Abstract: A heat dissipating system for a data center includes a return air area and an installation area. The return air area defines a return air damper and an air outlet, and the installation area defines an air inlet damper and an air outlet damper. The installation area includes a fan control unit, a humidity control unit and an electronic device. When the humidity control unit detects that the humidity value in the installation area is greater than a standard value, the humidity control unit controls the return air damper to partly open. Warmed air generated by the electronic device partly flows to the return air area through the return air damper, and the cold air and the warmed air are mixed. The mixed air is configured to dissipate heat for the electronic device, and the humidity in the data center is reduced.

Abstract: A heat dissipating system for a data center includes a return air area and an installation area. The return air area defines a return air damper and an air outlet, and the installation area defines an air inlet damper and an air outlet damper. The installation area includes a fan control unit, a humidity control unit and an electronic device. When the humidity control unit detects that the humidity value in the installation area is greater than a standard value, the humidity control unit controls the return air damper to partly open. Warmed air generated by the electronic device partly flows to the return air area through the return air damper, and the cold air and the warmed air are mixed. The mixed air is configured to dissipate heat for the electronic device, and the humidity in the data center is reduced.

Abstract: A container data center includes a container, a number of air filtering modules, a number of cabinets received in the container, a heat dissipation apparatus, and a controller apparatus. The container includes a first sidewall defining a number of air inlets and a second sidewall defining a number of air outlets. A number of shielding plates are rotatably connected to the second sidewall to cover the air outlets. The air filtering modules are mounted to the first sidewall aligning with the air inlets. Each air filtering module defines a through hole communicating with the corresponding air inlet. Each air filtering module includes a number of fans and a number of rotating plates rotatably connected to cover the through hole. The controller apparatus includes a first motor driving the shielding plates, a second motor driving the rotating plates, a temperature sensor, a switch controlling the heat dissipation apparatus.

Abstract: A container data center includes a container, a number of air filtering modules, a number of cabinets received in the container, a heat dissipation apparatus, and a controller apparatus. The container includes a first sidewall defining a number of air inlets and a second sidewall defining a number of air outlets. A number of shielding plates are rotatably connected to the second sidewall to cover the air outlets. The air filtering modules are mounted to the first sidewall aligning with the air inlets. Each air filtering module defines a through hole communicating with the corresponding air inlet. Each air filtering module includes a number of fans and a number of rotating plates rotatably connected to cover the through hole. The controller apparatus includes a first motor driving the shielding plates, a second motor driving the rotating plates, a temperature sensor, a switch controlling the heat dissipation apparatus.

Abstract: A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a control device. The container defines a number of air inlets and a number of air outlets. A number of first shielding plates movably coupled to the container to cover the air inlets and a number of second shielding plates movably coupled to the container to cover the air outlets. The container forms a cooling air channel at one side of the server cabinets and a heat air channel at an opposite side of the server cabinets. The ventilation pipe is communicated between the heat dissipation apparatus and at least one of the air inlets, the ventilation pipe defines a opening communicating with the heating air channel, and a third shielding plate is movably coupled to the ventilation pipe to cover the corresponding through hole.

Abstract: A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a control device. The container defines a number of air inlets and a number of air outlets. A number of first shielding plates movably coupled to the container to cover the air inlets and a number of second shielding plates movably coupled to the container to cover the air outlets. The container forms a cooling air channel at one side of the server cabinets and a heat air channel at an opposite side of the server cabinets. The ventilation pipe is communicated between the heat dissipation apparatus and at least one of the air inlets, the ventilation pipe defines a opening communicating with the heating air channel, and a third shielding plate is movably coupled to the ventilation pipe to cover the corresponding through hole.

Abstract: A container data center includes a container and a row of server cabinets received in the container. The container includes a front wall defining a plurality of air inlets and a rear wall defining a plurality of air outlets. Each server cabinet is adjoined with an inner surface of the rear wall. Cooling air enters into the container from the air inlets of the front wall and flows through the server cabinets, and is directly exhausted through the air outlets of the rear wall.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Abstract: An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.

Abstract: An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section.

Abstract: An exemplary heat pipe includes a tube, a first wick structure and a second wick structure received in the tube, and working liquid filling the tube. The first wick structure is disposed in an evaporating section of the tube. The second wick structure is located between the first wick structure, and supports the first wick structure partially contacting an inner face of the evaporating section of the tube. The first wick structure defines a gap between two opposite ends thereof. The second wick structure extends from the evaporating section through an adiabatic section to a condensing section of the tube.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: A lamp includes a heat sink and a lamp cover mounted on the heat sink. The lamp cover includes a connecting portion. The heat sink includes a plurality of clamping portions. The plurality of clamping portions surrounds the lamp cover and is spaced apart from each other along a circumferential direction. The plurality of clamping portions each defines a recess facing the lamp cover. The recesses communicate with each other along the circumferential direction whereby an annular engaging groove is defined in the heat sink by the recesses. The connecting portion is engaged in the engaging groove whereby the lamp cover is connected with the heat sink.

Abstract: A heat dissipation device includes a bracket, a fan with an air inlet and an air outlet, and a heat sink mounted on the bracket. The bracket includes a plurality of rivets and clasps. Each of the clasps includes a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion. The mounting portion is riveted on the bracket by a corresponding rivet. The fan includes a plurality of ears corresponding to the clasps. The hook portions of the clasps abut on top surfaces of the ears to fix the fan on the bracket. The fan defines a plurality of channels communicating the outlet of the fan.

Abstract: A thermal module assembly includes a first thermal module (10) and a second thermal module (20). The first thermal module (10) has a fan (300) with an air outlet, a first heat sink (120) positioned at the air outlet and a first clamp portion (122) formed on the first heat sink (120). The second thermal module (20) has a second heat sink (220) and a second clamp portion (222) formed on the second heat sink (220). The second heat sink (220) is juxtaposed with the first heat sink (120). The first heat sink (120) and the second heat sink (220) are combined together via engagement of the first clamp portion (122) and the second clamp portion (222) so that airflow produced by the fan (300) flows past the first heat sink (120) and the second heat sink (220) in order.

Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Abstract: A thermal module adapted for dissipating heat of an electronic component includes a heat pipe; and two mounting flakes mounted on the heat pipe. The mounting flakes are configured for mounting the thermal module on a circuit board on which the electronic component is mounted. Each of the mounting flakes is formed integrally as a single piece. The mounting flake includes a fixing body and two mounting arms formed at two opposite ends of the fixing body. The fixing body is directly bonded on the heat pipe. The mounting arms extend beyond the heat pipe and define through holes therein for extension of fasteners.

Abstract: A cooling fan includes a housing, a cover on the housing and an impeller received in a space between the housing and the cover. The housing includes a bottom wall and a sidewall projecting upwardly from an outer periphery of the bottom wall. The sidewall defines an air outlet therein. The impeller includes a hub and a plurality of blades extending radially out from the hub. A porous layer extends into the space between the housing and the cover from the sidewall at a location adjacent to the air outlet.

Abstract: A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged at a central portion of the air outlet, and two second fin sets respectively arranged at a side portion of the air outlet. The first fin set includes a plurality of first fins with a first passage defined between each two neighboring first fins. Each of the second fin sets includes a plurality of second fins with a second passage defined between each two neighboring second fins. Each of the second fin sets defines an undercut near the air outlet of the fan. The first passages communicate with the central portion of the air outlet of the fan. Each of the undercuts of the second fin sets communicates with corresponding side portion and corresponding second passage.