Patents by Inventor Ching-Chun Chou

Ching-Chun Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10973005
    Abstract: A method for resource allocation includes acquiring resource information indicating an available wireless resource and an available computing resource, and allocating the available wireless resource and the available computing resource for a transmission mode of a wireless transmission based on the resource information and a system utility requirement.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: April 6, 2021
    Assignees: HON HAI PRECISION INDUSTRY CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Hung-Yu Wei, Ching-Chun Chou
  • Publication number: 20210051454
    Abstract: A V2X communication method includes: sending an assistance information from a V2X device to a user equipment (UE); performing first configuration on the UE; receiving a packet by the UE; performing upper layer mapping by the UE; sending a first traffic information from the UE to the V2X device; in response to a configuration request from the UE to the V2X device, performing second configuration on the UE by the V2X device; performing packet mapping by the UE; and performing layer processing by the UE.
    Type: Application
    Filed: August 13, 2020
    Publication date: February 18, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Chun CHOU, Hung-Yu WEI, Hua-Lung TSAI
  • Publication number: 20210018009
    Abstract: A fan module comprises a frame, a wire-stopping structure, an impeller and a circuit board. The frame includes a frame wall, a base, a plurality of static blades and a connector. A wire groove formed on an outside of the frame wall to accommodate a wire. The static blades are radially connected to the base and the frame wall. The connector is formed on the outside of the frame wall and extended from one end of the wire groove to the base along one of the static blades. The connector includes a plurality of pins. The wire-stopping board is fixed to the frame wall to cover the wire groove. The impeller is disposed in the frame. The circuit board is disposed in the frame and located on the base. The circuit board includes a plurality of pin holes, and the pin holes are electrically connected to the pins.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 21, 2021
    Inventors: MING-KAI HSIEH, CHING-HSIANG HUANG, YI-FANG CHOU, PO-CHUN WANG
  • Publication number: 20200396719
    Abstract: The disclosure is directed to a radio resource sensing and selecting method used by a mobile device for wireless communication and a mobile device using the same. In an exemplary embodiment, the disclosure is directed to a resource sensing and selecting method used by a UE newly entering a network and operating under NR V2X mode 2. The method includes not limited to: receiving aperiodic data traffic; obtaining resource usage information of a resource pool before a first short-term window; determining collided UEs from the resource usage information; determining whether the collided UEs have sufficient resource units; selecting no resource within the first short-term window when the collided UEs lack sufficient resource units and waiting for a second short-term window; and selecting, in a random manner, an idle resource unit from the resource pool at the first short-term window when the collided UEs have sufficient resources.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 17, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Chorng-Ren Sheu, Hua-Lung Tsai, Ching-Chun Chou, Heng-Ming Hu
  • Publication number: 20200388706
    Abstract: The present disclosure describes various non-planar semiconductor devices, such as fin field-effect transistors (finFETs) to provide an example, having one or more metal rail conductors and various methods for fabricating these non-planar semiconductor devices. In some situations, the one or more metal rail conductors can be electrically connected to gate, source, and/or drain regions of these various non-planar semiconductor devices. In these situations, the one or more metal rail conductors can be utilized to electrically connect the gate, the source, and/or the drain regions of various non-planar semiconductor devices to other gate, source, and/or drain regions of various non-planar semiconductor devices and/or other semiconductor devices. However, in other situations, the one or more metal rail conductors can be isolated from the gate, the source, and/or the drain regions these various non-planar semiconductor devices.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang CHEN, Chih-Ming LAI, Ching-Wei TSAI, Charles Chew-Yuen YOUNG, Jiann-Tyng TZENG, Kuo-Cheng CHIANG, Ru-Gun LIU, Wei-Hao WU, Yi-Hsiung LIN, Chia-Hao CHANG, Lei-Chun CHOU
  • Patent number: 10823384
    Abstract: A wireless induction lamp includes a transmitter device for emitting wireless electric energy to a lamp receiver device, and the lamp receiver device includes a lamp housing having a transparent part disposed thereon, and a wireless light emitting device is disposed inside the lamp housing and in the transparent part. A first induction coil is disposed around on an outer edge of the wireless light emitting device, and receives the wireless electric energy of the transmitter device, to provide electric energy to the wireless light emitting device to emit light. The wireless induction lamp can wirelessly transmit electrical power to the light emitting element to emit light, so as to reduce disposal of electric wires, and the wireless light emitting device can be turned on/off by just changing a posture angle of the lamp housing to move close to or away from the electromagnetic range of the transmitter device.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 3, 2020
    Assignee: DS Power Co., Ltd.
    Inventors: Shen-Jye Shieh, Ching-Yuan Huang, Chih-Hsiung Yu, Li-Han Chen, Ju-Chun Liu, Kai-Yi Chou
  • Patent number: 10763365
    Abstract: The present disclosure describes various non-planar semiconductor devices, such as fin field-effect transistors (finFETs) to provide an example, having one or more metal rail conductors and various methods for fabricating these non-planar semiconductor devices. In some situations, the one or more metal rail conductors can be electrically connected to gate, source, and/or drain regions of these various non-planar semiconductor devices. In these situations, the one or more metal rail conductors can be utilized to electrically connect the gate, the source, and/or the drain regions of various non-planar semiconductor devices to other gate, source, and/or drain regions of various non-planar semiconductor devices and/or other semiconductor devices. However, in other situations, the one or more metal rail conductors can be isolated from the gate, the source, and/or the drain regions these various non-planar semiconductor devices.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kuo-Cheng Ching, Ru-Gun Liu, Wei-Hao Wu, Yi-Hsiung Lin, Chia-Hao Chang, Lei-Chun Chou
  • Patent number: 10660003
    Abstract: A method performed by an MEC orchestrator includes: acquiring MEC computation-related information and User Equipment (UE) mobility-related information from an MEC system including a plurality of MEC entities, performing a classification procedure, based on the MEC computation-related information and the UE mobility-related information, to determine a behavior type of a UE, wherein the behavior type indicates whether to trigger a handover (HO) in the MEC system and whether to trigger a Virtual Machine (VM) migration in the MEC system, and providing an instruction table in response to the behavior type, wherein the instruction table including routing information for routing MEC traffic among one or more of the plurality of MEC entities.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: May 19, 2020
    Assignees: HON HAI PRECISION INDUSTRY CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Hung-Yu Wei, Yung-Lin Hsu, Ching-Chun Chou
  • Publication number: 20200152675
    Abstract: Some embodiments relate an integrated circuit (IC). The IC includes a first substrate including an array of photodetectors, wherein a bond pad opening extends through the first substrate and is defined by an inner sidewall of the first substrate. An interconnect structure is disposed over the first substrate and includes a plurality of metal layers stacked over one another and disposed within a dielectric structure. The bond pad opening further extends through at least a portion of the interconnect structure and is further defined by an inner sidewall of the interconnect structure. A bond pad structure directly contacts a metal layer of the plurality of metal layers in the interconnect structure and is located at an uppermost extent of the bond pad opening.
    Type: Application
    Filed: December 6, 2019
    Publication date: May 14, 2020
    Inventors: Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou
  • Publication number: 20200006514
    Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a first region, a second region, a third region, and a fourth region; forming a tuning layer on the second region; forming a first work function metal layer on the first region and the tuning layer of the second region; forming a second work function metal layer on the first region, the second region, and the fourth region; and forming a top barrier metal (TBM) layer on the first region, the second region, the third region, and the fourth region.
    Type: Application
    Filed: September 4, 2019
    Publication date: January 2, 2020
    Inventors: Kuo-Chih Lai, Yun-Tzu Chang, Wei-Ming Hsiao, Nien-Ting Ho, Shih-Min Chou, Yang-Ju Lu, Ching-Yun Chang, Yen-Chen Chen, Kuan-Chun Lin, Chi-Mao Hsu
  • Patent number: 10515995
    Abstract: Some embodiments relate to a method. In the method, a CMOS substrate, which includes a plurality of CMOS devices, is received. An interconnect structure including a plurality of metal layers is formed over the CMOS substrate, wherein a first metal layer of the metal layers is nearest the CMOS substrate and an Nth of the metal layers is furthest from the CMOS substrate. An image sensor substrate is bonded to the interconnect structure. A first mask is formed over the image sensor substrate, and a first etch is performed with the first mask in place to expose an upper surface of the first metal layer. A conductive bond pad material is formed in direct contact with the exposed first metal layer.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou
  • Patent number: 10490643
    Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a first region, a second region, a third region, and a fourth region; forming a tuning layer on the second region; forming a first work function metal layer on the first region and the tuning layer of the second region; forming a second work function metal layer on the first region, the second region, and the fourth region; and forming a top barrier metal (TBM) layer on the first region, the second region, the third region, and the fourth region.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: November 26, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chih Lai, Yun-Tzu Chang, Wei-Ming Hsiao, Nien-Ting Ho, Shih-Min Chou, Yang-Ju Lu, Ching-Yun Chang, Yen-Chen Chen, Kuan-Chun Lin, Chi-Mao Hsu
  • Publication number: 20190310341
    Abstract: A method of direction finding (DF) positioning based on a simplified antenna platform format in a wireless communication network is proposed. A receiver receives antenna platform format information of a transmitter having multiple antenna elements. The antenna platform format information comprises an antenna platform format indicator, antenna platform position and orientation information, a number of antenna elements, and switching delay, phase center, and polarization information for each antenna element. The receiver receives a plurality of direction finding sounding signals transmitted from the transmitter via the multiple antenna elements. The receiver performs a DF algorithm based on the plurality of DF sounding signals and the antenna platform format information and thereby estimating a DF solution. Finally, the receiver determines its own location information based on the estimated DF solution.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 10, 2019
    Inventors: James June-Ming Wang, Kai-Chun Chou, Ching-Hwa Yu, Hsuan-Yu Liu
  • Patent number: 10371783
    Abstract: A method of direction finding (DF) positioning based on a simplified antenna platform format in a wireless communication network is proposed. A receiver receives antenna platform format information of a transmitter having multiple antenna elements. The antenna platform format information comprises an antenna platform format indicator, antenna platform position and orientation information, a number of antenna elements, and switching delay, phase center, and polarization information for each antenna element. The receiver receives a plurality of direction finding sounding signals transmitted from the transmitter via the multiple antenna elements. The receiver performs a DF algorithm based on the plurality of DF sounding signals and the antenna platform format information and thereby estimating a DF solution. Finally, the receiver determines its own location information based on the estimated DF solution.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 6, 2019
    Assignee: MEDIATEK INC.
    Inventors: James June-Ming Wang, Kai-Chun Chou, Ching-Hwa Yu, Hsuan-Yu Liu
  • Publication number: 20190212368
    Abstract: A probe card includes a space transformer, a printed circuit board and a plurality of welding elements. The space transformer is disposed with a plurality of first conductive protrusions. Each of the first conductive protrusions has a first end surface. The printed circuit board is disposed with a plurality of second conductive protrusions. Each of the second conductive protrusions has a second end surface. The welding elements are respectively and electrically connected between each of the second end surfaces and the corresponding first end surface. A first surface of the space transformer away from the printed circuit board has a first degree of flatness. A second surface of the printed circuit board away from the space transformer has a second degree of flatness. The first degree of flatness is less than the second degree of flatness.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 11, 2019
    Inventors: Hsien-Ta HSU, Yu-Chen HSU, Ching-Hua WU, Kuan-Chun CHOU, Horng-Kuang FAN
  • Patent number: 10342001
    Abstract: The disclosure is directed to a base station and a user equipment having on-demand signaling mechanism in directional wireless system. According to one of the exemplary embodiment, the present disclosure proposes a base station which includes at least but not limited to a transmitter and a receiver to transmit and receive data respectively and a processing circuit coupled to the transmitter and the receiver and is configured at least to receive through the receiver a service request to start an on-demand transmission, configure a control signaling to schedule a schedulable resource based on the service request in response to starting the on-demand transmission, and transmit through the transmitter the control signaling for triggering reference signals of an external base station to transmit the scheduled schedulable resource, wherein the reference signals are aperiodic and directional.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: July 2, 2019
    Assignees: National Taiwan University, MediaTek Inc.
    Inventors: Hung-Yu Wei, Ching-Chun Chou
  • Publication number: 20190165177
    Abstract: The present disclosure describes various non-planar semiconductor devices, such as fin field-effect transistors (finFETs) to provide an example, having one or more metal rail conductors and various methods for fabricating these non-planar semiconductor devices. In some situations, the one or more metal rail conductors can be electrically connected to gate, source, and/or drain regions of these various non-planar semiconductor devices. In these situations, the one or more metal rail conductors can be utilized to electrically connect the gate, the source, and/or the drain regions of various non-planar semiconductor devices to other gate, source, and/or drain regions of various non-planar semiconductor devices and/or other semiconductor devices. However, in other situations, the one or more metal rail conductors can be isolated from the gate, the source, and/or the drain regions these various non-planar semiconductor devices.
    Type: Application
    Filed: October 31, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang CHEN, Chih-Ming LAI, Ching-Wei TSAI, Charles Chew-Yuen YOUNG, Jiann-Tyng TZENG, Kuo-Cheng CHING, Ru-Gun LIU, Wei-Hao WU, Yi-Hsiung LIN, Chia-Hao CHANG, Lei-Chun CHOU
  • Publication number: 20190141593
    Abstract: A method performed by an MEC orchestrator includes: acquiring MEC computation-related information and User Equipment (UE) mobility-related information from an MEC system including a plurality of MEC entities, performing a classification procedure, based on the MEC computation-related information and the UE mobility-related information, to determine a behavior type of a UE, wherein the behavior type indicates whether to trigger a handover (HO) in the MEC system and whether to trigger a Virtual Machine (VM) migration in the MEC system, and providing an instruction table in response to the behavior type, wherein the instruction table including routing information for routing MEC traffic among one or more of the plurality of MEC entities.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 9, 2019
    Inventors: HUNG-YU WEI, YUNG-LIN HSU, CHING-CHUN CHOU
  • Publication number: 20190069274
    Abstract: A method for resource allocation includes acquiring resource information indicating an available wireless resource and an available computing resource, and allocating the available wireless resource and the available computing resource for a transmission mode of a wireless transmission based on the resource information and a system utility requirement.
    Type: Application
    Filed: August 30, 2018
    Publication date: February 28, 2019
    Inventors: HUNG-YU WEI, CHING-CHUN CHOU
  • Publication number: 20180368053
    Abstract: Methods and devices for network slicing are disclosed. The method of network slicing includes generating, by a base station, a network slice capability message including a network slice profile having a computational configuration, and transmitting, by the base station, the network slice capability message to a user equipment (UE).
    Type: Application
    Filed: June 15, 2018
    Publication date: December 20, 2018
    Inventors: HUNG-YU WEI, CHING-CHUN CHOU