Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate. A first precursor and a second precursor are combined. The first precursor is an organometallic having a formula: MaRbXc, where M is one or more of Sn, Bi, Sb, In, and Te, R is one or more of a C7-C11 aralkyl group, a C3-C10 cycloalkyl group, a C2-C10 alkoxy group, and a C2-C10 alkylamino group, X is one or more of a halogen, a sulfonate group, and an alkylamino group, and 1?a?2, b?1, c?1, and b+c?4, and the second precursor is one or more of water, an amine, a borane, and a phosphine. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern. The latent pattern is developed by applying a developer to the selectively exposed photoresist layer.

Abstract: A semiconductor apparatus and a method for collecting residues of curable material are provided. The semiconductor apparatus includes a chamber containing a wafer cassette, and a collecting module disposed in the chamber for collecting residues of curable material in the chamber. The collecting module includes a flow-directing structure disposed below a ceiling of the chamber, a baffle structure disposed below the flow-directing structure, and a tray disposed on the wafer cassette. The flow-directing structure includes a first hollow region, the baffle structure includes a second hollow region, and the tray is moved together with the wafer cassette to pass through the second hollow region of the baffle structure and is positioned to cover the first hollow region of the flow-directing structure.

Abstract: A pixel sensor may include a layer stack to reduce and/or block the effects of plasma and etching on a photodiode and/or other lower-level layers. The layer stack may include a first oxide layer, a layer having a band gap that is approximately less than 8.8 electron-Volts (eV), and a second oxide layer. The layer stack may reduce and/or prevent the penetration and absorption of ultraviolet photons resulting from the plasma and etching processes, which may otherwise cause the formation of electron-hole pairs in the substrate in which the photodiode is included.

Abstract: A fixing assembly includes a fixing frame, a fixing member, and a fastening member. The fixing frame includes a frame body and a guiding wall portion. The frame body is disposed between a circuit board and a heatsink. The guiding wall portion is connected to the frame body and has an elongated hole. The thicknesses of the guiding wall portion are reduced toward the frame body. The fixing member abuts against the guiding wall portion and is located over the heatsink. The fixing member has a screw hole communicated with the elongated hole. The fastening member is fastened to the screw hole via the elongated hole. The fastening member is retained by the elongated hole to move relative to the guiding wall portion along the elongated hole, so as to move the fixing member toward or away from the heatsink.

Abstract: A fixing assembly includes a fixing frame, a fixing member, and a fastening member. The fixing frame includes a frame body and a guiding wall portion. The frame body is disposed between a circuit board and a heatsink. The guiding wall portion is connected to the frame body and has an elongated hole. The thicknesses of the guiding wall portion are reduced toward the frame body. The fixing member abuts against the guiding wall portion and is located over the heatsink. The fixing member has a screw hole communicated with the elongated hole. The fastening member is fastened to the screw hole via the elongated hole. The fastening member is retained by the elongated hole to move relative to the guiding wall portion along the elongated hole, so as to move the fixing member toward or away from the heatsink.

Abstract: A lighting device, a lighting panel and a circuit board thereof are provided. The circuit board comprises a substrate; a plurality of light sources disposed on the substrate and at least one circuit layer, being patterned onto the substrate to form a plurality of traces for electrically connecting the light sources. Therein, the circuit board is capable of being assembled with other circuit boards to construct the lighting panel. The lighting device is capable of having the lighting panel of a large size by assembling a plurality of the circuit boards and individually controlling each light source disposed on the lighting panel so as to provide the function of local dimming.

Abstract: A lighting device, a lighting panel and a circuit board thereof are provided. The circuit board comprises a substrate; a plurality of light sources disposed on the substrate and at least one circuit layer, being patterned onto the substrate to form a plurality of traces for electrically connecting the light sources. Therein, the circuit board is capable of being assembled with other circuit boards to construct the lighting panel. The lighting device is capable of having the lighting panel of a large size by assembling a plurality of the circuit boards and individually controlling each light source disposed on the lighting panel so as to provide the function of local dimming.

Abstract: A touch detecting device capable of saving power for a touch panel includes a touch sensing unit, a micro control unit and a mode detecting unit. The touch sensing unit is coupled to the touch panel and used for being triggered by a first control signal to generate sensing data according to a touch state of the touch panel. The micro control unit is coupled to the touch sensing unit and used for being triggered by a second control signal to generate the first control signal. The mode detecting unit is coupled to the micro control unit and the touch panel, and used for generating the second control signal according to the touch state of the touch panel.