Patents by Inventor Ching Chang

Ching Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260150357
    Abstract: A method includes depositing a multi-layer stack on a semiconductor substrate, wherein a top surface of the semiconductor substrate is parallel to the (110) crystallographic plane, etching the multi-layer stack and the semiconductor substrate to form a fin, forming a first recess in the fin adjacent the dummy gate, wherein a bottom surface of the first recess in the fin is coplanar with the (110) crystallographic plane, and forming an epitaxial source/drain region in the first recess, wherein the epitaxial source/drain region includes a bottom portion of the epitaxial source/drain region, and a top portion of the epitaxial source/drain region over the bottom portion of the epitaxial source/drain region, wherein when observed along the <110> crystallographic direction, a number of dislocations in the top portion of the epitaxial source/drain region is greater than a number of dislocations in the bottom portion of the epitaxial source/drain region.
    Type: Application
    Filed: November 27, 2024
    Publication date: May 28, 2026
    Inventors: Ching Chang, Chien-Wei Lee, Chien-I Kuo, Ming-Hua Yu
  • Publication number: 20260028532
    Abstract: In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.
    Type: Application
    Filed: July 30, 2025
    Publication date: January 29, 2026
    Inventors: Jar-Wha Lee, Ching Chang
  • Patent number: 12493012
    Abstract: A sensor device is adapted to detect glucose concentration in saliva of an object, and includes a conductive substrate, a polymer layer, and a carbon nanomaterial unit. The polymer layer is disposed on the conductive substrate and is made from conducting polymer. The carbon nanomaterial unit is disposed on the polymer layer and includes at least one carbon-nanotube layer. The saliva of the object is applied on the carbon nanomaterial unit and an enzyme is added to be mixed with the saliva to detect the glucose concentration in the saliva. A method for making the sensor device is also provided.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: December 9, 2025
    Assignee: National Tsing Hua University
    Inventors: Nyan-Hwa Tai, Chi-Young Lee, Guan-Kai Huang, Ching Chang, Shau-San Wu, Jin-Liang Chen, You-Ti Kuo
  • Publication number: 20240350029
    Abstract: A non-invasive carbon dioxide sensor includes a conductive substrate, a electrical transmission layer, and a gas sensing layer. The conductive substrate includes a base and at least two electrode disposed on the base and spaced apart from each other. The electrical transmission layer is disposed on the conductive substrate, and includes a plurality of carbon nanotubes crossing one another and a plurality of metal oxide nanorods attached to the carbon nanotubes. The carbon nanotubes and the metal oxide nanorods together form a composite material having a hierarchical three-dimensional structure. The gas sensing layer is disposed on the electrical transmission layer and includes a polymer material that contains at least one amino functional group capable of reacting with carbon dioxide. A method for manufacturing a non-invasive carbon dioxide sensor is also provided.
    Type: Application
    Filed: April 19, 2024
    Publication date: October 24, 2024
    Inventors: Nyan-Hwa TAI, Ya-Hsuan YANG, Ching CHANG, Chi-Young LEE, Diahn-Warng PERNG
  • Patent number: 12052815
    Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: July 30, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Patent number: 12050192
    Abstract: A gas sensing device includes a substrate, a conductive unit, and a sensing layer. The conductive unit is disposed on the substrate, and includes two electrodes. The sensing layer is disposed on the conductive unit, and is electrically connected with the electrodes. The sensing layer adapted to absorb carbon dioxide includes polyethyleneimine and polyethylene glycol. A detecting system including a testing device, an analyzing device and the aforementioned gas sensing device is also disclosed. The gas sensing device is detachably mounted to and is electrically connected to the testing device. Electrical property of the gas sensing device 100 changes when the gas sensing device 100 absorbs carbon dioxide.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 30, 2024
    Assignees: NATIONAL TSING HUA UNIVERSITY, TAIPEI VETERANS GENERAL HOSPITAL
    Inventors: Nyan-Hwa Tai, Chi-Young Lee, Ching Chang, Cheng-Chieh Lin, Tien-Wang Peng, Yi-Han Hsiao, Kang-Cheng Su, Hsin-Kuo Ko
  • Publication number: 20230389172
    Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Patent number: 11785707
    Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: October 10, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Publication number: 20230288363
    Abstract: A sensor device is adapted to detect glucose concentration in saliva of an object, and includes a conductive substrate, a polymer layer, and a carbon nanomaterial unit. The polymer layer is disposed on the conductive substrate and is made from conducting polymer. The carbon nanomaterial unit is disposed on the polymer layer and includes at least one carbon-nanotube layer. The saliva of the object is applied on the carbon nanomaterial unit and an enzyme is added to be mixed with the saliva to detect the glucose concentration in the saliva. A method for making the sensor device is also provided.
    Type: Application
    Filed: September 8, 2022
    Publication date: September 14, 2023
    Applicant: National Tsing Hua University
    Inventors: Nyan-Hwa TAI, Chi-Young LEE, Guan-Kai HUANG, Ching CHANG, Shau-San WU, Jin-Liang CHEN, You-Ti KUO
  • Patent number: 11404425
    Abstract: The present invention provides a test key structure, the test key structure a substrate, a plurality of test key cells disposed on the substrate, wherein each test key cell includes a first gate structure arranged along a first direction (X-axis), a first diffusion region, a second diffusion region, a connection diffusion region and a share contact arranged along a second direction (Y-axis), wherein the first gate structure crosses over the first diffusion region to form a pull-up transistor (PU), the second gate structure crosses over the second diffusion region to form a pull-down transistor (PD), and wherein the plurality of share contacts and the plurality of connection diffusion regions of the plurality of test key cells are electrically connected to each other.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: August 2, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Fang-Sheng Chou, Ching Chang
  • Publication number: 20220232694
    Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
    Type: Application
    Filed: October 8, 2021
    Publication date: July 21, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Publication number: 20220128503
    Abstract: A gas sensing device includes a substrate, a conductive unit, and a sensing layer. The conductive unit is disposed on the substrate, and includes two electrodes. The sensing layer is disposed on the conductive unit, and is electrically connected with the electrodes. The sensing layer adapted to absorb carbon dioxide includes polyethyleneimine and polyethylene glycol. A detecting system including a testing device, an analyzing device and the aforementioned gas sensing device is also disclosed. The gas sensing device is detachably mounted to and is electrically connected to the testing device. Electrical property of the gas sensing device 100 changes when the gas sensing device 100 absorbs carbon dioxide.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 28, 2022
    Applicant: National Tsing Hua University
    Inventors: Nyan-Hwa TAI, Chi-Young LEE, Ching CHANG, Cheng-Chieh LIN, Tien-Wang PENG, Yi-Han HSIAO, Kang-Cheng SU, Hsin-Kuo KO
  • Publication number: 20220125349
    Abstract: A non-invasive sensing electrode for determining a concentration of glucose in a liquid sample includes a conductive substrate body, a composite layer disposed on the conductive substrate body, and a modifying layer disposed on the composite layer. The composite layer includes a plurality of carbon nanotubes randomly crossing one another, and a plurality of gold nanoparticles attached randomly to the carbon nanotubes. The modifying layer includes a plurality of reduced graphene oxide nanowebs separately attached to the composite layer.
    Type: Application
    Filed: January 11, 2021
    Publication date: April 28, 2022
    Applicant: National Tsing Hua University
    Inventors: Nyan-Hwa TAI, Chi-Young LEE, Ching CHANG, Jia-Ying LIN, Shau-San WU, Jin-Liang CHEN, You-Ti KUO
  • Publication number: 20210320109
    Abstract: The present invention provides a test key structure, the test key structure a substrate, a plurality of test key cells disposed on the substrate, wherein each test key cell includes a first gate structure arranged along a first direction (X-axis), a first diffusion region, a second diffusion region, a connection diffusion region and a share contact arranged along a second direction (Y-axis), wherein the first gate structure crosses over the first diffusion region to form a pull-up transistor (PU), the second gate structure crosses over the second diffusion region to form a pull-down transistor (PD), and wherein the plurality of share contacts and the plurality of connection diffusion regions of the plurality of test key cells are electrically connected to each other.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 14, 2021
    Inventors: Fang-Sheng Chou, Ching Chang
  • Patent number: 10134744
    Abstract: A semiconductor memory device includes a first inverter, a second inverter, a first and second inner access transistors, and a first and second outer access transistors. The first inverter includes a first pull-up transistor and a first pull-down transistor, the second inverter includes a second pull-up transistor (PL2) and a second pull-down transistor, and the first inverter and the second inverter forms a latch circuit. The first and second inner access transistors and the first and second outer access transistors are electrically connected to the latch circuit, and channel widths of the second inner access transistor and the second outer access transistor are different from each other.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: November 20, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Han Chen, Wei-Chi Chen, Ching Chang, Ming-Shing Chen, Chao-Hsien Wu, Chia-Hui Hwang, Lu-Ran Huang
  • Publication number: 20180187077
    Abstract: In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.
    Type: Application
    Filed: August 23, 2017
    Publication date: July 5, 2018
    Inventors: Jar-Wha Lee, Ching Chang
  • Patent number: 9233441
    Abstract: A machining system includes two machining devices. Each machining device includes a bracket and a machining unit, a transferring unit, a control unit mounted on the bracket. The transferring unit includes a driving member and a transferring member connected to the driving member. The control unit is electrically connected to the machining unit and the driving member. The two machining devices are arranged in a straight line. The transferring members are connected in order. The control unit of one machining device controls the machining unit to machine the workpiece, and when the machining unit has finished machining the workpiece, the control unit controls the driving member to drive the transferring member, thus the transferring member of one machining device conveys the workpiece to the transferring member of an adjacent machining device.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: January 12, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Teh-Yuh Lee, Ching Chang, Wei-Jung Hung
  • Publication number: 20140013591
    Abstract: A machining system includes two machining devices. Each machining device includes a bracket and a machining unit, a transferring unit, a control unit mounted on the bracket. The transferring unit includes a driving member and a transferring member connected to the driving member. The control unit is electrically connected to the machining unit and the driving member. The two machining devices are arranged in a straight line. The transferring members are connected in order. The control unit of one machining device controls the machining unit to machine the workpiece, and when the machining unit has finished machining the workpiece, the control unit controls the driving member to drive the transferring member, thus the transferring member of one machining device conveys the workpiece to the transferring member of an adjacent machining device.
    Type: Application
    Filed: June 20, 2013
    Publication date: January 16, 2014
    Inventors: TEH-YUH LEE, CHING CHANG, WEI-JUNG HUNG
  • Publication number: 20120021218
    Abstract: In various embodiments, the present application provides electrically conductive metal-plated fibers and continuous processes of preparing metal-plated fibers. Additionally, provided are polymeric articles comprising the provided metal-plated fibers or other fibers prepared by the provided process, said articles having electromagnetic interference shielding effectiveness.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 26, 2012
    Applicant: SYSCOM ADVANCED MATERIALS, INC.
    Inventors: Jar-Wha Lee, Ching Chang
  • Publication number: 20100178610
    Abstract: This invention relates to a novel metallocenyl phthalocyanine compound represented by the following general formula (I), in which at least one of the four benzene rings of phthalocyanine is connected with the organometallic complex group through a linker having one carbon atom. This invention also relates to the use of the phthalocyanine compounds in optical recording media. wherein all symbols are defined in the specification.
    Type: Application
    Filed: May 21, 2008
    Publication date: July 15, 2010
    Applicant: ORGCHEM TECHNOLOGIES INC.
    Inventors: Chin SHA, Cheng YANG, Ping CHENG, Ching CHANG, Kuang YEN, An HONG