Patents by Inventor Ching-Chi Kuo
Ching-Chi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11969447Abstract: A composition for promoting defecation includes a cell culture of at least one lactic acid bacterial strain which is substantially free of cells. The least one lactic acid bacterial strain is selected from the group consisting of Lactobacillus salivarius subsp. salicinius AP-32, Bifidobacterium animalis subsp. lactis CP-9, and Lactobacillus acidophilus TYCA06, which are respectively deposited at the Bioresource Collection and Research Center (BCRC) under accession numbers BCRC 910437, BCRC 910645 and BCRC 910813. Also disclosed is a method for promoting defecation, including administering to a subject in need thereof an effective amount of the composition.Type: GrantFiled: March 17, 2021Date of Patent: April 30, 2024Assignee: GLAC BIOTECH CO., LTD.Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yi-Wei Kuo, Yu-Fen Huang, Cheng-Chi Lin
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Patent number: 10568206Abstract: A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.Type: GrantFiled: January 16, 2019Date of Patent: February 18, 2020Assignee: DELTA ELECTRONICS, INC.Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Patent number: 10568207Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a pushing piece configured to provide a supporting surface to sustain the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.Type: GrantFiled: January 16, 2019Date of Patent: February 18, 2020Assignee: DELTA ELECTRONICS, INC.Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Patent number: 10321565Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.Type: GrantFiled: August 3, 2017Date of Patent: June 11, 2019Assignee: DELTA ELECTRONICS, INC.Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Publication number: 20190166692Abstract: A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.Type: ApplicationFiled: January 16, 2019Publication date: May 30, 2019Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Publication number: 20190150281Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a pushing piece configured to provide a supporting surface to sustain the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.Type: ApplicationFiled: January 16, 2019Publication date: May 16, 2019Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Publication number: 20180352655Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.Type: ApplicationFiled: August 3, 2017Publication date: December 6, 2018Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
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Publication number: 20080032523Abstract: A circuit module to be mounted on a system circuit board having first contact portions is provided. The circuit module includes a printed wire board and at least an electronic component mounted on the printed wire board. The printed wire board includes a substrate and a trace pattern formed on at least a surface of the substrate. At least an edge side of the substrate has second contact portions corresponding to the first contact portions of the system circuit board and in contact with the trace pattern.Type: ApplicationFiled: November 27, 2006Publication date: February 7, 2008Applicant: Delta Electronics, Inc.Inventor: Ching-Chi Kuo
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Patent number: 5338594Abstract: High strength foam-filled materials and methods for their production are disclosed. The high strength materials include cellular structures comprising a plurality of open-ended cells containing polycyanurate foam. The polycyanurate foam-filled cellular structures have synergistically high mechanical properties and improved resistance to moisture. When cyanate ester foamable precursors in the form of tough films are foamed to fill honeycomb cells, the resulting foam-filled honeycomb has uniformly fine foam cell structure and improved bonding between the foam and the honeycomb.Type: GrantFiled: February 7, 1992Date of Patent: August 16, 1994Assignee: Hexcel CorporationInventors: Yen-Seine Wang, Frank Lee, Ching-Chi Kuo, Ken Baron
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Patent number: 5077319Abstract: Foamable resin compositions of cyanate esters and thermoplastic resins are disclosed.Type: GrantFiled: May 18, 1990Date of Patent: December 31, 1991Assignee: Hexcel CorporationInventors: Yen-Seine Wang, Ching-Chi Kuo, David B. Conway, Frank W. Lee, Kenneth S. Baron
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Patent number: 4939019Abstract: Plastic foam materials having a high degree of structural integrity, cell network uniformity and small cell size are obtained from (meth)acrylic acid and (meth)acrylonitrile by incorporating acrylamide as a comonomer additive within certain ranges of concentration. Incorporation of the latter together with conventional additives normally used in preparing foams from the principal monomers helps to avoid preliminary precipitation during the polymerization process, and the gradients in the polymer microstructure which frequently result and cause internal stresses and weaknesses in the ultimate product.Type: GrantFiled: November 15, 1989Date of Patent: July 3, 1990Assignee: Hexcel CorporationInventors: Ching-Chi Kuo, Mark Robertson, Kyu W. Lee
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Patent number: 4918110Abstract: Plastic foam materials having a high degree of structural integrity, cell network uniformity and small cell size are obtained from (meth)acrylic acid and (meth)acrylonitrile by incorporating acrylamide as a comonomer additive within certain ranges of concentration. Incorporation of the latter together with conventional additives normally used in preparing foams from the principal monomers helps to avoid preliminary precipitation during the polymerization process, and the gradients in the polymer microstructure which frequently result and cause internal stresses and weaknesses in the ultimate product.Type: GrantFiled: September 12, 1988Date of Patent: April 17, 1990Assignee: Hexcel CorporationInventors: Ching-Chi Kuo, Mark Robertson, Kyu W. Lee