Abstract: An electronic package and a manufacturing method thereof are provided, in which a wiring structure electrically connected to a photonic structure is disposed on a surface of a part of the photonic structure, an electronic component is disposed on the wiring structure to be electrically connected to the wiring structure, and an optical element is disposed on a surface of another part of the photonic structure to be electrically connected to the photonic structure. Therefore, the photonic structure and the electronic component are placed relatively vertically on opposite sides of the wiring structure, thereby effectively reducing the layout area of the wiring structure to meet the demand for miniaturization.

Abstract: A magnetic core structure is disclosed. The magnetic core structure includes a bottom plate, two magnetic columns, a sidewall and a cover plate. The two magnetic columns are disposed on the bottom plate. The sidewall has a first wall portion, a second wall portion and a third wall portion. The first wall portion and the second wall portion are disposed on two sides of the bottom plate along an axial direction of the two magnetic columns. The third wall portion is disposed between the two magnetic columns, and the third wall portion is connected to the first wall portion and the second wall portion, respectively. The cover plate is disposed on the sidewall and covers the two magnetic columns. Another magnetic core structure is also provided.

Abstract: A transformer includes a magnetic core, a primary side winding and a plurality of secondary side windings. The magnetic core includes a first outer column, a second outer column, an upper cover and a lower cover. The first outer column and the second outer column are disposed between the upper cover and the lower cover. The primary side winding is disposed on the first outer column and the second outer column, and the plurality of secondary side windings are disposed on the first outer column and the second outer column. Each of the secondary windings has one end passing through a region between the first outer column and the second outer column.

Abstract: An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.

Abstract: A transformer includes a magnetic core, a primary side winding and a plurality of secondary side windings. The magnetic core includes a first outer column, a second outer column, an upper cover and a lower cover. The first outer column and the second outer column are disposed between the upper cover and the lower cover. The primary side winding is disposed on the first outer column and the second outer column, and the plurality of secondary side windings are disposed on the first outer column and the second outer column. Each of the secondary windings has one end passing through a region between the first outer column and the second outer column.

Abstract: An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.

Abstract: A modulus address generator calculates the next address to access from a current address of a circular buffer having a length L and an address shift from the current address to the next address to access. Within the circuit of the modulus address generator, a plurality of registers stores the length L of the circular buffer, the current address, and the address shift. A separator circuit generates an offset address and a base address from a mask value and the current address. A modulus calculation via a plurality of adders, and selectors is performed to calculate the next address of the circular buffer to access. A sign selector associated with an inverter and the separator circuit sets a wrap around flag depending on whether a wrap around the circular buffer has occurred during the modulus calculation of the next address to access.

Abstract: A modulus address generator calculates the next address to access from a current address of a circular buffer having a length L and an address shift from the current address to the next address to access. Within the circuit of the modulus address generator, a plurality of registers stores the length L of the circular buffer, the current address, and the address shift. A separator circuit generates an offset address and a base address from a mask value and the current address. A modulus calculation via a plurality of adders, and selectors is performed to calculate the next address of the circular buffer to access. A sign selector associated with an inverter and the separator circuit sets a wrap around flag depending on whether a wrap around the circular buffer has occurred during the modulus calculation of the next address to access.