Patents by Inventor Chin-Yuan Ho
Chin-Yuan Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11563157Abstract: A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.Type: GrantFiled: September 26, 2020Date of Patent: January 24, 2023Assignee: Au Optronics CorporationInventors: Hui-Yang Chuang, Chin-Yuan Ho, Tsung-Tien Wu
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Publication number: 20210391517Abstract: A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.Type: ApplicationFiled: September 26, 2020Publication date: December 16, 2021Applicant: Au Optronics CorporationInventors: Hui-Yang Chuang, Chin-Yuan Ho, Tsung-Tien Wu
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Patent number: 11037902Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.Type: GrantFiled: July 22, 2019Date of Patent: June 15, 2021Assignee: Au Optronics CorporationInventors: Tsung-Tien Wu, Chin-Yuan Ho, Chu-Yu Liu
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Publication number: 20210175202Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover an outermost sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. The sacrificial pattern layer is located between the connection patterns, and the sacrificial pattern layer is overlapped with the pads in a normal direction of the substrate.Type: ApplicationFiled: February 23, 2021Publication date: June 10, 2021Applicant: Au Optronics CorporationInventors: Tsung-Tien Wu, Chin-Yuan Ho, Chu-Yu Liu
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Patent number: 10862005Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.Type: GrantFiled: October 4, 2018Date of Patent: December 8, 2020Assignee: Au Optronics CorporationInventors: Yi-Fen Lan, Chin-Yuan Ho, Tsung-Tien Wu
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Publication number: 20200219839Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.Type: ApplicationFiled: July 22, 2019Publication date: July 9, 2020Applicant: Au Optronics CorporationInventors: Tsung-Tien Wu, Chin-Yuan Ho, Chu-Yu Liu
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Publication number: 20200028030Abstract: A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (?LED), a first conductive layer, and a second conductive layer. A light emitting surface of the ?LED is away from the substrate. The ?LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.Type: ApplicationFiled: October 4, 2018Publication date: January 23, 2020Applicant: Au Optronics CorporationInventors: Yi-Fen Lan, Chin-Yuan Ho, Tsung-Tien Wu
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Patent number: 10418234Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.Type: GrantFiled: May 30, 2019Date of Patent: September 17, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Chin-Yuan Ho
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Publication number: 20190279865Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.Type: ApplicationFiled: May 30, 2019Publication date: September 12, 2019Inventors: Yi-Cheng LIU, Chin-Yuan HO
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Patent number: 10403493Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.Type: GrantFiled: March 15, 2018Date of Patent: September 3, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Chin-Yuan Ho
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Patent number: 10327293Abstract: A display device includes a substrate, a first light emitting element, and a second light emitting element. The substrate includes at least one pixel area. The first light emitting element and the second emitting element are disposed in the pixel area. The first light emitting element emits light of a first color and has a first luminous efficiency-injection current density function. The second light emitting element emits light of a second color and has a second luminous efficiency-injection current density function, intersected with the first luminous efficiency-injection current density function to define a critical transform current density. The light of the first color and the light of the second color have a same color system.Type: GrantFiled: August 30, 2018Date of Patent: June 18, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Kuo-Lung Lo, Chin-Yuan Ho, Chen-Chi Lin
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Patent number: 10325892Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.Type: GrantFiled: September 22, 2017Date of Patent: June 18, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Tsung-Tien Wu, Chin-Yuan Ho, Tsung-Yi Lin
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Publication number: 20190110344Abstract: A display device includes a substrate, a first light emitting element, and a second light emitting element. The substrate includes at least one pixel area. The first light emitting element and the second emitting element are disposed in the pixel area. The first light emitting element emits light of a first color and has a first luminous efficiency-injection current density function. The second light emitting element emits light of a second color and has a second luminous efficiency-injection current density function, intersected with the first luminous efficiency-injection current density function to define a critical transform current density. The light of the first color and the light of the second color have a same color system.Type: ApplicationFiled: August 30, 2018Publication date: April 11, 2019Inventors: Kuo-Lung Lo, Chin-Yuan Ho, Chen-Chi Lin
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Publication number: 20180366320Abstract: A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.Type: ApplicationFiled: March 15, 2018Publication date: December 20, 2018Inventors: Yi-Cheng LIU, Chin-Yuan Ho
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Publication number: 20180122788Abstract: A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.Type: ApplicationFiled: September 22, 2017Publication date: May 3, 2018Inventors: Tsung-Tien WU, Chin-Yuan HO, Tsung-Yi LIN
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Publication number: 20170092205Abstract: This disclosure provides systems, methods, and apparatus for providing protective coatings on electromechanical systems (EMS) devices. A display apparatus can include an electrostatic actuation assembly for controlling the position of a suspended portion of a display element. The electrostatic actuation assembly can include a load beam, drive beam, and a coating disposed over a portion of the drive beam. The coating can include a plurality of raised tabs spaced apart from each other. One or both of the size of the raised tabs and a pitch between raised tabs can be varied along a surface of the drive beam. The voltage used to actuate the actuator is, in part, related to the shape and relative position of the load and drive beams. The raised tabs can be sized, spaced, or positioned to affect a desired rest position and rest shape of the drive beam relative to the load beam.Type: ApplicationFiled: September 24, 2015Publication date: March 30, 2017Inventors: Chin-Yuan Ho, Javier Villarreal, Hung-Chien Lin
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Publication number: 20160209641Abstract: This disclosure provides systems, methods and apparatus for reducing capacitance between interconnects in a display apparatus. In one aspect, a display apparatus can include a plurality of light modulators each having a shutter suspended over a substrate. A first suspended interconnect can electrically couple a first light modulator and a second light modulator. A majority of the length of the first suspended interconnect can be suspended a first height above the substrate. A second suspended interconnect can electrically couple the first light modulator and a third light modulator. A majority of the length of the second suspended interconnect can be above the substrate at a different height than the first suspended interconnect.Type: ApplicationFiled: January 16, 2015Publication date: July 21, 2016Inventors: Michael Andrew Gingras, Javier Villarreal, Mark Bradford Andersson, Joyce Wu, Hung-Chien Lin, Chin-Yuan Ho
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Publication number: 20160096729Abstract: This disclosure provides systems, methods and apparatus including processes that use two layers of resist, with a layer of etch stop material in between.Type: ApplicationFiled: October 7, 2014Publication date: April 7, 2016Inventors: Javier Villarreal, Timothy Brosnihan, Chin-Yuan Ho, Hung-Chien Lin