Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The present invention discloses a light sensing unit of a light sensing device including a light sensing element and a switching element. The light sensing element includes a gate, a semiconductor layer, a gate insulating layer, a source, and a drain. The gate and the semiconductor layer are disposed on a substrate, the gate insulating layer separates the gate from the semiconductor layer, and the source and the drain are connected to the semiconductor layer respectively. At least one of the source and the drain are formed of a light-transmissive conductive layer. The semiconductor layer is disposed between one of the source and the drain and the gate, and when viewed along a normal direction of the substrate, the gate overlaps the one of the source and the drain, and the gate does not overlap another one of the source and the drain.

Abstract: A light sensing device includes a substrate, a gate electrode, a shielding electrode, a insulating layer, a semiconductor layer, a source electrode, and a drain electrode. The gate electrode and the shielding electrode are disposed over the substrate and spaced apart from each other. The insulating layer is disposed over the gate electrode and the shielding electrode. The semiconductor layer is disposed over the insulating layer. The source and drain electrodes are respectively connected to the semiconductor layer, and the semiconductor layer has a channel region between the source and drain electrodes. The channel region is divided into a first region adjacent to the drain electrode and overlapping the gate electrode and a second region adjacent to the source electrode and not overlapping the gate electrode, and the second region partially overlaps the shielding electrode.

Abstract: A pixel structure includes a substrate and a thin-film transistor having a first top surface and disposed above the substrate. The first top surface has a first projection area. A data line has a data line adjoining area connected to the thin-film transistor. A pixel electrode has a second top surface and disposed above the thin-film transistor. The second top surface has a second projection area that is greater than the first projection area. The second projection area has a first part and a second part; the first part corresponding to the first projection area is removed by at least 50%; and the second part corresponding to the data line adjoining area is at most 70% removed. The pixel structure omits an insulation layer under the pixel electrode to lower the cost of production and speed up the manufacturing process.

Abstract: A touch panel includes a substrate, a touch electrode, a control unit, and a trace structure. The substrate has a touch sensing area and a peripheral circuit area. The touch electrode is disposed on the touch sensing area of the substrate. The touch electrode includes a first transparent conductive layer, a second transparent conductive layer, and a metal mesh layer. The second transparent conductive layer is disposed on the first transparent conductive layer. The metal mesh layer is disposed between the first transparent conductive layer and the second transparent conductive layer, in which the metal mesh layer is at least partially in contact with the first transparent conductive layer and the second transparent conductive layer, and the metal mesh layer comprises plural metal lines. The trace structure is disposed on the peripheral circuit area of the substrate and configured to electrically connect the touch electrode to the control unit.

Abstract: A handheld radiation image detecting system and an operation method thereof are provided. The handheld radiation image detecting system includes a handheld device including a radiation emitter and a first transceiver and a sensing device including a radiation image sensor and a second transceiver. The first transceiver is coupled to the radiation emitter and used for generating a first wave with directionality. The second transceiver is used for receiving the first wave and for generating a second wave with directionality, and the first transceiver is used for receiving the second wave.

Abstract: A display device includes a display substrate, at least one micro light-emitting diode (LED) chip, and at least one reflective layer. The display substrate includes at least one sub-pixel circuit. The micro LED chip is electrically connected to the sub-pixel circuit. The micro LED chip is at least partially disposed between the reflective layer and the sub-pixel circuit.

Abstract: A method for manufacturing a flexible touch display panel is provided. First, a display mother substrate including a plurality of first pad sets and a flexible touch mother substrate including a plurality of second pad sets are provided. Next, a plurality of first openings are formed in the display mother substrate, and a plurality of second openings are formed in the flexible touch mother substrate. Then, the flexible touch mother substrate is adhered to the display mother substrate by an adhesive layer, in which each first opening exposes one of the second pad sets respectively, and each second opening exposes one of the first pad sets respectively. Afterward, a cutting process is performed to form a plurality of touch display units.

Abstract: A display device includes a display substrate, at least one micro light-emitting diode (LED) chip, and at least one reflective layer. The display substrate includes at least one sub-pixel circuit. The micro LED chip is electrically connected to the sub-pixel circuit. The micro LED chip is at least partially disposed between the reflective layer and the sub-pixel circuit.

Abstract: A method for manufacturing a flexible touch display panel is provided. First, a display mother substrate including a plurality of first pad sets and a flexible touch mother substrate including a plurality of second pad sets are provided. Next, a plurality of first openings are formed in the display mother substrate, and a plurality of second openings are formed in the flexible touch mother substrate. Then, the flexible touch mother substrate is adhered to the display mother substrate by an adhesive layer, in which each first opening exposes one of the second pad sets respectively, and each second opening exposes one of the first pad sets respectively. Afterward, a cutting process is performed to form a plurality of touch display units.

Abstract: A handheld radiation image detecting system and an operation method thereof are provided. The handheld radiation image detecting system includes a handheld device including a radiation emitter and a first transceiver and a sensing device including a radiation image sensor and a second transceiver. The first transceiver is coupled to the radiation emitter and used for generating a first wave with directionality. The second transceiver is used for receiving the first wave and for generating a second wave with directionality, and the first transceiver is used for receiving the second wave.

Abstract: A touch panel includes a substrate, a touch electrode, a control unit, and a trace structure. The substrate has a touch sensing area and a peripheral circuit area. The touch electrode is disposed on the touch sensing area of the substrate. The touch electrode includes a first transparent conductive layer, a second transparent conductive layer, and a metal mesh layer. The second transparent conductive layer is disposed on the first transparent conductive layer. The metal mesh layer is disposed between the first transparent conductive layer and the second transparent conductive layer, in which the metal mesh layer is at least partially in contact with the first transparent conductive layer and the second transparent conductive layer, and the metal mesh layer comprises plural metal lines. The trace structure is disposed on the peripheral circuit area of the substrate and configured to electrically connect the touch electrode to the control unit.

Abstract: A touch panel includes a substrate, a touch electrode, a control unit, and a trace structure. The substrate has a touch sensing area and a peripheral circuit area. The touch electrode is disposed on the touch sensing area of the substrate. The touch electrode includes a first transparent conductive layer, a second transparent conductive layer, and a metal mesh layer. The second transparent conductive layer is disposed on the first transparent conductive layer. The metal mesh layer is disposed between the first transparent conductive layer and the second transparent conductive layer, in which the metal mesh layer is at least partially in contact with the first transparent conductive layer and the second transparent conductive layer, and the metal mesh layer comprises plural metal lines. The trace structure is disposed on the peripheral circuit area of the substrate and configured to electrically connect the touch electrode to the control unit.

Abstract: A flexible touch display panel and a method for manufacturing the same are provided. First, a display mother substrate including a plurality of first pad sets and a flexible touch mother substrate including a plurality of second pad sets are provided. Next, a plurality of first openings are formed in the display mother substrate, and a plurality of second openings are formed in the flexible touch mother substrate. Then, the flexible touch mother substrate is adhered to the display mother substrate by an adhesive layer, in which each first opening exposes one of the second pad sets respectively, and each second opening exposes one of the first pad sets respectively. Afterward, a cutting process is performed to form a plurality of touch display units.

Abstract: A touch panel is disclosed, which includes a substrate, plural sensing units, plural wires, and a grounding component. The substrate includes a touch area and a wiring area surrounding the touch area. The sensing units are formed in the touch area. The wires are formed in the wiring area and are connected to the sensing units. The ground component is formed in the wiring area and includes plural hollow portions and conductive portions. At least parts of the hollow portions and at least parts of the conductive portions are alternatingly arranged. The situation of metal peeling can be prevented by slicing the grounding component in the touch panel.