Patents by Inventor Chin Yong Poo

Chin Yong Poo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for packaging circuits
    Publication number: 20030067001
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: April 8, 2002
    Publication date: April 10, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Chin Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Ho Kwok Seng