Loong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless leadframe electronic package and sensor module incorporating same
    Patent number: 7095621
    Abstract: A leadless optical electronic package includes a lead frame having a die-attach pad and a plurality of leadless connection pads encapsulated in and extending through an encapsulation defining a planar mounting surface that can be soldered directly to a circuit board. The die-attach pad and connection pads define internal surfaces that remain partially exposed through the encapsulation. The internal surfaces are for attaching an electronic die and making electrical connections between the die and the connection pads. A die mounted on the die-attach pad is cooled more effectively and efficiently than dice in prior optical electronic packages. The leadless connection pads reduce the footprint and height of the package compared with prior optical electronic packages. The encapsulation is adapted for receiving a cover having a cover glass to allow light to pass though the cover and illuminate the die. The cover is adapted to receive an optics component for projecting light through the cover glass onto the die.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: August 22, 2006
    Assignee: Avago Technologies Sensor IP (Singapore) Pte. Ltd.
    Inventors: Lee Saimun, Gurbir Singh, Chin Yee Loong
  • Leadless leadframe electronic package and sensor module incorporating same
    Publication number: 20040165356
    Abstract: A leadless optical electronic package includes a lead frame having a die-attach pad and a plurality of leadless connection pads encapsulated in and extending through an encapsulation defining a planar mounting surface that can be soldered directly to a circuit board. The die-attach pad and connection pads define internal surfaces that remain partially exposed through the encapsulation. The internal surfaces are for attaching an electronic die and making electrical connections between the die and the connection pads. A die mounted on the die-attach pad is cooled more effectively and efficiently than dice in prior optical electronic packages. The leadless connection pads reduce the footprint and height of the package compared with prior optical electronic packages. The encapsulation is adapted for receiving a cover having a cover glass to allow light to pass though the cover and illuminate the die. The cover is adapted to receive an optics component for projecting light through the cover glass onto the die.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 26, 2004
    Inventors: Lee Sai Mun, Gurbir Singh, Chin Yee Loong