Abstract: A photoresist composition includes a conjugated resist additive, a photoactive compound, and a polymer resin. The conjugated resist additive is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline. The polyacetylene, polythiophene, polyphenylenevinylene, polyfluorene, polypryrrole, the polyphenylene, and polyaniline includes a substituent selected from the group consisting of an alkyl group, an ether group, an ester group, an alkene group, an aromatic group, an anthracene group, an alcohol group, an amine group, a carboxylic acid group, and an amide group. Another photoresist composition includes a polymer resin having a conjugated moiety and a photoactive compound. The conjugated moiety is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline.

Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist layer is selectively exposed to actinic radiation, the selectively exposed photoresist layer is developed to form a pattern in the photoresist layer. The photoresist composition includes a polymer including monomer units with photocleaving promoters, wherein the photocleaving promoters are one or more selected from the group consisting of living free radical polymerization chain transfer agents, electron withdrawing groups, bulky two dimensional (2-D) or three dimensional (3-D) organic groups, N-(acyloxy)phthalimides, and electron stimulated radical generators.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer having an organic material over a substrate. A second layer is formed over the first layer, wherein the second layer includes a silicon-containing polymer having pendant acid groups or pendant photoacid generator groups. The forming a second layer includes: forming a layer of a composition including a silicon-based polymer and a material containing an acid group or photoacid generator group over the first layer, floating the material containing an acid group or photoacid generator group over the silicon-based polymer, and reacting the material containing an acid group or photoacid generator group with the silicon-based polymer to form an upper second layer including a silicon-based polymer having pendant acid groups or pendant photoacid generator groups overlying a lower second layer comprising the silicon-based polymer. A photosensitive layer is formed over the second layer, and the photosensitive layer is patterned.

Abstract: A method of forming a patterned photoresist layer includes the following operations: (i) forming a patterned photoresist on a substrate; (ii) forming a molding layer covering the patterned photoresist; (iii) reflowing the patterned photoresist in the molding layer; and (iv) removing the molding layer from the reflowed patterned photoresist. In some embodiments, the molding layer has a glass transition temperature that is greater than or equal to the glass transition temperature of the patterned photoresist. In yet some embodiments, the molding layer has a glass transition temperature that is 3° C.-30° C. less than the glass transition temperature of the patterned photoresist.

Abstract: In a method of manufacturing a semiconductor device, a metallic photoresist layer is formed over a target layer to be patterned, the metallic photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern. The metallic photo resist layer is an alloy layer of two or more metal elements, and the selective exposure changes a phase of the alloy layer.

Abstract: An electrical tool includes a housing, a motor, a bearing set and a shock-absorbing element. The motor is disposed in the housing and has a driving shaft and a nut. The bearing set is arranged on a side of the motor and includes a bearing seat, a bearing and a tool spindle. The tool spindle has a slot disposed at one end thereof facing the motor, and another end thereof is disposed protrusively from the bearing seat. One end of the driving shaft is combined in the slot through the nut. The shock-absorbing element sheathes the nut and is attached to an inner wall of the slot to reduce the vibration and noise during the operation of the electrical tool.

Abstract: A belt sander includes a main casing, a frame arm rotatably connected to the main casing, an abrasive belt mounted to the frame arm and adapted to be driven by electric power, a positioning member, a first sensor and a second sensor. The positioning member is movably mounted to the main casing and is movable relative to the main casing between a releasing position, where the first and second sensors are in a first sensor state, and where the second sensor generates a first signal for ceasing the electric power, and a first engaging position, where the first and second sensors are in the second sensor state, and where the second sensor generates a second signal for conducting the electric power.

Abstract: A belt sander includes: a power unit having a rotating shaft; a rotatable belt casing defining a track groove that is open toward the power unit and that surrounds the rotating shaft, and having a plurality of engaging portions that are arranged around the track groove; an abrasive belt drivable by the rotating shaft; and a positioning unit including a movable positioning member that is adapted for manual operation, and an engaging member that is co-movably connected to the positioning member. The positioning unit is movable between an engaging position, where the engaging member is engaged with a selected one of the engaging portions, and a releasing position, where the engaging member is disengaged from the engaging portions.

Abstract: A belt sander having a fast-lift cover structure includes a drive mechanism, a body and a cover. The drive mechanism includes a drive module, a tension arm, a sanding belt surrounding the drive module and the tension arm. The body receives the drive module. The body includes a base, an extendable support rod extended from the body and connected to the tension arm, and a cover fastening assembly disposed at the base. The cover fastening assembly includes a release and a resilient element for restoring the release to its original position. One end of a cover is pivotally connected at one side of the body, and the other end of the cover includes a fastening portion engaged with the release. Operation is easy, no hand tools are required, and the cover does not fall off.

Abstract: A belt sander having a fast-lift cover structure includes a drive mechanism, a body and a cover. The drive mechanism includes a drive module, a tension arm, a sanding belt surrounding the drive module and the tension arm. The body receives the drive module. The body includes a base, an extendable support rod extended from the body and connected to the tension arm, and a cover fastening assembly disposed at the base. The cover fastening assembly includes a release and a resilient element for restoring the release to its original position. One end of a cover is pivotally connected at one side of the body, and the other end of the cover includes a fastening portion engaged with the release. Operation is easy, no hand tools are required, and the cover does not fall off.

Abstract: An earphone jack which includes a plurality of terminals mounted in a casing, and a cover plate covered on the casing to hold down the terminals, each terminal having a contact portion for contact with a contact on the earphone jack inserted into the earphone jack and a horizontal mounting portion extended out of a respective side notch on the casing and disposed in flush with the cover plate for fastening to a circuit board by a surface mounting technique.