Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.

Abstract: A light source module is provided. The light source module includes a lead frame, a light source, a cup part, and a reflector. The light source is disposed on the lead frame, wherein the light source provides a light. The cup part is disposed on the lead frame, wherein the cup part includes an opening, a plurality of thick-wall portions and a plurality of thin-wall portions. The thick-wall portions and the thin-wall portions surround the light source and define a space. The reflector covers the opening. At least a portion of the light is reflected by the reflector, and is emitted through the thick-wall portions and the thin-wall portions.

Abstract: A light-emitting device includes a circuit substrate, a wall, a light-emitting diode chip, a fluorescent resin and a plate. The wall is formed on the circuit substrate to form a concave cup with properties of light transmission and reflection, and has a height of the wall is H2. The light emitting diode chip is die-bonded on the circuit substrate in the concave cup and a height of the light-emitting diode chip is H1. The fluorescent resin is filled in the concave cup and covered over the light-emitting diode chip. The plate is covered on the fluorescent resin and equipped with properties of light transmission and reflection. A maximum thickness of the plate is H3, wherein H3=A*(H2/H1)+B, a value of A ranges from 10.5 to 15.5, and a value of B ranges from 0.05 to 131.5.

Abstract: A light-emitting diode includes an electrical connecting base, a lamp holder, a power driving module, an adapter plate and a lamp plate. One end of the lamp holder is connected to the electrical connecting base and the other end of the lamp holder is configured to be a supporting surface. The electrical connecting base and the lamp holder form an accommodation space which accommodates the power driving module. The adapter plate has a first surface and a second surface opposite to each other. The first surface is contacted with the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the second surface. The lamp plate has a second connector which is detachably plugged to the first connector, so as to be disposed on the adapter plate.

Abstract: A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.

Abstract: A light-emitting diode includes an electrical connecting base, a lamp holder, a power driving module, an adapter plate and a lamp plate. One end of the lamp holder is connected to the electrical connecting base and the other end of the lamp holder is configured to be a supporting surface. The electrical connecting base and the lamp holder form an accommodation space which accommodates the power driving module. The adapter plate has a first surface and a second surface opposite to each other. The first surface is contacted with the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the second surface. The lamp plate has a second connector which is detachably plugged to the first connector, so as to be disposed on the adapter plate.