Patents by Inventor CHING-CHAO LIN

CHING-CHAO LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240297190
    Abstract: An image sensor includes an image sensing chip, an encapsulant, a plurality of outer-side encapsulant vias, an interior wire redistribution layer and an exterior wire redistribution layer. The encapsulant wraps around the image sensing chip, the outer-side encapsulant vias penetrate the encapsulant, and the interior wire redistribution layer is formed on a top surface of the encapsulant, wherein the image sensing chip is electrically connected to the exterior wire redistribution layer through the interior wire redistribution layer and the outer-side encapsulant vias, and then further through the conducting terminals on the exterior wire redistribution layer to connect to the outside. The exterior wire redistribution layer is directly formed underneath the image sensing chip without using a substrate. Since the electrical connection is realized through the outer-side encapsulant vias, the thicknesses of the encapsulant and the size of the packaged image sensor can be reduced.
    Type: Application
    Filed: October 13, 2023
    Publication date: September 5, 2024
    Inventor: CHING-CHAO LIN
  • Publication number: 20230411419
    Abstract: A fan-out package structure of an image sensing device includes an image sensing unit having an image sensor with opposite sensing surface and connecting surface, a spacer layer surrounding a central portion of the sensing surface, and a light-transmitting cover plate disposed on the spacer layer spaced apart from and covering the sensing surface. An image signal processor is disposed on the connecting surface. A redistribution layer covers the image signal processor and the connecting surface, and includes a fan-out area. An encapsulation layer is disposed on the fan-out area, surrounds and covers an outer periphery of the image sensing unit, and allows a top surface of the light-transmitting cover plate to be exposed. A method of manufacturing a fan-out package structure of an image sensing device is also disclosed.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 21, 2023
    Applicant: Powertech Technology Inc.
    Inventor: Ching-Chao LIN
  • Publication number: 20160122214
    Abstract: A bio-block has a main body provided with at least one through hole. The through hole foil is two openings in two surfaces of the main body respectively and has a diameter of 2.5±0.25 mm and a depth of 10.0±1.0 mm When the main body is immersed in a liquid, the surface tension or viscosity generated at the two openings of the through hole guides the liquid rapidly into the through hole and makes the liquid stay in the through hole without flowing through the through hole immediately. Thus, the bio-block retains the liquid in the through hole. The liquid in the through hole can be used to grow microorganisms or plankton such as bacteria, microalgae, and SS-type rotifers. Given the same volume, the bio-block can cultivate various microorganisms and plankton in larger quantities and at higher speed than similar products.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 5, 2016
    Inventor: CHING-CHAO LIN
  • Publication number: 20150129488
    Abstract: A filtering solid includes a body, the body includes at least two surfaces defined thereon, and at least one accommodating room is formed thereon. The accommodating room penetrates through the two surfaces, and at least one wall surface is formed at an interior of the accommodating room. The body is a cube or a cylinder; the accommodating room is a circular through hole or a square through hole. The filtering solid attains the purposes of reaching a maximum storage of water and increasing an adhering area of nitrifying bacteria in a limited volume.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Inventor: CHING-CHAO LIN