Patents by Inventor Ching-Fang CHENG

Ching-Fang CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Support structure and manufacture method thereof
    Patent number: 10149384
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: December 4, 2018
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
  • SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF
    Publication number: 20180332704
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Application
    Filed: July 4, 2018
    Publication date: November 15, 2018
    Inventors: Yung-Tai SU, Ching-Fang Cheng, Ti-Chiang Chiu
  • Support structure and manufacture method thereof
    Patent number: 10021783
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: July 10, 2018
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
  • SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF
    Publication number: 20170332490
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Application
    Filed: February 17, 2017
    Publication date: November 16, 2017
    Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai SU, Ching-Fang CHENG, Ti-Chiang CHIU