Abstract: This disclosure provides a heat dissipation assembly and an electronic device. The heat dissipation assembly includes a first fan, a first fin assembly, a second fan, a second fin assembly, a vapor chamber and a heat dissipation sheet. The second fan has a second inlet, at least one second outlet and a side outlet. The at least one second outlet and the side outlet are in fluid communication with the second inlet. A direction of the side outlet directs toward the first fan. The vapor chamber is thermally coupled to the first fin assembly and the second fin assembly. The heat dissipation sheet is in thermal contact with a side of the vapor chamber, and located between the first fan and the second fan.

Abstract: A thermoelectric cooling module includes a base, a thermoelectric cooler and a plurality of heat exchangers. The base includes a case and a cover. The case has an inlet and an outlet. The cover covers the case. The cover and the case together define an accommodation space. The inlet and the outlet are connected with the accommodation space for a heat transfer fluid to flow in and out of the accommodation space. The thermoelectric cooler is in thermal contact with the cover for exchanging heat with the cover. The heat exchangers are disposed on and in thermal contact with the cover. The heat exchangers extend from the cover into the accommodation space for exchanging heat with the heat transfer fluid in the accommodation space.

Abstract: A heat dissipation system includes a first heat dissipation module, a second heat dissipation module and a bridge heat pipe. The first heat dissipation module has a heat absorbing surface in thermal contact with a first heat source. The second heat dissipation module has a heat absorbing surface in thermal contact with a second heat source. The first heat dissipation module is disposed on the bridge heat pipe. The second heat dissipation module is pivoted to the bridge heat pipe for adjusting an angle between the heat absorbing surface of the first heat dissipation module and the heat absorbing surface of the second heat dissipation module.