Abstract: A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The insulating encapsulant laterally surrounds the first semiconductor die and the second semiconductor die, wherein the insulating encapsulant includes a first portion sandwiched in between the first semiconductor die and the second semiconductor die, the first portion has a first recessed part adjacent to an edge of the first semiconductor die, and a second recessed part adjacent to an edge of the second semiconductor die. The redistribution layer is disposed on and electrically connected to the first semiconductor die and the second semiconductor die.

Abstract: A package includes a first die and a second die in an encapsulant layer, and a dummy bar in the encapsulant layer and adjacent a gap between the first die and the second die. A method of forming a package includes attaching a first die and a second die to a surface, attaching a dummy bar to the surface adjacent a gap between the first die and the second die, and forming an encapsulant layer on the first die, the second die and the dummy bar.