Patents by Inventor Ching-Chen Huang

Ching-Chen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160347449
    Abstract: The kite frame assembly contains a kite frame, a number of limiting elements, and a number of fastening elements. The kite frame contains a main stick, a number of connection elements movably configured along the main stick, and a number of auxiliary sticks joined to the main stick. The limiting elements are movably configured along the main stick; and the fastening elements are fixedly configured along the main stick. Each connection element is sandwiched between a pair of limiting elements, which in turn sandwiched between a pair of fastening elements. As such, each connection element is movably limited to an appropriate position range along the main stick and enhanced flexibility and convenience is achieved when assembling a kite.
    Type: Application
    Filed: May 25, 2015
    Publication date: December 1, 2016
    Inventor: Ching-Chen Huang
  • Publication number: 20020140069
    Abstract: A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Applicant: MEGIC CORPORATION
    Inventors: Jin-Yuan Lee, Ching-Chen Huang, Mou-Shiung Lin
  • Patent number: 5524851
    Abstract: A kite assembly has a main truss made of sheet material and attachable/detachable wings. The wings have a row of slots which fit over a corresponding row of hooks formed along the top edge of the main truss. The wings can be moved back and forth on the main truss for attachment and detachment. A reinforcing bar is mounted on the wings and fits in a hook eye formed in one of the hooks. The kite can be made in eye-catching configurations simulating birds in flight.
    Type: Grant
    Filed: March 20, 1995
    Date of Patent: June 11, 1996
    Inventor: Ching-Chen Huang