Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.

Abstract: There is provided a smoke detector including a first light source, a second light source surface, a light sensor and a processor. The light sensor receives reflected light when the first light source and the second light source emit light, and generates a first detection signal corresponding to light emission of the first light source and a second detection signal corresponding to light emission of the second light source. The processor distinguishes smoke and floating particles according to a similarity between the first detection signal and the second detection signal.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: An anti-peep system applicable to an automated teller machine (ATM), which includes a main body and a display screen mounted on the main body. The anti-peep system includes a sensor and an anti-peep unit. The sensor includes a housing and a sensing element set in the housing; the housing is provided on the main body of the ATM, and the sensing element is used to sense whether there is an object located in an area in front of the display screen. The anti-peep unit is integrated into the display screen and electrically connected to the sensing element of the sensor. The anti-peep unit is enabled or disabled according to a sensing result of the sensing element to selectively shield the display screen.

Abstract: The present disclosure provides a storage control method, a storage controller, a storage device, and a storage system. The storage control method controls a storage behavior of a storage device, including: acquiring behavior information of the storage device; processing the behavior information through a deep learning algorithm to obtain a behavior parameter of the storage device; and adjusting an operation mode of the storage device according to the behavior parameter of the storage device. The present disclosure enhances the automatic adjustment operation algorithm of the storage device by means of deep self-learning to adapt to the different requirements of the complex system for the storage device, thereby achieving the storage device with the optimal read/write performance, the best reliability, and the lowest power consumption in accordance with the requirements of the system.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Abstract: An optical encoding device includes a light source module, an encoding disc, and a photodetector. The light source module emits a source beam. The encoding disc is disposed on a passing path of the source beam. The encoding disc has first diffracting patterns. The first diffracting patterns include a plurality of sets of first diffracting patterns arranged along a radial direction of the encoding disc. Each set of the first diffracting patterns includes a plurality kinds of first diffracting patterns having different pattern extending directions and different pattern periods. When the encoding disc is rotating, the first diffracting patterns in each set of first diffracting patterns enter the passing path of the source beam in sequence, to cause a diffraction and form diffracted beams having different angles. The photodetector receives the diffracted beams having the different angles.

Abstract: An optical encoding device includes a light source module, an encoding disc, and a photodetector. The light source module emits a source beam. The encoding disc is disposed on a passing path of the source beam. The encoding disc has first diffracting patterns. The first diffracting patterns include a plurality of sets of first diffracting patterns arranged along a radial direction of the encoding disc. Each set of the first diffracting patterns includes a plurality kinds of first diffracting patterns having different pattern extending directions and different pattern periods. When the encoding disc is rotating, the first diffracting patterns in each set of first diffracting patterns enter the passing path of the source beam in sequence, to cause a diffraction and form diffracted beams having different angles. The photodetector receives the diffracted beams having the different angles.

Abstract: A display unit for concurrently displaying multiple frames includes a liquid crystal panel; a control unit electrically connected to the liquid crystal panel; a transparent plate disposed in front of the liquid crystal panel; and a printed pattern layer printed on the transparent plate and having at least two hollow-cored portions whereby the transparent plate is defined with display regions corresponding in quantity to the hollow-cored portions, wherein the control unit drives the liquid crystal panel to produce local frames which are displayed in the display regions and are not outnumbered by the display regions. Hence, the display unit produces multiple partitioned frames with just one liquid crystal panel, just one control unit, and a printed pattern layer.

Abstract: An optical encoder includes a light emitting module, a positioning device and a light separating structure. The light emitting module emits a light beam illuminating an illumination area of the positioning device. The positioning device includes light penetrating areas arranged in a dislocation manner. The light penetrating areas sequentially move into the illumination area. The light separating structure is disposed in the path of the light beam. The positioning device is disposed between the light emitting module and the light separating structure. When part of the light beam penetrates one of these light penetrating areas and is transmitted to the light separating structure, the light separating structure transmits the light to a sensing area and forms at least one first positioning optical pattern. The distance between two first positioning optical patterns formed by two adjacent light penetrating areas is greater than the pitch between the two adjacent light penetrating areas.

Abstract: An optical encoder includes a light emitting module, a positioning device and a light separating structure. The light emitting module emits a light beam illuminating an illumination area of the positioning device. The positioning device includes light penetrating areas arranged in a dislocation manner. The light penetrating areas sequentially move into the illumination area. The light separating structure is disposed in the path of the light beam. The positioning device is disposed between the light emitting module and the light separating structure. When part of the light beam penetrates one of these light penetrating areas and is transmitted to the light separating structure, the light separating structure transmits the light to a sensing area and forms at least one first positioning optical pattern. The distance between two first positioning optical patterns formed by two adjacent light penetrating areas is greater than the pitch between the two adjacent light penetrating areas.