Abstract: An integrated circuit in a transmitter includes a multi-lane interface, N signal generating circuits, a lane selection circuit and a control circuit. The multi-lane interface has N lanes. M of the N signal generating circuits are configured to generate M clock signals respectively. (N-M) of the N signal generating circuits are configured to generate (N-M) data signals respectively. The lane selection circuit is configured to select M of the N lanes as M clock lanes by coupling the M clock signals to the M clock lanes respectively, and couple one of the (N-M) data signals to one of remaining (N-M) lanes, serving as (N-M) data lanes, according to a data select signal. The control circuit is configured to generate a data select signal according to a lane identifier of the one of the (N-M) lanes. The data select signal has a signal value mapping to the lane identifier.

Abstract: A semiconductor die includes a semiconductor substrate, a dielectric layer over the semiconductor substrate, a metal structure in the dielectric layer, a first metal pad over the metal structure, a first oxide-based passivation layer over the first metal pad, a second oxide-based passivation layer over the first oxide-based passivation layer, and a bump electrically connected to the first metal pad. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A semiconductor die includes a semiconductor substrate, a dielectric layer over the semiconductor substrate, a metal structure in the dielectric layer, a first metal pad over the metal structure, a first oxide-based passivation layer over the first metal pad, a second oxide-based passivation layer over the first oxide-based passivation layer, and a bump electrically connected to the first metal pad. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A method is provided. A bottom passivation layer is formed on a dielectric layer over a semiconductor substrate. Then, a first opening is formed in the bottom passivation layer to expose a portion of the dielectric layer. Next, a metal pad is formed in the first opening. Afterwards, a first oxide-based passivation layer is formed over the metal pad. Then, a second oxide-based passivation layer is formed over the first oxide-based passivation layer. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A method is provided. A bottom passivation layer is formed on a dielectric layer over a semiconductor substrate. Then, a first opening is formed in the bottom passivation layer to expose a portion of the dielectric layer. Next, a metal pad is formed in the first opening. Afterwards, a first oxide-based passivation layer is formed over the metal pad. Then, a second oxide-based passivation layer is formed over the first oxide-based passivation layer. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A method is provided. A bottom passivation layer is formed on a dielectric layer over a semiconductor substrate. Then, a first opening is formed in the bottom passivation layer to expose a portion of the dielectric layer. Next, a metal pad is formed in the first opening. Afterwards, a first oxide-based passivation layer is formed over the metal pad. Then, a second oxide-based passivation layer is formed over the first oxide-based passivation layer. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A method is provided. A bottom passivation layer is formed on a dielectric layer over a semiconductor substrate. Then, a first opening is formed in the bottom passivation layer to expose a portion of the dielectric layer. Next, a metal pad is formed in the first opening. Afterwards, a first oxide-based passivation layer is formed over the metal pad. Then, a second oxide-based passivation layer is formed over the first oxide-based passivation layer. The second oxide-based passivation layer has a hardness less than a hardness of the first oxide-based passivation layer.

Abstract: A keyboard includes a non-conductive board, a plurality of keyswitches, and a capacitive touch sensing sheet. The plurality of keyswitches is disposed on the non-conductive board. Each keyswitch includes a keycap and a support device. The support device is connected to the keycap and the non-conductive board so as to make the keycap movable between a pressing position and a non-pressing position relative to the non-conductive board. The capacitive touch sensing sheet is disposed under the non-conductive board for providing a cursor signal to a computer device.

Abstract: A keyswitch includes a cap, a board, first and second support members rotatably connected to the cap and the board, a seesaw member, and a magnetic member. The seesaw member movably supports at least one of the cap and the first and second support members. The magnetic member is disposed on the board corresponding to the seesaw member. When the cap is pressed, the at least one of the cap and the first and second support members drives the seesaw member to raise and the cap moves from a non-pressed position to a pressed position. When the cap is released, a magnetic attraction force between the magnetic member and the seesaw member drives the seesaw member to raise for lifting the at least one of the cap and the first and second support members, so as to move the cap back to the non-pressed position.

Abstract: A keyswitch includes a cap, a board, first and second support members rotatably connected to the cap and the board, a seesaw member, and a magnetic member. The seesaw member movably supports at least one of the cap and the first and second support members. The magnetic member is disposed on the board corresponding to the seesaw member. When the cap is pressed, the at least one of the cap and the first and second support members drives the seesaw member to raise and the cap moves from a non-pressed position to a pressed position. When the cap is released, a magnetic attraction force between the magnetic member and the seesaw member drives the seesaw member to raise for lifting the at least one of the cap and the first and second support members, so as to move the cap back to the non-pressed position.

Abstract: A keyboard includes a non-conductive board, a plurality of keyswitches, and a capacitive touch sensing sheet. The plurality of keyswitches is disposed on the non-conductive board. Each keyswitch includes a keycap and a support device. The support device is connected to the keycap and the non-conductive board so as to make the keycap movable between a pressing position and a non-pressing position relative to the non-conductive board. The capacitive touch sensing sheet is disposed under the non-conductive board for providing a cursor signal to a computer device.

Abstract: An eye massager comprises a pair of magnetic devices; and an eye mask. The eye mask comprises a mask frame and a pair of buckles for combining an adjustable tension strip. A front end of the mask frame is a soft mask body. The mask body is formed with two through holes at positions corresponding to those of user's eyes. Each through hole is passed through by and fixed with one magnetic device. Each of two sides of the eye mask is installed with one of the pair of buckles. The mask body and the mask frame are made of hard materials. A periphery of each through hole of the mask body is enclosed by a rubber ring. The magnetic device comprises a permanent magnet; a handle having a receiving portion for receiving the permanent magnet; and a plug for sealing the permanent magnet in the handle.