Abstract: In a method of manufacturing a semiconductor device, a first interlayer dielectric (ILD) layer is formed over a substrate, a chemical mechanical polishing (CMP) stop layer is formed over the first ILD layer, a trench is formed by patterning the CMP stop layer and the first ILD layer, a metal layer is formed over the CMP stop layer and in the trench, a sacrificial layer is formed over the metal layer, a CMP operation is performed on the sacrificial layer and the metal layer to remove a portion of the metal layer over the CMP stop layer, and a remaining portion of the sacrificial layer over the trench is removed.

Abstract: There is provided a smoke detector including a first light source, a second light source surface, a light sensor and a processor. The light sensor receives reflected light when the first light source and the second light source emit light, and generates a first detection signal corresponding to light emission of the first light source and a second detection signal corresponding to light emission of the second light source. The processor distinguishes smoke and floating particles according to a similarity between the first detection signal and the second detection signal.

Abstract: A display device is provide. The display device is within a transportation device having a first seating area, including a display unit, a mechanical platform, and a mechanical shaft assembly. The mechanical platform is configured to correspond to the first seating area. The mechanical shaft assembly is disposed on the mechanical platform and including a first shaft portion, a second shaft portion, and a third shaft portion. The first shaft portion is connected to the display unit and driving the display unit to move along a horizontal direction. The second shaft portion is connected to an upper end of the display unit and driving the display unit to rotate around a second axis. The third shaft portion is connected to the second shaft portion and driving the display unit to rotate around a third axis.

Abstract: A photolithographic mask assembly according to the present disclosure accompanies a photolithographic mask. The photolithographic mask includes a capping layer over a substrate and an absorber layer disposed over the capping layer. The absorber layer includes a first main feature area, a second main feature area, and a venting feature area disposed between the first main feature area and the second main feature area. The venting feature area includes a plurality of venting features.

Abstract: A double gap double coil driven speaker includes a diaphragm, a permanent magnet having a magnetization, and a magnetic flux conducting device having a magnetic flux conducting path. The magnetic flux conducting device and the permanent magnet together form a magnetic flux loop, wherein the magnetic flux loop has two gaps, and directions of magnetic fields generated in the two gaps are opposite to each other. The speaker further includes a voice coil having two coils wound on an outer surface of the voice coil and the voice coil having one end connected to the diaphragm, wherein the two coils are respectively accommodated in the two gaps. When the two coils conduct currents, the voice coil is displaced to push the diaphragm, wherein, relative to a common cross section of the two gaps, the currents respectively flowing through the two coils are in opposite directions.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A photolithographic mask assembly according to the present disclosure accompanies a photolithographic mask. The photolithographic mask includes a capping layer over a substrate and an absorber layer disposed over the capping layer. The absorber layer includes a first main feature area, a second main feature area, and a venting feature area disposed between the first main feature area and the second main feature area. The venting feature area includes a plurality of venting features.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: A current detection method adapted to an inverter is provided, which includes: determining that a plurality of lower arms of an inverter have a minimum conduction period when all the lower arms are turned on simultaneously; determining a sampling time point according to the minimum conduction period, wherein a period from a starting point of the minimum conduction period to the sampling time point is defined as a sampling period that is close to the minimum conduction period; simultaneously detecting currents flowing through the lower arms by a plurality of detection resistors to generate a plurality of measurement voltages; and determining the currents of the inverter according to the measurement voltages.

Abstract: A reinforcement learning system is provided, including at least one agent and a server. According to a set condition, the at least one agent transmits a plurality of state sets related to a state of the environment through a network, receives a plurality of action sets for performing an action, and transmits, to the server, a plurality of feedback messages generated after interacting with the environment. The server configures a predetermined ratio of the memory space as at least one workstation according to the set condition, and selects an untrained model to be temporarily stored in the at least one workstation. The at least one workstation imports a current state set, a current action set, and a current feedback message, as parameters, into the untrained model for reinforcement learning, and generates a next action set until a goal is achieved.

Abstract: There is provided a smoke detector including a first light source, a second light source surface, a light sensor and a processor. The light sensor receives reflected light when the first light source and the second light source emit light, and generates a first detection signal corresponding to light emission of the first light source and a second detection signal corresponding to light emission of the second light source. The processor distinguishes smoke and floating particles according to a similarity between the first detection signal and the second detection signal.

Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.

Abstract: A method includes forming a plurality of low-k dielectric layers over a semiconductor substrate, forming a first plurality of dummy stacked structures extending into at least one of the plurality of low-k dielectric layers, forming a plurality of non-low-k dielectric layers over the plurality of low-k dielectric layers, and forming a second plurality of dummy stacked structures extending into the plurality of non-low-k dielectric layers. The second plurality of dummy stacked structures are over and connected to corresponding ones of the first plurality of dummy stacked structures. The method further includes etching the plurality of non-low-k dielectric layers, the plurality of low-k dielectric layers, and the semiconductor substrate to form a via opening. The via opening is encircled by the first plurality of dummy stacked structures and the second plurality of dummy stacked structures. The via opening is then filled to form a through-via.

Abstract: A driving circuit of fluid pump module includes a microprocessor, a primary boost circuit, and a pump driving circuit is provided. The microprocessor receives an output signal with a large-width variable rectangular waveform, a driving voltage, a first detection current-feedback signal, and a second detection current-feedback signal. The primary boost circuit converts an inputted driving voltage into a direct current with a certain high voltage. The pump driving circuit receives the certain high voltage and is connected with the microprocessor to receive the voltage control signal and the pulse-width modulation (PWM) signal. The secondary boost circuit receives the certain high voltage to boost the certain high voltage into a working voltage for the fluid pump. The operation driving circuit receives the working voltage and provides the pulse-width modulation signal for the fluid pump through the second detection current-feedback signal.

Abstract: A power semiconductor package signal connection component includes a cylinder having a first through hole and two bases respectively disposed on opposite sides of the cylinder. Each base includes a continuous protrusion pattern and has a flat surface, a curved surface, and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole runs through the curved surface and communicates with the first through hole. The continuous protrusion pattern is connected to a second side of the curved surface and is located on the flat surface.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

Abstract: A smoke detection device includes a housing, a smoke collector, an optical detector and a cover plate. The housing has a piercing hole. The smoker collector has a smoke hole, and position of the smoke hole is close to position of the piercing hole. The optical detector is disposed inside the smoke collector and adapted to detect gaseous concentration inside the smoke collector. The cover plate is disposed between the housing and the smoke collector, and used to set a channel from the piercing hole to the smoke hole, so that gaseous matter flows from outside the smoke detection device into the smoke collector through the piercing hole and the smoke hole.