Patents by Inventor Ching-Feng Tseng

Ching-Feng Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8681051
    Abstract: Provided is a multiband printed antenna for receiving and emitting multiple electromagnetic wave signals of different bands. The multiband printed antenna includes a substrate and a conductive layer formed on a positive surface of the substrate. The conductive layer includes a grounding portion, a plurality of radiating portions controlling different bands and a single feeder point used to transmit electromagnetic wave signals. The multiband printed antenna of the present invention can separately control multiple radiating portions, which have different bands and are together formed on one same substrate, to emit the electromagnetic wave signals at one same feeder point, thereby realizing the object of the single printed antenna controlling multiple bands and greatly reducing the manufacture cost to satisfy the demand of 4G communication industry.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: March 25, 2014
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yi-feng Huang, Jia-hung Su, Kai Shih, Ching-feng Tseng
  • Publication number: 20130063311
    Abstract: Provided is a multiband printed antenna for receiving and emitting multiple electromagnetic wave signals of different bands. The multiband printed antenna includes a substrate and a conductive layer formed on a positive surface of the substrate. The conductive layer includes a grounding portion, a plurality of radiating portions controlling different bands and a single feeder point used to transmit electromagnetic wave signals. The multiband printed antenna of the present invention can separately control multiple radiating portions, which have different bands and are together formed on one same substrate, to emit the electromagnetic wave signals at one same feeder point, thereby realizing the object of the single printed antenna controlling multiple bands and greatly reducing the manufacture cost to satisfy the demand of 4G communication industry.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Applicant: Cheng Uei Precision Industry Co., LTD.
    Inventors: Yi-feng Huang, Jia-hung Su, Kai Shih, Ching-feng Tseng
  • Patent number: 7352329
    Abstract: A multi-band antenna with the broadband function is based upon a planar inverted-F antenna with two conductive arms and a ground. The two conductive arms extend from the ground near the two opposite ends of the ground. Two radiation plates of the two conductive arms extend toward each other. The multi-band antenna has a sufficient large band at high frequencies. Since the conductive arms are disposed close to the two ends of the ground, operations of bending the two conductive arms or soldering a feed wires are simpler and have a higher yield.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: April 1, 2008
    Assignee: Advance Connectek, Inc.
    Inventors: Ming-Hsun Chung, Tsung-Wen Chiu, Ching-Feng Tseng, Yun-Fan Bai, An-Chia Chen, Fu-Ren Hsiao
  • Publication number: 20070171130
    Abstract: A multi-band antenna with the broadband function is based upon a planar inverted-F antenna with two conductive arms and a ground. The two conductive arms extend from the ground near the two opposite ends of the ground. Two radiation plates of the two conductive arms extend toward each other. The multi-band antenna has a sufficient large band at high frequencies. Since the conductive arms are disposed close to the two ends of the ground, operations of bending the two conductive arms or soldering a feed wires are simpler and have a higher yield.
    Type: Application
    Filed: November 27, 2006
    Publication date: July 26, 2007
    Inventors: Ming-Hsun Chung, Tsung-Wen Chiu, Ching-Feng Tseng, Yun-Fan Bai, An-Chia Chen, Fu-Ren Hsiao
  • Patent number: 6691876
    Abstract: A semiconductor wafer cassette has a first side wall, a second side wall opposite the first side wall, a front surface, and a back surface opposite the front surface. A body defines an internal bay portion with slots for vertically receiving wafers, each slot of the internal bay portion having one support slab. The body also includes two parallel legs for supporting the cassette and a handle for handling the cassette.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: February 17, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng, Fu-Tang Chu
  • Publication number: 20030075518
    Abstract: The present invention discloses a semiconductor wafer cassette, which is able to receive at least one wafer, comprising: a first side wall, a second side wall opposite to the first side wall, a front surface, and a back surface opposite to the front surface; the cassette further comprising a body, the body defining an internal bay portion with slots for vertically receiving a plurality of wafers, each slot of the internal bay portion having one support slab. Moreover, the body also includes two parallel legs for supporting the cassette and a handle for handling the wafer cassette.
    Type: Application
    Filed: January 25, 2002
    Publication date: April 24, 2003
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng, Fu-Tang Chu
  • Patent number: D649962
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: December 6, 2011
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ching-Feng Tseng, Kai Shih, Jia-Hung Su, Lan-Yung Hsiao
  • Patent number: D654061
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: February 14, 2012
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ching-Feng Tseng, Jia-Hung Su, Kai Shih
  • Patent number: D658639
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 1, 2012
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yi-Feng Huang, Jia-Hung Su, Kai Shih, Ching-Feng Tseng
  • Patent number: D659685
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 15, 2012
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yi-Feng Huang, Jia-Hung Su, Kai Shih, Ching-Feng Tseng