Patents by Inventor Ching-Feng Lin
Ching-Feng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 11944412Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.Type: GrantFiled: June 2, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
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Publication number: 20240087960Abstract: A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.Type: ApplicationFiled: November 13, 2023Publication date: March 14, 2024Inventors: Yu-Lien HUANG, Ching-Feng FU, Huan-Just LIN, Fu-Sheng LI, Tsai-Jung HO, Bor Chiuan HSIEH, Guan-Xuan CHEN, Guan-Ren WANG
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Patent number: 11736856Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.Type: GrantFiled: October 26, 2021Date of Patent: August 22, 2023Assignee: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
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Patent number: 11582551Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.Type: GrantFiled: October 25, 2021Date of Patent: February 14, 2023Assignee: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
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Patent number: 11553273Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.Type: GrantFiled: September 15, 2021Date of Patent: January 10, 2023Assignee: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
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Patent number: 11546681Abstract: A speaker adapted to be disposed on a head-mounted device includes a housing member, a speaker unit, a vibrating unit and an abutting member. The housing member is adapted to be disposed on the head-mounted device and is formed with an opening adapted to open toward an ear of a user when in use. The speaker unit is disposed on the housing member in a manner that the speaker unit is not directly in contact with the head of the user when in use. The vibrating unit is disposed on the housing member and is capable of generating vibrations. The abutting member is disposed on the vibrating unit, is adapted to be in contact with the skin of the user, and is capable of transmitting the vibrations to the skull of the user.Type: GrantFiled: September 17, 2021Date of Patent: January 3, 2023Assignee: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen
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Patent number: 11488786Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.Type: GrantFiled: September 18, 2020Date of Patent: November 1, 2022Assignee: APAQ TECHNOLOGY CO., LTD.Inventors: Chieh Lin, Chung-Jui Su, Ching-Feng Lin, Ming-Tsung Chen
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Publication number: 20220141570Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.Type: ApplicationFiled: October 26, 2021Publication date: May 5, 2022Applicant: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
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Publication number: 20220141575Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.Type: ApplicationFiled: October 25, 2021Publication date: May 5, 2022Applicant: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
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Publication number: 20220141561Abstract: A speaker adapted to be disposed on a head-mounted device includes a housing member, a speaker unit, a vibrating unit and an abutting member. The housing member is adapted to be disposed on the head-mounted device and is formed with an opening adapted to open toward an ear of a user when in use. The speaker unit is disposed on the housing member in a manner that the speaker unit is not directly in contact with the head of the user when in use. The vibrating unit is disposed on the housing member and is capable of generating vibrations. The abutting member is disposed on the vibrating unit, is adapted to be in contact with the skin of the user, and is capable of transmitting the vibrations to the skull of the user.Type: ApplicationFiled: September 17, 2021Publication date: May 5, 2022Applicant: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen
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Publication number: 20220141574Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.Type: ApplicationFiled: September 15, 2021Publication date: May 5, 2022Applicant: Jabil Circuit (Singapore) Pte. Ltd.Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
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Publication number: 20210296054Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.Type: ApplicationFiled: September 18, 2020Publication date: September 23, 2021Inventors: CHIEH LIN, CHUNG-JUI SU, CHING-FENG LIN, MING-TSUNG CHEN
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Patent number: 10513602Abstract: The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.Type: GrantFiled: August 9, 2017Date of Patent: December 24, 2019Assignee: APAQ TECHNOLOGY CO., LTD.Inventors: Chieh Lin, Ching-Feng Lin, Ming-Tsung Chen
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Publication number: 20190194441Abstract: The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.Type: ApplicationFiled: February 27, 2019Publication date: June 27, 2019Inventors: CHIEH LIN, CHING-FENG LIN, MING-TSUNG CHEN
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Capacitor assembly having a non-symmetrical electrode structure and capacitor seat structure thereof
Patent number: 10192687Abstract: The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.Type: GrantFiled: July 10, 2017Date of Patent: January 29, 2019Assignee: APAQ TECHNOLOGY CO., LTD.Inventors: Ming-Tsung Chen, Hsi-Dung Lin, Ching-Feng Lin -
Patent number: 10163576Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.Type: GrantFiled: January 25, 2017Date of Patent: December 25, 2018Assignee: Apaq Technology Co., Ltd.Inventors: Ching-Feng Lin, Ming-Tsung Chen
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Patent number: 10098268Abstract: An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanostructure is disposed on the first surface of the carrier substrate, and the second nanostructure is disposed on the second surface of the carrier substrate.Type: GrantFiled: February 14, 2017Date of Patent: October 9, 2018Assignee: ANDAQ TECHNOLOGY CO., LTD.Inventor: Ching-Feng Lin