Patents by Inventor Chin Cheng Lin
Chin Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240192538Abstract: A display apparatus having a privacy mode and a sharing mode is provided. The display apparatus includes a display panel, a privacy liquid crystal module, and a touch sensing module. The touch sensing module is disposed on a side of the privacy liquid crystal module and is configured to generate a touch signal. When the display apparatus is in the privacy mode, the privacy liquid crystal module is applied with a first voltage. When the display apparatus is in the sharing mode and the touch sensing module generates the touch signal, the privacy liquid crystal module is applied with a second voltage for a predetermined time. After maintaining for the predetermined time, a third voltage is applied to the privacy liquid crystal module. The display apparatus can effectively reduce a smear phenomenon caused by the display apparatus being touched in a sharing mode.Type: ApplicationFiled: December 3, 2023Publication date: June 13, 2024Applicant: Coretronic CorporationInventors: Chih-Hsuan Kuo, Ming-Hsiung Fan, Yi-Cheng Lin, Chin-Lung Chen, Cheng-Wei Zhu, Chin-Yuan Chang
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Patent number: 12009379Abstract: An image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, and the first photoelectric conversion component includes: a first metal layer formed on the substrate; a first photoelectric conversion layer formed on the first metal layer; and a second metal layer formed on the first photoelectric conversion layer.Type: GrantFiled: May 1, 2017Date of Patent: June 11, 2024Assignee: VISERA TECHNOLOGIES COMPANY LIMITEDInventors: Wu-Cheng Kuo, Kuo-Feng Lin, Tsung-Lin Wu, Chin-Chuan Hsieh
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Patent number: 12009949Abstract: A signal receiver includes a first transistor, a second transistor, a load circuit, an amplifying circuit and a load circuit. The first transistor has a first end receiving a power voltage, and a control end receive a first input signal. The second transistor has a first end receiving the power voltage, and a control end receiving a second input signal, wherein the first input signal and the second input signal are differential signals and transit between a first voltage and a reference ground voltage, the first voltage is larger than the power voltage. The load circuit is coupled to the first transistor and the second transistor. The amplifying circuit generates an output signal according a first signal on the second end of the first transistor and a second signal on the second end of the second transistor.Type: GrantFiled: October 14, 2021Date of Patent: June 11, 2024Assignee: Novatek Microelectronics Corp.Inventors: Hao-Che Hsu, Chin-Tung Chan, Ying-Cheng Lin, Ren-Hong Luo
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Publication number: 20240153840Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.Type: ApplicationFiled: January 18, 2024Publication date: May 9, 2024Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
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Publication number: 20240155185Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
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Patent number: 11971657Abstract: A photoresist developer includes a solvent having Hansen solubility parameters of 15<?d<25, 10<?p<25, and 6<?p<30; an acid having an acid dissociation constant, pKa, of ?15<pKa<4, or a base having a pKa of 40>pKa>9.5; and a chelate.Type: GrantFiled: April 11, 2022Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: An-Ren Zi, Chin-Hsiang Lin, Ching-Yu Chang, Yahru Cheng
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Patent number: 11962847Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: GrantFiled: November 9, 2022Date of Patent: April 16, 2024Assignee: MEDIATEK INC.Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
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Publication number: 20240094626Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.Type: ApplicationFiled: April 12, 2023Publication date: March 21, 2024Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
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Publication number: 20240096731Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
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Publication number: 20240071888Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.Type: ApplicationFiled: August 28, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
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Patent number: 11915992Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.Type: GrantFiled: February 24, 2022Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
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Patent number: 10414203Abstract: A multi-function writing implement includes a pen shaft, a colored pen assembly, and an erasing pen assembly. The colored pen assembly is arranged at one end of the pen shaft. The colored pen assembly includes a cartridge seat, a nib seat, a plurality of colored cartridges, a plurality of relay cartridges, and a plurality of colored ink cotton tubes. The erasing pen assembly is arranged at the other end of the pen shaft opposite to the colored pen assembly. Only one end of the pen shaft may have at least two colors for providing the user to use different colors and the user is not necessary to use two nibs respectively arranged at two ends of the pen shaft by replacing in turn.Type: GrantFiled: January 3, 2017Date of Patent: September 17, 2019Inventor: Chin-Cheng Lin
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Publication number: 20190156984Abstract: A transformer structure includes an iron core and coils constituted by first, second, third and fourth windings, where the iron core has a first, second and middle flanges. The first flange is respectively configured with first and second terminal electrodes, the second flange third and fourth terminal electrodes, and the middle flange first and second center taps. The first winding is respectively in connection with the first terminal electrode and first center tap, the second winding the first center tap and third terminal electrode, the third winding the second terminal electrode and second center tap, and the fourth winding the second center tap and fourth terminal electrode. Whereby, the present invention can obviously increase the Hi-Pot safety distance of the transformer, and can thus have better high-pressure resistance.Type: ApplicationFiled: November 22, 2017Publication date: May 23, 2019Inventors: MING-YEN HSIEH, HSIANG-CHUNG YANG, CHIN-CHENG LIN
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Publication number: 20170225506Abstract: A multi-function writing implement comprises a pen shaft, a colored pen assembly, and an erasing pen assembly. The colored pen assembly is arranged at one end of the pen shaft. The colored pen assembly includes a cartridge seat, a nib seat, a plurality of colored cartridges, a plurality of relay cartridges, and a plurality of colored ink cotton tubes. The cartridge seat is connected to the pen shaft. One end of the nib seat has a plurality of cartridge slots. The colored cartridges are respectively arranged at the cartridge slots. The relay cartridges are respectively connected to the colored cartridges and arranged in the cartridge seat. The colored ink cotton tubes are respectively connected to the relay cartridges and arranged in the pen shaft and the cartridge in parallel. The erasing pen assembly is arranged at the other end of the pen shaft opposite to the colored pen assembly.Type: ApplicationFiled: January 3, 2017Publication date: August 10, 2017Inventor: Chin-Cheng Lin
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Patent number: 8042124Abstract: An optical disk drive includes a body, a tray, a first fastening structure, and a second fastening structure. The body has an opening. The tray is coupled to the body and movable at the opening. The first fastening structure is disposed at the body, and the second fastening structure is disposed at the tray. When the tray is situated in the body, the first fastening structure and second fastening structure are correspondingly fastened to each other to restrict the displacement of the tray along the vertical direction in the body.Type: GrantFiled: December 7, 2007Date of Patent: October 18, 2011Assignee: Asustek Computer Inc.Inventors: Shi-Wei Liu, Chin-Cheng Lin, Ya-Lun Yang, Yen-Hsing Lin
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Patent number: 7958521Abstract: There is provided an optical disc drive designed for reading data stored in an optical disc. The optical disc drive includes a body, a driving module, a body wrapping unit, and an access module designed for reading data stored in the optical disc. The driving module and the access module are both disposed in the body. The driving module has a circuit board and a driving element disposed on the circuit board, and the body has a plurality of latching structures. The driving mechanism is secured to the body with the use of the latching structures, and the driving mechanism is secured at one side of the latching structures. Moreover, the body wrapping unit used to cover the body has at least a limiting portion which is positioned at another side of a portion of the latching structures.Type: GrantFiled: April 16, 2007Date of Patent: June 7, 2011Assignee: ASUSTeK Computer Inc.Inventors: Yen-Hsing Lin, Chin-Cheng Lin, Ya-Lun Yang
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Publication number: 20080141292Abstract: An optical disk drive includes a body, a tray, a first fastening structure, and a second fastening structure. The body has an opening. The tray is coupled to the body and movable at the opening. The first fastening structure is disposed at the body, and the second fastening structure is disposed at the tray. When the tray is situated in the body, the first fastening structure and second fastening structure are correspondingly fastened to each other to restrict the displacement of the tray along the vertical direction in the body.Type: ApplicationFiled: December 7, 2007Publication date: June 12, 2008Applicant: ASUSTek COMPUTER INC.Inventors: Shi-Wei Liu, Chin-Cheng Lin, Ya-Lun Yang, Yen-Hsing Lin
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Patent number: D569327Type: GrantFiled: December 19, 2007Date of Patent: May 20, 2008Assignee: LOYO Industrial Co., Ltd.Inventor: Chin-Cheng Lin
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Patent number: D569328Type: GrantFiled: December 26, 2007Date of Patent: May 20, 2008Assignee: Loyo Industrial Co., Ltd.Inventor: Chin-Cheng Lin
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Patent number: D701565Type: GrantFiled: November 27, 2013Date of Patent: March 25, 2014Inventor: Chin-Cheng Lin