Abstract: A smart phone includes a lens set formed in front of an image sensor. An optical lens is configurated in front of the lens set, the image sensor or the combination thereof. The optical lens includes at least one transparent layer having trenches, resonators are formed in the trenches, wherein the resonators are formed with different sizes and responsive to different light frequencies.

Abstract: A wireless charging device includes a wireless communication device configurated in the wireless charging device to communicate with an electric vehicle. At least one transmitting coil is connected to a power supply to wirelessly charge the electric vehicle, and at least one resonant coil is configurated in front of the at least one transmitting coil to form a negative or zero refractive index medium by resonance.

Abstract: A rope buckle assembly includes a female buckle and a male buckle. The female buckle has an accommodating slot and a plurality of openings being in spatial communication with and respectively arranged at two opposite side of the accommodating slot. The accommodating slot has two guiding surfaces protruding from a slot bottom thereof. The male buckle has two through holes in spatial communication with each other and includes two elastic arms spaced apart from each other. When the male buckle and the female buckle jointly receive an external force to move from an initial position to a through position, the two elastic arms are compressed and deformed by respectively abutting against the two guiding surfaces, so that each of the two through holes becomes smaller, and each of the two through holes corresponds in position to two of the openings for jointly defining a rope channel.

Abstract: A rope buckle assembly includes a female buckle and a male buckle. The female buckle has an accommodating slot and a plurality of openings that are in spatial communication with the accommodating slot. The accommodating slot has two guiding surfaces protruding from a slot bottom thereof, and the openings are respectively arranged at two opposite side of the accommodating slot and respectively face toward each other. The male buckle includes two rigid arms and a deformable segment that connects the two rigid arms. When the male buckle is inserted into the female buckle, the two rigid arms swing toward each other to jointly compress and deform the deformable segment by respectively abutting against the two guiding surfaces, so that a through hole of each of the two rigid arms corresponds in position to two of the openings facing each other for jointly defining a rope channel.

Abstract: A rope buckle assembly includes a female buckle and a male buckle. The female buckle has an accommodating slot and a plurality of openings that are in spatial communication with the accommodating slot. The accommodating slot has two guiding surfaces protruding from a slot bottom thereof, and the openings are respectively arranged at two opposite side of the accommodating slot and respectively face toward each other. The male buckle includes two rigid arms and a deformable segment that connects the two rigid arms. When the male buckle is inserted into the female buckle, the two rigid arms swing toward each other to jointly compress and deform the deformable segment by respectively abutting against the two guiding surfaces, so that a through hole of each of the two rigid arms corresponds in position to two of the openings facing each other for jointly defining a rope channel.

Abstract: An image sensor is provided. The image sensor includes a substrate and an isolation structure disposed over the substrate. The isolation structure has isolation segments in a cross-sectional view and is electrically non-conductive, and the isolation segments form concave tanks that define pixel regions. The image sensor also includes bottom electrodes disposed at bottoms of the concave tanks and reflective layers disposed on sidewalls of the concave tanks. The image sensor further includes a photoelectric conversion layer disposed on the isolation structure and in the concave tanks and a top electrode disposed on the photoelectric conversion layer. Moreover, the image sensor includes an encapsulation layer disposed on the top electrode.

Abstract: A rope buckle assembly includes a female buckle and a male buckle. The female buckle has an accommodating slot and a plurality of openings being in spatial communication with and respectively arranged at two opposite side of the accommodating slot. The accommodating slot has two guiding surfaces protruding from a slot bottom thereof. The male buckle has two through holes in spatial communication with each other and includes two elastic arms spaced apart from each other. When the male buckle and the female buckle jointly receive an external force to move from an initial position to a through position, the two elastic arms are compressed and deformed by respectively abutting against the two guiding surfaces, so that each of the two through holes becomes smaller, and each of the two through holes corresponds in position to two of the openings for jointly defining a rope channel.

Abstract: An image sensor includes a first unit. The first unit includes a first photodiode having a first dimension, a second photodiode disposed adjacent the first photodiode and having a second dimension that is greater than the first dimension, a first color filter overlapping the first photodiode and the second photodiode, and a first internal reflector disposed in the first color filter and overlapping the first photodiode. The first internal reflector has an inclined light receiving surface inclined from a top surface of the first color filter toward the second photodiode, and a refraction index of the first internal reflector is smaller than a refraction index of the first color filter.

Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. The semiconductor device includes a gate structure that comprises a lower portion and an upper portion. The lower portion wraps around each of the plurality of semiconductor layers. The semiconductor device includes a gate spacer that extends along a sidewall of the upper portion of the gate structure and comprises a first layer and a second layer. The first layer is in contact with a first portion of the sidewall and the second layer is in contact with a second portion of the sidewall.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion elements. The solid-state image sensor also includes a mosaic pattern layer disposed above the photoelectric conversion elements. The mosaic pattern layer includes an infrared-passing segment and color filter segments disposed on the periphery of the infrared-passing segment. The solid-state image sensor further includes a first condensing structure disposed on the mosaic pattern layer. The infrared-passing segment and the color filter segments share the first condensing structure.

Abstract: An integrated over-current protection device includes a positive temperature coefficient (PTC) component, a first conductive unit, a second conductive unit, a first conductive via, and a second conductive via. The PTC component includes a first PTC body, and has opposing first and second surfaces. The first conductive unit is disposed on the first surface, and includes a first electrode and a first conductive pad electrically insulated from the first electrode. The second conductive unit is disposed on the second surface, and includes a second electrode and a second conductive pad electrically insulated from the second electrode. The first conductive via extends through the first conductive unit and the PTC component to electrically connect the first electrode to the second conductive pad. The second conductive via extends through the second conductive unit and the PTC component to electrically connect the second electrode to the first conductive pad.

Abstract: An integrated over-current protection device includes a positive temperature coefficient (PTC) component, a first conductive unit, a second conductive unit, a first conductive via, and a second conductive via. The PTC component includes a first PTC body, and has opposing first and second surfaces. The first conductive unit is disposed on the first surface, and includes a first electrode and a first conductive pad electrically insulated from the first electrode. The second conductive unit is disposed on the second surface, and includes a second electrode and a second conductive pad electrically insulated from the second electrode. The first conductive via extends through the first conductive unit and the PTC component to electrically connect the first electrode to the second conductive pad. The second conductive via extends through the second conductive unit and the PTC component to electrically connect the second electrode to the first conductive pad.

Abstract: An image sensor is provided. The image sensor includes a substrate and isolation structures disposed on the substrate. The isolation structures are electrically non-conductive and define pixel regions. The image sensor also includes electrodes disposed on the substrate and in direct contact with the isolation structures. The image sensor further includes an active layer disposed between the isolation structures. Moreover, the image sensor includes an encapsulation layer disposed over the active layer. The image sensor also includes a color filter layer disposed over the encapsulation layer.

Abstract: Fragrance dispenser systems are disclosed. The system can include a flameless candle, such as an LED candle, and a base. The base can be configured to receive and support the flameless candle. The base can include a fan unit and a fragrance cartridge. The fan unit can blow air over the fragrance cartridge. The fragranced air can be discharged from the base into the ambient environment.

Abstract: An image sensor includes a plurality of liquid-lens units, which include: a lower electrode and an upper electrode; a dielectric layer disposed between the lower electrode and the upper electrode; a containment space disposed between the dielectric layer and the upper electrode; and a non-polar liquid and a polar liquid filled into the containment space, wherein the non-polar liquid and the polar liquid are immiscible with each other. The non-polar liquid is configured to occupy a first contact area on the dielectric layer under a first voltage, and a second contact area on the dielectric layer under a second voltage. The first contact area is larger than the second contact area, and the second voltage is higher than the first voltage.

Abstract: An image sensor includes a first pixel array. The first pixel array includes multiple photo diodes and a polyhedron structure. The polyhedron structure is located above the photo diodes, and the polyhedron structure includes a bottom facet, a top facet, and at least one side facet. The bottom facet is located between the side facet and the photo diodes, and an orthogonal projection of the polyhedron structure overlaps with photo diodes. The polyhedron structure is configured to divide an incident light into a plurality of light beams focused in the photo diodes.

Abstract: An image sensor is provided. The image sensor includes a substrate, an isolation structure on the substrate, a photoelectric conversion layer, a transparent electrode layer, an encapsulation layer, a color filter layer, and a micro-lens. The isolation structure is electrically non-conductive and defines a plurality of pixel regions on the substrate. The isolation structure prevents cross-talk of electrical signals among pixels. The photoelectric conversion layer is disposed on the pixel regions defined by the isolation structure. The transparent electrode layer is disposed over the isolation structure and the photoelectric conversion layer. The encapsulation layer is disposed over the transparent electrode layer. The micro-lens is disposed on the color filter layer.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion elements. The solid-state image sensor also includes a mosaic pattern layer disposed above the photoelectric conversion elements. The mosaic pattern layer includes an infrared-passing segment and color filter segments disposed on the periphery of the infrared-passing segment. The solid-state image sensor further includes a first condensing structure disposed on the mosaic pattern layer. The infrared-passing segment and the color filter segments share the first condensing structure.

Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. The semiconductor device includes a gate structure that comprises a lower portion and an upper portion. The lower portion wraps around each of the plurality of semiconductor layers. The semiconductor device includes a gate spacer that extends along a sidewall of the upper portion of the gate structure and comprises a first layer and a second layer. The first layer is in contact with a first portion of the sidewall and the second layer is in contact with a second portion of the sidewall.

Abstract: An electromagnetic induction hub includes a first disc having a first magnet, a second disc having a second magnet, a coil disc formed between the first disc and the second disc, a bearing penetrates the first disc, the second disc and the coil disc.