Abstract: An ultra-short focus projection lens is configured to receive an image beam from an image source side and project the image beam toward a projection surface. The ultra-short focus projection lens has an optical axis. The ultra-short focus projection lens includes a reflective optical element, a first lens group, a stop, and a second lens group arranged in sequence along the optical axis. The image beam from the image source side passes through the second lens group, the stop, and the first lens group in sequence, and is reflected by the reflective optical element and projected to the projection surface. The first lens group includes a plurality of lenses having diopters. The second lens group 10 includes a plurality of lenses having diopters. The first lens group and the second lens group include ten lenses having diopters in total. A projection device is also provided.

Abstract: A gamma tap circuit includes: (i) a first gamma division circuit configured to generate a first gamma tap voltage by performing voltage division of an upper gamma tap voltage and a lower gamma tap voltage, in-sync with a first clock signal CK1 and a first complementary clock signal CK1b, which is 180° out-of-phase relative to CK1, (ii) a second gamma division circuit configured to generate a second gamma tap voltage by performing voltage division of the upper gamma tap voltage and the first gamma tap voltage, in-sync with a second clock signal CK2 and a second complementary clock signal CK2b, which is 180° out-of-phase relative to CK2, and (iii) a third gamma division circuit configured to generate a third gamma tap voltage by performing voltage division of the first gamma tap voltage and the lower gamma tap voltage, in response to CK2 and CK2b, which have a lower frequency relative to CK1 and CK1b.

Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A control device for an oil drain valve can control opening and closing of the oil drain valve at a far end. The oil drain valve includes a base and a control element connected to the base. The control device further includes a guide element and a driving element. The guide element at an end thereof is joined to the base and the driving element passes through the guide element. An end of the driving element is joined to the control element and another end of the driving element can be pulled from the far end to rotate the control element for controlling opening and closing.

Abstract: A control device for an oil drain valve can control opening and closing of the oil drain valve at a far end. The oil drain valve includes a base and a control element connected to the base. The control device further includes a guide element and a driving element. The guide element at an end thereof is joined to the base and the driving element passes through the guide element. An end of the driving element is joined to the control element and another end of the driving element can be pulled from the far end to rotate the control element for controlling opening and closing.

Abstract: An oil drain valve comprises a base and a control part. The base is fixedly attached to a drain hole at the bottom of the oil container. The base at the interior is a hollow chamber to communicate with the oil container and a guide opening is provided at the lateral wall of the base to communicate with the hollow chamber. The control part at the interior thereof has a communication chamber communicates with the hollow chamber and the lateral side thereof has an outlet connects with the communication chamber. The base at the lateral wall thereof has a guide groove and receiver grooves with a resilient piece being received in each receiver groove. A ball is disposed on the respective resilient piece to be biased against the guide groove so that the control part can fit with the base pivotally to block the guide opening.

Abstract: An oil drain valve comprises a base and a control part. The base is fixedly attached to a drain hole at the bottom of the oil container. The base at the interior is a hollow chamber to communicate with the oil container and a guide opening is provided at the lateral wall of the base to communicate with the hollow chamber. The control part at the interior thereof has a communication chamber communicates with the hollow chamber and the lateral side thereof has an outlet connects with the communication chamber. The base at the lateral wall thereof has a guide groove and receiver grooves with a resilient piece being received in each receiver groove. A ball is disposed on the respective resilient piece to be biased against the guide groove so that the control part can fit with the base pivotally to block the guide opening.