Patents by Inventor Ching-Fu Huang

Ching-Fu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11998894
    Abstract: A composite solid base catalyst, a manufacturing method thereof and a manufacturing method of glycidol are provided. The composite solid base catalyst includes an aluminum carrier and a plurality of calcium particles. The plurality of calcium particles are supported by the aluminum carrier. Beta basic sites of the composite solid base catalyst are 0.58 mmol/g-3.89 mmol/g.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: June 4, 2024
    Assignees: NATIONAL TSING HUA UNIVERSITY, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., LTD., DAIREN CHEMICAL CORP.
    Inventors: De-Hao Tsai, Yung-Tin Pan, Che-Ming Yang, Ching-Yuan Chang, Ding-Huei Tsai, Chien-Fu Huang, Yi-Ta Tsai
  • Patent number: 11990454
    Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
  • Patent number: 11984342
    Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
  • Patent number: 11948881
    Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsi-Kuei Cheng, Chih-Kang Han, Ching-Fu Chang, Hsin-Chieh Huang
  • Patent number: 10505296
    Abstract: A track light structure and an earth terminal fitting are disclosed. The track light structure includes a light body having a terminal block. The terminal block has two conductive terminals for connecting a live wire and a neutral wire. The terminal block has a socket communicating with the light body for insertion of a pin extending from the underside of a base of an earth terminal fitting, so that the pin is electrically connected to the light body. The base has a connecting portion and a conductive member electrically connected to the pin. The conductive member is configured to connect an earth wire. The earth terminal fitting is selectively connected to the terminal block through the connecting portion, thereby changing the track light to a three-terminal or two-terminal configuration.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 10, 2019
    Assignee: King One Products Co.
    Inventor: Ching Fu Huang
  • Publication number: 20120130704
    Abstract: A real-time translation method for a mobile device is disclosed. In this method, a location of the mobile device is provided by a global positioning system (GPS). Then, an image is captured, and characters shown in the image are recognized in accordance with a language used in the location of the mobile device. Thereafter, the characters recognized are translated in accordance with a translation database. Then, a translation result of the characters recognized is displayed.
    Type: Application
    Filed: April 15, 2011
    Publication date: May 24, 2012
    Applicant: INVENTEC CORPORATION
    Inventors: Po-Tsang LEE, Yuan-Chi TSAI, Meng-Chen TSAI, Ching-Hsuan HUANG, Ching-Yi CHEN, Ching-Fu HUANG
  • Publication number: 20120127093
    Abstract: A touch pad disposed in an electronic display device is provided. The touch pad includes a sliding region, a first virtual-key region and a second virtual-key region both adjacent to the sliding region, a first vibrator and a second vibrator. The sliding region are capable of sensing a dragging action, the first virtual-key region and the second virtual-key region are capable of sensing a pressing action, and the second virtual-key region corresponds to one side of the first virtual-key region. The first vibrator and the second vibrator are respectively disposed underneath the first virtual-key region and the second virtual-key region. When the first virtual-key region senses the pressing action, the first vibrator generates vibration. When the second virtual-key region senses the pressing action, the second vibrator generates vibration.
    Type: Application
    Filed: April 27, 2011
    Publication date: May 24, 2012
    Applicant: INVENTEC CORPORATION
    Inventors: Ching-Hsuan HUANG, Po-Tsang LEE, Meng-Chen TSAI, Ching-Fu HUANG, Ching-Yi CHEN, Yuan-Chi TSAI
  • Patent number: 5322000
    Abstract: A material holding and guiding device of automatic lathe has a base with one end provided with an arm frame and another end provided with a reciprocating set. A receiving and retaining set is mounted pivotally on the arm frame in a manner that the bottom of the receiving and retaining set is coupled with the reciprocating set. The receiving and retaining set has an inner annular body and an outer annular body. The inner annular body is axially provided with a through hole which is used to accommodate therein the material to be lathed and which is provided at each of two ends thereof with a ring sleeve. The motion of the reciprocating set causes the receiving and retaining set to make a swing of a predetermined angle so as to force the ring sleeves located at both ends of the through hole of the inner annular body to hold the material stably in a manner that the material is capable of turning synchronously with the inner annular body.
    Type: Grant
    Filed: September 14, 1993
    Date of Patent: June 21, 1994
    Inventor: Ching-Fu Huang
  • Patent number: D369693
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: May 14, 1996
    Assignee: Leefu Wood Products Co., Ltd.
    Inventor: Ching-Fu Huang
  • Patent number: D372807
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: August 20, 1996
    Assignee: Leefu Wood Products Co., Ltd.
    Inventor: Ching-Fu Huang
  • Patent number: D1024640
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 30, 2024
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Fang-Cheng Su, Ci-Bin Huang, Ching-Fu Chiu, Shu-Chen Lin