Patents by Inventor Chin-Yuan Hsieh

Chin-Yuan Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5043695
    Abstract: A miniature electronic device includes a housing attached to a substrate by a plurality of terminal leads, each of which has a first end embedded or molded into the housing near the top surface thereof, and a second end bent around a side wall of the housing to engage the bottom surface of the substrate. The bottom surface of the substrate has a plurality of metallized areas, each of which is electrically connected to a component on the upper surface of the substrate. The second end of each lead is soldered or welded to a metallized area. The connection of the leads to the metallized areas secures the housing to the substrate, with the leads also providing the structure for the electrical and mechanical connection of the substrate (and the components thereon) to a circuit board.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: August 27, 1991
    Assignee: Bourns, Inc.
    Inventors: Thomas E. Simon, Thanh V. Nguyen, Chin-Yuan Hsieh