Patents by Inventor Ching-Fong Lee

Ching-Fong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultra-thin thermally enhanced electro-magnetic interference shield package
    Patent number: 10600743
    Abstract: A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: March 24, 2020
    Assignee: Inari Semiconductor Labs Sdn Bhd
    Inventors: Ching-Fong Lee, Heap-Hooi Nyeo, Chin-Chooi Ch'ng, Ooi-Lin Cheng
  • ULTRA-THIN THERMALLY ENHANCED ELECTRO-MAGNETIC INTERFERENCE SHIELD PACKAGE
    Publication number: 20190139902
    Abstract: A method to fabricate an electronic package is described and includes the steps of: connecting a plurality of semiconductor chips to at least one surface of a substrate using a connect pad; encapsulating the semiconductor chips with a non-conductive material; and forming an electro-magnetic interference shield layer over the encapsulated semiconductor chip.
    Type: Application
    Filed: September 12, 2018
    Publication date: May 9, 2019
    Applicant: Inari Semiconductor Labs Sdn Bhd
    Inventors: Ching-Fong Lee, Heap-Hooi Nyeo, Chin-Chooi Ch'ng, Ooi-Lin Cheng