Patents by Inventor Chin-Ying Wang

Chin-Ying Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Patent number: 11943939
    Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
  • Publication number: 20110294963
    Abstract: The present invention discloses a novel toughener selected from the group of polyurea, polyurethane and poly(urea-urethane) using a facile synthesis method. The toughener forms thick-interface particles, and creates an effective toughness improvement for epoxy resin. Different from the conventional epoxy/rubber composite or epoxy/thermoplastic composite, the epoxy/polyurea, epoxy/polyurethane, or epoxy/poly(urea-urethane) composite shows Newtonian rheological behaviour, a convenient property for processing. The unique feature of the toughener according to the present invention is that toughness can be significantly improved at low toughener content without losing other desirable properties.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: FAR EAST UNIVERSITY
    Inventors: HSU-CHIANG KUAN, CHEN-FENG KUAN, HSIN-CHIN PENG, CHIA-HSUN CHEN, KUN-CHANG LIN, MIN-CHI CHUNG, YU-CHUEN LO, JHEN-CHENG WANG, CHIN-YING WANG, CHIN-LUNG CHIANG
  • Publication number: 20080294697
    Abstract: A method and programmable storage device for controlling an archival process in a supply chain management software tool that includes using a control table to identify files or directories to be archived, and archiving information based on the data stored in each row of the control table. The method provides for the querying of archive control table rows by incrementally reading a row in the archive control table for an active column designation, storing the information from the row in a list if the active column designation is in a predetermined active state, and incrementing to a next row in the archive control table, or skipping the row if the active column designation is in a predetermined non-active state, and incrementing to a next row in the archive control table.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael J. Andrasak, Chin-Ying Wang