Patents by Inventor Ching Chuan

Ching Chuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210096341
    Abstract: The invention provides a projection zoom lens and a projector. The projection zoom lens includes a first lens group and a second lens group sequentially arranged along an optical axis from a screen end to an image source end. The first lens group has a negative refractive power and includes a first lens, a second lens, and a third lens. The second lens group has a positive refractive power and includes a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, a tenth lens, an eleventh lens, and a twelfth lens. The first lens to the twelfth lens are sequentially arranged along the optical axis from the screen end to the image source end, and the refractive powers of the first lens to the twelfth lens are negative, negative, positive, positive, positive, negative, negative, positive, positive, negative, positive, and positive.
    Type: Application
    Filed: September 17, 2020
    Publication date: April 1, 2021
    Applicant: Coretronic Corporation
    Inventors: Wei-Ting Wu, Meng-Feng Chung, Ching-Chuan Wei, Tao-Hung Kuo
  • Publication number: 20210096052
    Abstract: A particle detecting module is provided. The particle detecting module includes a base, a piezoelectric actuator, a driving circuit board, a laser component, a particulate sensor and an outer cover. A gas-guiding-component loading regain and a laser loading region are separated by the base. By the design of the gas flowing path, the driving circuit board covering the bottom surface of the base, and the outer cover covering the surfaces of the base, an inlet path is defined by the gas inlet groove of the base, and an outlet path is defined by a gas outlet groove of the base. Consequently, the thickness of the particle detecting module is drastically reduced.
    Type: Application
    Filed: September 9, 2020
    Publication date: April 1, 2021
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Ching-Sung LIN, Chin-Chuan WU, Chih-Kai CHEN, Yung-Lung HAN, Chi-Feng HUANG, Chang-Yen TSAI
  • Patent number: 10961114
    Abstract: The present disclosure provides a semiconductor structure, including a sensing substrate, a capping substrate over the sensing substrate, the capping substrate having a first surface facing toward the sensing substrate and a second surface facing away from the sensing substrate, wherein the capping substrate comprises a through hole extending from the first surface to the second surface, a spacer between the sensing substrate and the capping substrate, the spacer, the sensing substrate, and the capping substrate forming a cavity connecting with the through hole, and a sealing structure at the second surface and aligning with the through hole, wherein the sealing structure comprises a metal layer and a dielectric layer.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: March 30, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu
  • Patent number: 10961118
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Publication number: 20210092814
    Abstract: An operating method for a light-emitting diode (LED) power supply includes the following operations: controlling an output voltage to be a first voltage by a control circuit; detecting a load current by a detection circuit; maintaining the output voltage as the first voltage by a constant voltage control circuit when the load current is greater than zero, changing the output voltage from the first voltage to a second voltage by the control circuit when the load current is equal to zero, and the second voltage being greater than the first voltage.
    Type: Application
    Filed: April 15, 2020
    Publication date: March 25, 2021
    Inventors: Ching-Ho CHOU, Yung-Chuan LU
  • Publication number: 20210089701
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout, the initial layout comprising a first pattern and a second pattern; decomposing the initial layout into a first layout including the first pattern and a second layout including the second pattern; inserting a third pattern into the first layout; overlapping the first layout including the first pattern and the third pattern to the second layout including the second pattern; increasing a width of the third pattern in the first layout overlapping the second pattern in the second layout to form a fourth pattern in the first layout; and outputting the first layout comprising the first pattern, the third pattern and the fourth pattern into a first photomask.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 25, 2021
    Inventors: CHIN-MIN HUANG, CHING-HUNG LAI, JIA-GUEI JOU, YIN-CHUAN CHEN, CHI-MING TSAI
  • Patent number: 10955746
    Abstract: An extreme ultraviolet lithography method is disclosed. In an example, the EUVL method includes forming a resist layer on a substrate; performing a first exposure process to image a first pattern of a first sub-region of a first mask to the resist layer; performing a second exposure process to image a second pattern of a second sub-region of the first mask to the resist layer; and performing a third exposure process to image a third pattern of a first sub-region of a second mask to the resist layer. The second and third patterns are identical to the first pattern. The first, second and third exposure processes collectively form a latent image of the first pattern on the resist layer.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: March 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shinn-Sheng Yu, Ching-Fang Yu, Wen-Chuan Wang, Ting-Hao Hsu, Sheng-Chi Chin, Anthony Yen
  • Publication number: 20210080098
    Abstract: A lighting module includes a circuit board, a light emitting diode, a light guide plate and a glue material. The light emitting diode is disposed over the circuit board, and the light emitting diode includes a light emitting side surface and a non-light emitting side surface. The light guide plate is substantially parallel to the circuit board, and a portion of the light guide plate is disposed over the circuit board and adjacent to the light emitting side surface of the light emitting diode. The glue material covers and is in contact with the non-light emitting side surface of the light emitting diode and the portion of the light guide plate.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 18, 2021
    Inventors: Tsai-Wei SHEI, Yen-Ze HUANG, Ching-Huan LIAO, Yu-Chuan WEN, Sheng-Chieh TAI
  • Publication number: 20210072498
    Abstract: The disclosure proposes a projection lens including a first lens group, a second lens group and a third lens group arranged in sequence along an optical axis from a magnification side to a reduction side. The first lens group includes a plurality of lenses having refractive power. The second lens group includes at least one lens having refractive power. The third lens group includes a diaphragm, and a plurality of lenses having refractive power, wherein an intermediate image is formed between the first and third lens groups, and the refractive powers of the first, second and third lens groups are positive, positive, and positive, respectively. A projection device including the above projection lens is also proposed.
    Type: Application
    Filed: September 3, 2020
    Publication date: March 11, 2021
    Applicant: Coretronic Corporation
    Inventors: Ching-Chuan Wei, Yi-Chin Chen
  • Patent number: 10935478
    Abstract: A particle detecting device is provided. The particle detecting device includes a base, a detecting element, a micro pump and a drive control board. The base includes a detecting channel, a beam channel and a light trapping region. The detecting element includes a microprocessor, a particle sensor and a laser transmitter. The particle sensor is disposed at an orthogonal position where the detecting channel intersects the beam channel. When the micro pump, the particle sensor and the laser transmitter are enabled under the control of the microprocessor, the gas outside the detecting channel is inhaled into the detecting channel. When the gas flows to the orthogonal position where the detecting channel intersects the beam channel, the gas is irradiated by the projecting light source from the laser transmitter, and projecting light spots generated are projected on the particle sensor for detecting the size and the concentration of suspended particles.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: March 2, 2021
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Chin-Chuan Wu, Chih-Kai Chen, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo
  • Patent number: 10935969
    Abstract: A virtual metrology system at least includes a process apparatus including a set of process data, the process apparatus producing a workpiece according to the set of process data. A virtual metrology server is configured to gather the set of process data, cluster the set of process data to obtain data clusters, and compare the data clusters with patterns. If the data clusters meet the patterns corresponding to the data clusters, performing a corresponding maintenance, repair, and overhaul step on the process apparatus.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 2, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Feng-Chi Chung, Ching-Hsing Hsieh, Yi-Chun Lin, Chien-Chuan Yu
  • Patent number: 10923142
    Abstract: A system, method and computer product for training a neural network system. The method comprises applying an audio signal to the neural network system, the audio signal including a vocal component and a non-vocal component. The method also comprises comparing an output of the neural network system to a target signal, and adjusting at least one parameter of the neural network system to reduce a result of the comparing, for training the neural network system to estimate one of the vocal component and the non-vocal component. In one example embodiment, the system comprises a U-Net architecture. After training, the system can estimate vocal or instrumental components of an audio signal, depending on which type of component the system is trained to estimate.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: February 16, 2021
    Assignee: Spotify AB
    Inventors: Andreas Simon Thore Jansson, Angus William Sackfield, Ching Chuan Sung
  • Patent number: 10923141
    Abstract: A system, method and computer product for training a neural network system. The method comprises applying an audio signal to the neural network system, the audio signal including a vocal component and a non-vocal component. The method also comprises comparing an output of the neural network system to a target signal, and adjusting at least one parameter of the neural network system to reduce a result of the comparing, for training the neural network system to estimate one of the vocal component and the non-vocal component. In one example embodiment, the system comprises a U-Net architecture. After training, the system can estimate vocal or instrumental components of an audio signal, depending on which type of component the system is trained to estimate.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 16, 2021
    Assignee: Spotify AB
    Inventors: Andreas Simon Thore Jansson, Angus William Sackfield, Ching Chuan Sung
  • Patent number: 10899608
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Publication number: 20210003822
    Abstract: An optical lens includes a first lens group, a second lens group and an aperture stop. The first lens group includes a first lens and a second lens, and the second lens group includes a third lens and a cemented lens. The aperture stop is disposed between the second lens and the cemented lens, a total number of lenses with refractive powers in the optical lens is less than eight, and the optical lens includes at most three aspheric lenses. The optical lens satisfies the condition 0.9<D1/IM<1.6, where IM denotes an image circle diameter measured on a visible-light focal plane of the optical lens, and D1 denotes a lens diameter of the first lens.
    Type: Application
    Filed: June 23, 2020
    Publication date: January 7, 2021
    Inventors: CHING-SHENG CHANG, CHIA-CHEN KUNG, CHIU-JUNG LAI, KUO-CHUAN WANG
  • Patent number: 10883667
    Abstract: An LED light source module is provided, including a substrate, a protective layer, a first conductive terminal, a second conductive terminal, at least one auxiliary structure, and a light-emitting member. The protective layer is disposed on the substrate and has an opening. The first conductive terminal, the second conductive terminal, and the auxiliary structure are disposed on the substrate and accommodated in the opening, wherein the auxiliary structure is disposed between the first conductive terminal and the second conductive terminal. The light-emitting member has a first electrode and a second electrode, respectively electrically connected to the first conductive terminal and the second conductive terminal. The auxiliary structure is disposed between the light-emitting member and the substrate. A method for manufacturing the aforementioned LED light source module is also provided.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 5, 2021
    Assignees: RADIANT OPTO-ELECTRONICS (SUZHOU) CO., LTD, RADIANT OPTO-ELECTRONICS CORPORATION
    Inventors: Chih-Hsien Chung, Hsiu-Hung Yeh, Ching-Yuan Chen, Yen-Chuan Chu
  • Patent number: 10879123
    Abstract: A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh-Chuan Lee, Chia-Chan Chen, Ching-Heng Liu
  • Publication number: 20200390988
    Abstract: A spacer device for an inhaler. The device may include a hollow tube. The device may also include a piston member configured to be inserted into the hollow tube such that a space between a first end of the hollow tube and the piston member may define a chamber for holding a mist released from the inhaler. The piston may be slidable along the hollow tube towards the first end of the hollow tube as the mist is aspirated from the chamber. The hollow tube and the piston member may cooperate to provide a visual indication of the progress of the aspiration of the mist from the chamber.
    Type: Application
    Filed: December 14, 2018
    Publication date: December 17, 2020
    Applicant: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Shi Yun Karyn LIM, John ZHENG, Kum Yoong Marcus WOO, Wee Chuan Melvin LOH, Ching Chiuan YEN, Felix AUSTIN, Ulrich Bohannes SCHRAUDOLPH, Hugo VAN BEVER
  • Patent number: 10867107
    Abstract: A method for forming a photomask is provided. The method includes: receiving an initial layout including a plurality of first patterns and a plurality of second patterns; decomposing the initial layout into a first layout including the plurality of first patterns and a second layout including the plurality of second patterns; inserting a plurality of third patterns into the first layout, wherein each of the plurality of third patterns is adjacent to at least one of the plurality of first patterns; comparing the first layout and the second layout; identifying a fourth pattern as an overlapping portion of the plurality of third patterns overlapping one of the plurality of second patterns; increasing a width of the fourth pattern; and outputting the first layout including the first patterns, the third patterns and the fourth patterns into a first photomask.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Min Huang, Ching-Hung Lai, Jia-Guei Jou, Yin-Chuan Chen, Chi-Ming Tsai
  • Publication number: 20200377362
    Abstract: The present disclosure provides a semiconductor structure, including a sensing substrate, a capping substrate over the sensing substrate, the capping substrate having a first surface facing toward the sensing substrate and a second surface facing away from the sensing substrate, wherein the capping substrate comprises a through hole extending from the first surface to the second surface, a spacer between the sensing substrate and the capping substrate, the spacer, the sensing substrate, and the capping substrate forming a cavity connecting with the through hole, and a sealing structure at the second surface and aligning with the through hole, wherein the sealing structure comprises a metal layer and a dielectric layer.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 3, 2020
    Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU