Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: A buffer includes a hollow tube, a first cap located at one end of the tube, a shaft, a flexible valve and a flexible inflation member. The shaft includes a main stem, an action stem and a sub-stem. The main stem and/or sub-stem are extended outside the tube. The main stem and action stem are bridged by a connection bar which has a first detent element connected to the main stem. The action stem has a coupling portion coupled with the connection bar, a stem surface with air intake grooves and a second detent element with notches. The inflation member has two ends surrounding the outer surface of the connection bar and the stem surface of the action stem to form a compression zone with the action stem. The buffer thus formed can prevent buffer delay and enhance buffer damping capability to generate steady and secure buffering effect.

Abstract: An air pressure buffer includes a hollow tube, a first cap at one end of the tube, a shaft including a first section, a second section and a third section with the first section and/or third section extended outside the tube, a flexible valve which has an annular recess at one side to form an open space with the tube and second section extended to the third section and another side facing the first cap to form a closed space with the tube, the first cap and the second section extended to the first section, and a flexible compression member which has at least one axial ventilation groove on the outer surface thereof. The structure thus formed does not have buffer delay while being applied by an external force and provides enhanced buffer damping capability and steady and secure buffering effect.

Abstract: A hydraulic shock absorber comprises a pipe body, a piston rod, a ring, a piston, and a hydraulic oil contained in the pipe body. The ring is coupled to a tapered portion of the piston rod and moved along an aslant tapered surface of the tapered portion, and the piston is fixed to a connecting portion of the piston rod and can move together with the piston rod. The piston has a longitudinally penetrating through hole that restricts the hydraulic oil to pass the piston through the through hole only. If the piston rod is pulled, the ring will move along the tapered portion and attach on the surface of the piston to block a portion of the through hole, and the piston rod moves slowly to produce a shock absorbing force, so as to achieve the purpose of reducing shocks and noises during the movement of an object.