Patents by Inventor Chinatsu Adachi

Chinatsu Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5446309
    Abstract: A semiconductor device includes a first chip and a second chip. Active elements such as transistors are fabricated on the surface of the semiconductor substrate of the first chip. Passive elements such as inductors and capacitors are fabricated on the second chip. The first chip is so disposed on the second chip that the reverse surface of the first chip makes a contact onto the surface of the second chip. The active element and the passive element are electrically connected by bonding wire.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: August 29, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Chinatsu Adachi, Masaaki Nishijima, Yorito Ota, Osamu Ishikawa