Abstract: The present invention is a shielding and insulating module with a shielding-assisting component, including an insertion connection insulating component and a shielding-assisting component, wherein the insertion connection insulating component can receive a portion of an electrical connector, and the shielding-assisting component is located at a bottom portion of the insertion connection insulating component so that not only can the complexity in design of the internal structures of the insertion connection insulating component be reduced, but also it is made easy to connect to an external circuit board material or the shielding frames of the electrical connector in order to effectively form an electromagnetic shielding structure for reducing external electromagnetic interference (EMI).

Abstract: An electrical connector cable assembly, consisting of a ribbon cable joined with an electrical connector, and equipped with a fixing shielding base. The fixing shielding base can provide the fixation to the ribbon cable and the electrical connector to prevent disconnection of the ribbon cable and the electrical connector, and provides EMI shielding at the joining part of the electrical connector and the ribbon cable to address electromagnetic interference issues.

Abstract: A flexible flat coaxial ribbon cable, equipped with a plurality of coaxial cables arranged side by side to reduce the degree of interference and loss during transmitting RF signals or high-speed signals through the coaxial cables, thereby effectively increasing the transmission distance for RF signals or high-speed signals. Additionally, the coaxial cables used in the flexible flat coaxial ribbon cable of this application omits an outer insulation layer, allowing the thickness of the flexible flat coaxial ribbon cable to be effectively reduced for use in spaces with height constraints.

Abstract: An electronic device and a CIP (connector-in-package) package used therein. The CIP package can includes a semiconductor chip, an RF connector, and a carrier substrate. The carrier substrate is for carrying the semiconductor chip and the RF connector and electrically connected to the semiconductor chip and the RF connector to allow the semiconductor chip to transmit RF signal through the RF connector.