Abstract: A direct-time-of-flight (dTOF) detecting device is provided. The dTOF detecting device includes a single-photon avalanche diode (SPAD) sensor and a processor. The SPAD sensor is configured to receive a reflective light reflected from an object and output an original data based on the reflective light. The processor is coupled to the SPAD sensor and configured to process the original data to generate depth data and intensity data. The depth data includes depth information of the object and the intensity data includes a two-dimensional image of the object.

Abstract: A semiconductor package includes a redistribution layer structure, a first semiconductor chip, a circuit board structure and an encapsulation layer. The redistribution layer structure has a first side and a second side opposite to the first side. The first semiconductor chip is electrically connected to the first side of the redistribution layer structure. The circuit board structure is electrically connected to the first side of the redistribution layer structure, and the circuit board structure includes a first mask layer having an opening pattern that corresponds to first semiconductor chip. The encapsulation layer laterally encapsulates the circuit board structure and fills in a space between the semiconductor chip and the opening pattern of the first mask layer of the circuit board structure.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The magnetic element has multiple sub-layers, and each sub-layer is wider than another sub-layer above it. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element, and the isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A method of a sensing device, comprising steps of emitting, by a light source of the sensing device, a light pulse in each of n cycles; measuring, by a single photon avalanche diodes array of the sensing device, a time-of-flight value with a resolution of m in each of the n cycles to generate n raw data frames based on a reflected light of the light pulse; performing, by a pre-processing circuit of the sensing device, a pre-processing operation to n raw data frames to generate k pre-processed data frames, wherein m, n and k are natural numbers, and k is smaller than n; and generating, by post-processor of the sensing device, a histogram according to the k pre-processed data frames and analyzing the histogram to output a depth result.

Abstract: An electronic device and a performance optimization method thereof are provided. The electronic device includes a battery module, a processor, and a controller. The battery module is configured to supply power to the electronic device. The processor has a power limit. The controller is configured to monitor a charging and discharging current of the battery module. In a power connection mode, the controller analyzes a status of the battery module and adjusts the power limit of the processor according to the charging and discharging current.

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Abstract: A semiconductor structure includes a redistribution structure, topmost and bottom conductive terminals. The redistribution structure includes a topmost pad in a topmost dielectric layer, a topmost under-bump metallization (UBM) pattern directly disposed on the topmost pad and the topmost dielectric layer, a bottommost UBM pad embedded in a bottommost dielectric layer, and a bottommost via laterally covered by the bottommost dielectric layer. Bottom surfaces of the topmost pad and the topmost dielectric layer are substantially coplanar, bottom surfaces of the bottommost UBM pad and the bottommost dielectric layer are substantially coplanar, the bottommost via is disposed on a top surface of the bottommost UBM pad, top surfaces of the bottommost via and the bottommost dielectric layer are substantially coplanar. The topmost conductive terminal lands on a recessed top surface of the topmost UBM pattern, and the bottommost conductive terminal lands on the planar bottom surface of the bottommost UBM.

Abstract: A semiconductor package includes a redistribution layer structure, a first semiconductor chip, a circuit board structure and an encapsulation layer. The redistribution layer structure has a first side and a second side opposite to the first side. The first semiconductor chip is electrically connected to the first side of the redistribution layer structure. The circuit board structure is electrically connected to the first side of the redistribution layer structure, and the circuit board structure includes a first mask layer having an opening pattern that corresponds to first semiconductor chip. The encapsulation layer laterally encapsulates the circuit board structure and fills in a space between the semiconductor chip and the opening pattern of the first mask layer of the circuit board structure.

Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

Abstract: A filtration and purification device includes a main body and one or more filtration passage layer. A plurality of purification chambers is disposed in the filtration passage layer. Each of the purification chambers has a flow-guiding unit, a filtration unit, a gas sensor, and an outlet valve. The flow-guiding unit introduces the gas into the purification chamber, the filtration unit filters the gas, and the gas sensor determines that if the filtered gas reaches a threshold for breathing so as to determine to open the outlet valve to discharge the gas out of the filtration and purification device.

Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.

Abstract: A 5G outdoor unit having a heat dissipation function includes a main body and a support frame. The main body includes a housing, a cover, and an antenna, the cover is mounted on one side of the housing, and the antenna is disposed on an inner side of the cover. The support frame includes a first side plate, a second side plate, and a plurality of heat dissipation fins. The first side plate is mounted on an outer side of the cover, the fins are arranged between the first side plate and the second side plate at intervals, and a channel is formed between the two adjacent heat dissipation fins. As such, the main body and the support frame are two separate elements. The volume of the main body is reduced, and the weight of the main body is less.

Abstract: The present invention provides an interactive advertisement method. At first, an interactive advertisement with an interactive game is formed in an advertisement platform according to an advertisement content. Next, the advertisement platform sends this interactive advertisement to a handheld device. The handheld device captures instant location information and instant image information at a specific position according to a task assignment of the interactive game. Then, based on the instant location information and the instant image information, the handheld device determines whether the task assignment is completed. When the task assignment has been completed, the handheld device transmits the instant location information and the instant image information to the advertisement platform for a secondary verification. Thereafter, the advertisement platform sends a verification code to the handheld device for exchanging a prize.

Abstract: Interactively augmented reality enable system includes a wearable interactive display apparatus, and a cloud server. The wearable interactive display apparatus includes a display portion having a visual-field direction, a positioning portion, a transmit/receive module, and a computing module. The positioning portion generates a positioning signal transmitted by the transmit/receive module and a visual-field direction signal. The cloud server receives the positioning signal from the transmit/receive module, and generates a virtual circumstance signal merged from the virtual landscape signal, the virtual event signal, and the virtual objects signal. The computing module receives the virtual circumstance signal through the transmit/receive module, and then, the computing module generates an image signal to display on the display portion.

Abstract: A supporting device is applied to an electronic device and includes a supporting unit, an adjusting unit and a fixing unit. The supporting unit supports the electronic device. The adjusting unit is connected to the supporting unit for adjusting an angle of the supporting unit. The fixing unit includes a locking part and a fixing part. The fixing part is fixed on a surface, and the locking part connects to the adjusting unit. The locking part is detachably locked with the fixing part so as to fixing the electronic device on the surface. The supporting device is advantageous for providing multiple viewing angles for users, and it is conveniently carried and easily assembled, thereby achieving firmly fixing effect.