Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: An adhesive deliver apparatus includes: a holder; an adhesive tube, containing an adhesive fluid and positioned inside the holder, wherein the adhesive tube comprises a nozzle and a nozzle seal formed on the nozzle; a support tube comprising a proximal end and a distal end; a connector, arranged to operably connect with the proximal end of the support tube; and an inner tube, positioned within the support tube and comprising an inlet end connected with the connector and an outlet end approximating to the distal end of the support tube. When the connector is inserted into the holder, a portion of the connector would break through the nozzle seal. When the holder is pressed, the adhesive fluid will be squeezed out from the adhesive tube and transmitted through the inner tube from the inlet end to the outlet end.

Abstract: An adhesive deliver apparatus includes: a separable holder having a flexible press region thereon and comprising an interior receiving chamber for placing the adhesive tube; a support tube having a substantially elongated shape and comprising a proximal end and a distal end; a connector connected with the proximal end of the support tube and arranged to operably connect with a nozzle of the adhesive tube; and an inner tube positioned within the support tube and comprising an inlet end connected with the connector and an outlet end approximating to the distal end of the support tube; wherein when the press region is pressed to cause an interior surface of the press region to press the adhesive tube, the adhesive fluid will be squeezed out from the adhesive tube and transmitted through the inner tube from the inlet end to the outlet end.

Abstract: An adhesive deliver apparatus includes: a separable holder having a flexible press region thereon and comprising an interior receiving chamber for placing the adhesive tube; a support tube having a substantially elongated shape and comprising a proximal end and a distal end; a connector connected with the proximal end of the support tube and arranged to operably connect with a nozzle of the adhesive tube; and an inner tube positioned within the support tube and comprising an inlet end connected with the connector and an outlet end approximating to the distal end of the support tube; wherein when the press region is pressed to cause an interior surface of the press region to press the adhesive tube, the adhesive fluid will be squeezed out from the adhesive tube and transmitted through the inner tube from the inlet end to the outlet end.

Abstract: An adhesive deliver apparatus includes: a holder; an adhesive tube, containing an adhesive fluid and positioned inside the holder, wherein the adhesive tube comprises a nozzle and a nozzle seal formed on the nozzle; a support tube comprising a proximal end and a distal end; a connector, arranged to operably connect with the proximal end of the support tube; and an inner tube, positioned within the support tube and comprising an inlet end connected with the connector and an outlet end approximating to the distal end of the support tube. When the connector is inserted into the holder, a portion of the connector would break through the nozzle seal. When the holder is pressed, the adhesive fluid will be squeezed out from the adhesive tube and transmitted through the inner tube from the inlet end to the outlet end.