Patents by Inventor Chin Yung Lai

Chin Yung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Porous Cu on Cu surface for semiconductor packages
    Patent number: 10914018
    Abstract: A semiconductor package includes a plurality of metal leads and a semiconductor die attached to the plurality of metal leads by an interconnect. A surface of the plurality of metal leads, a metallized surface of the semiconductor die, and/or a surface of the interconnect comprises Cu and has a thermal conductivity in a range of 340 to 400 W/mK and an electrical conductivity in a range of 80 to 110% IACS. One or more of the surfaces which comprise Cu and have a thermal conductivity in the range of 340 to 400 W/mK and an electrical conductivity in the range of 80 to 110% IACS also includes micropores having a diameter in a range of 1 ?m to 10 ?m. A method of manufacturing a metal surface with such micropores also is described.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: February 9, 2021
    Assignee: Infineon Technologies AG
    Inventors: Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Evelyn Napetschnig, Nurfarena Othman, Siew Ching Seah
  • Porous Cu on Cu Surface for Semiconductor Packages
    Publication number: 20200291538
    Abstract: A semiconductor package includes a plurality of metal leads and a semiconductor die attached to the plurality of metal leads by an interconnect. A surface of the plurality of metal leads, a metallized surface of the semiconductor die, and/or a surface of the interconnect comprises Cu and has a thermal conductivity in a range of 340 to 400 W/mK and an electrical conductivity in a range of 80 to 110% IACS. One or more of the surfaces which comprise Cu and have a thermal conductivity in the range of 340 to 400 W/mK and an electrical conductivity in the range of 80 to 110% IACS also includes micropores having a diameter in a range of 1 ?m to 10 ?m. A method of manufacturing a metal surface with such micropores also is described.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 17, 2020
    Inventors: Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Evelyn Napetschnig, Nurfarena Othman, Siew Ching Seah