Patents by Inventor Chin Yong Neo

Chin Yong Neo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250192005
    Abstract: A semiconductor device includes an electrically conductive carrier and a semiconductor chip arranged over a first portion of the carrier. The semiconductor device further includes a dielectric material arranged between the first portion of the carrier and the semiconductor chip, wherein the dielectric material galvanically isolates the first portion of the carrier and the semiconductor chip. At least one of the first portion of the carrier or the semiconductor chip includes at least one of a rounded corner or a rounded edge.
    Type: Application
    Filed: December 10, 2024
    Publication date: June 12, 2025
    Inventors: Rainer Markus SCHALLER, Volker STRUTZ, Chin Yong NEO, Chan Whai KAN, Shao Ping WAN