Patents by Inventor Chin Zeng YEH

Chin Zeng YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module structure
    Patent number: 9412921
    Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: August 9, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hsien Wang, Min-Tsung Kuan, Tzong-Ming Lee, Wen-Hsien Chou, Fu-Ming Lin, Wen-Kuei Lee, Chin Zeng Yeh, Ming-Hung Chen, Chung-Teng Huang, Hsueh Jen Fu
  • Composition of an Encapsulation Film for a Solar Cell Module
    Publication number: 20150187976
    Abstract: A composition of an encapsulation film for a solar cell module comprises 80˜99 weight percent of transparent resin, 0.5˜10 weight percent of granular polymer particles and 0.1˜5 weight percent of additives, wherein light refraction is controlled by a diffusion mechanism of the granular polymer particles, so that the probability of light incidence on the solar cell is increased and thus the photoelectric conversion efficiency of the solar cell is improved.
    Type: Application
    Filed: January 2, 2014
    Publication date: July 2, 2015
    Inventors: Chin-Zeng Yeh, Ming-Hung Chen, Jung-Chang Wang, Wei-Ju Chen, Min-Tsung Kuan, Szu-Lin Wang
  • MODULE STRUCTURE
    Publication number: 20140138734
    Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
    Type: Application
    Filed: September 4, 2013
    Publication date: May 22, 2014
    Applicants: Kuo Hsin Technology Co., Ltd., Industrial Technology Research Institute
    Inventors: Wen-Hsien WANG, Min-Tsung KUAN, Tzong-Ming LEE, Wen-Hsien CHOU, Fu-Ming LIN, Wen-Kuei LEE, Chin Zeng YEH, Ming-Hung CHEN, Chung-Teng HUANG, Hsueh Jen FU
  • MODULE STRUCTURE
    Publication number: 20140140012
    Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.
    Type: Application
    Filed: March 8, 2013
    Publication date: May 22, 2014
    Applicants: KUO HSIN TECHNOLOGY CO., LTD., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hsien WANG, Min-Tsung KUAN, Tzong-Ming LEE, Wen-Hsien CHOU, Fu-Ming LIN, Wen-Kuei LEE, Chin Zeng YEH, Ming-Hung CHEN