Patents by Inventor Chinami NAKAI
Chinami NAKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12119434Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.Type: GrantFiled: July 25, 2023Date of Patent: October 15, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 12080835Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.Type: GrantFiled: February 27, 2023Date of Patent: September 3, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20240266480Abstract: A light-emitting device includes: a package having an upper surface and defining a recess including an opening located at the upper surface; a light-emitting element disposed on a surface that defines a bottom of the recess of the package; and a sealing member disposed in the recess of the package and covering the light-emitting element. The upper surface of the sealing member includes a flat region. The flat region includes at least a region located above the light-emitting element. The flat region is located below the upper surface of the package.Type: ApplicationFiled: April 18, 2024Publication date: August 8, 2024Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11996502Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.Type: GrantFiled: March 13, 2020Date of Patent: May 28, 2024Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20230378408Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.Type: ApplicationFiled: July 25, 2023Publication date: November 23, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11791448Abstract: A light-emitting device includes: a light-emitting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.Type: GrantFiled: May 4, 2022Date of Patent: October 17, 2023Assignee: NICHIA CORPORATIONInventors: Atsushi Kojima, Kenji Ozeki, Chinami Nakai
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Patent number: 11764342Abstract: A light emitting device includes: a mounting board; a plurality of light emitting elements disposed on the mounting board; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a first cover member located on or above the mounting board, the first cover member including: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements.Type: GrantFiled: September 29, 2021Date of Patent: September 19, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Patent number: 11757078Abstract: A light emitting device includes: a package in which a recess is defined; a light emitting element mounted on a bottom surface defining the recess; a first reflecting layer covering lateral surfaces defining the recess; and a second reflecting layer covering the bottom surface defining the recess, wherein the second reflecting layer is in contact with the first reflecting layer, wherein at least a portion of lateral surfaces of the light emitting element is exposed from the second reflecting layer.Type: GrantFiled: August 10, 2021Date of Patent: September 12, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20230216000Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.Type: ApplicationFiled: February 27, 2023Publication date: July 6, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11616179Abstract: A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.Type: GrantFiled: October 28, 2021Date of Patent: March 28, 2023Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20230005895Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided. A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.Type: ApplicationFiled: November 2, 2020Publication date: January 5, 2023Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Kosuke SATO, Chinami NAKAI, Takashi ISHII, Atsushi KOJIMA
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Publication number: 20220263003Abstract: A light-emitting device includes: a light-emiting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.Type: ApplicationFiled: May 4, 2022Publication date: August 18, 2022Applicant: NICHIA CORPORATIONInventors: Atsushi KOJIMA, Kenji OZEKI, Chinami NAKAI
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Patent number: 11362248Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.Type: GrantFiled: July 14, 2020Date of Patent: June 14, 2022Assignee: NICHIA CORPORATIONInventors: Atsushi Kojima, Kenji Ozeki, Chinami Nakai
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Publication number: 20220052238Abstract: A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.Type: ApplicationFiled: October 28, 2021Publication date: February 17, 2022Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Publication number: 20220029061Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.Type: ApplicationFiled: October 6, 2021Publication date: January 27, 2022Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI, Yoshio ICHIHARA
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Publication number: 20220020733Abstract: A light emitting device includes: a mounting board; a plurality of light emitting elements disposed on the mounting board; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a first cover member located on or above the mounting board, the first cover member including: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements.Type: ApplicationFiled: September 29, 2021Publication date: January 20, 2022Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11189765Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element.Type: GrantFiled: December 24, 2019Date of Patent: November 30, 2021Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
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Publication number: 20210367118Abstract: A light emitting device includes: a package in which a recess is defined; a light emitting element mounted on a bottom surface defining the recess; a first reflecting layer covering lateral surfaces defining the recess; and a second reflecting layer covering the bottom surface defining the recess, wherein the second reflecting layer is in contact with the first reflecting layer, wherein at least a portion of lateral surfaces of the light emitting element is exposed from the second reflecting layer.Type: ApplicationFiled: August 10, 2021Publication date: November 25, 2021Applicant: NICHIA CORPORATIONInventors: Kenji OZEKI, Atsushi KOJIMA, Chinami NAKAI
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Patent number: 11171260Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.Type: GrantFiled: September 27, 2019Date of Patent: November 9, 2021Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai, Yoshio Ichihara
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Patent number: 11164991Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.Type: GrantFiled: December 20, 2019Date of Patent: November 2, 2021Assignee: NICHIA CORPORATIONInventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai