Patents by Inventor Ching-Chung Su

Ching-Chung Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Feature dimension measurement
    Patent number: 8049213
    Abstract: A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: November 1, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Chung Su, Yi-Wei Chiu, Tzu Chan Weng, Yih Song Chiu, Pin Chia Su, Chih-Cherng Jeng, Kuo-Hsiu Wei
  • Feature Dimension Measurement
    Publication number: 20090152545
    Abstract: A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Chung Su, Yi-Wei Chiu, Tzu-Chan Weng, Yih Song Chiu, Pin Chia Su, Chih-Cherng Jeng, Kuo-Hsiu Wei