Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.

Abstract: A heat dissipating pad includes a pad body and a fan. The pad body has a hollow accommodating recess and a first fixing structure disposed on a side of the hollow accommodating recess. The fan includes a fan frame. The fan frame is detachably disposed in the hollow accommodating recess and has a second fixing structure. When the fan frame is disposed at a predetermined position in the hollow accommodating recess, the first fixing structure and the second fixing structure are fixed with each other so as to prevent the fan frame from coming off the hollow accommodating recess.

Abstract: A foldable supporting bracket for a portable electronic apparatus includes a supporting arm, a holding element, and two load-bearing bars. The supporting arm has a first pivot shaft at one terminal thereof and the holding element has a second pivot shaft at one terminal thereof. The two load-bearing bars are separated to each other and pivotally arranged between the first pivot shaft and the second pivot shaft to form a hollow containing region. The supporting arm and the holding element are pivotally connected to the two load-bearing bars via the first pivot shaft and the second pivot shat, respectively, so that the supporting arm and the holding element are flipped toward the hollow containing region. Accordingly, the supporting arm and the holding element are folded in the hollow containing region and then levelly arranged to the two load-bearing bars, thus reducing occupied space and increasing carry convenience.