Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: In one embodiment, a method includes accessing a machine-learning model configured to generate an encoding for an utterance by using a module to process data associated with each segment of the utterance in a series of iterations, performing operations associated with an i-th segment during an n-th iteration by the module, which include receiving an input comprising input contextual embeddings generated for the i-th segment in a preceding iteration and a memory bank storing memory vectors generated in the preceding iteration for segments preceding the i-th segment, generating attention outputs and a memory vector based on keys, values, and queries generated using the input, and generating output contextual embeddings for the i-th segment based on the attention outputs, providing the memory vector to the module for performing operations associated with the i-th segment in a next iteration, and performing speech recognition by decoding the encoding of the utterance.

Abstract: An exemplary centrifugal blower is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The centrifugal blower includes a housing defining a receiving space therein, and an impeller rotatably received in the housing. The impeller includes a hub, a supporting member fixed on the hub, and a plurality of blades extending outwardly from the supporting member. The blades are made of metal.

Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.

Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.