Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.

Abstract: In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.

Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: This specification discloses a converter whose first electrical connector of a first standard is fixed on a first circuit board and whose second electrical connector of a second standard is connected to a second circuit board. The second circuit board is thus electrically connected to the first circuit board. Therefore, the converter expands the second connector to the first circuit board. This achieves the goal of connecting circuit boards of different connecting designs.

Abstract: An assembling structure of a quick installation/uninstallation switch, including a layout fixing seat formed with a central opening and a transverse insertion slot intersecting the central opening. A locating member is inserted through the transverse insertion slot. The locating member is formed with a central hole corresponding to the central opening. A resilient locating member and at least one lateral projecting section with a guide slope are disposed on the circumference of the central hole. At least one resilient restoring member is disposed between the locating member and the layout fixing seat for restoring the locating member to its home position. A connecting end of a switch main body is fitted in the central opening. A lateral locating section with a guide slope is formed on a circumference of the connecting end corresponding to the lateral projecting section. A locating transverse slot is formed on the circumference of the connecting end.