Abstract: A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.

Abstract: A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.

Abstract: A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance. This heat-dissipating device can achieve heat dissipation without bending the heat pipes.

Abstract: The present invention is to provide a heat sink module comprising a base; a first heat conduction block located on the middle of a first side of the base a second heat conduction block located on the middle of a second side of the base corresponding to the first heat conduction block; at least one heat conduction tube installed in the base between the first and second heat conduction blocks, the at least one heat conduction tube each having two distal ends curved in one direction and respectively inserted into the first and second heat conduction blocks; and a plurality of radiation fins located on two sides of the base and connected between the first and second heat conduction blocks, the radiation fins each having two ends respectively extended to two sides of the base for enabling the base to be installed in a heat source.