Abstract: An audible post-it system includes a post-it note printed with an index and an optical reading and recording device having an optical module, a switch, a storage device, an audio recording device, an audio playing device and a processor. The optical reading and recording device reads an image of the index. When the optical reading and recording device is at a recoding state, the processor receives the image of the index and obtains the index, then receives a digital audio outputted by the audio recording device to match the index with the digital audio, and stores the digital audio based on the index. When the optical reading and recording device is at a playing state, the processor receives the image of an index and retrieves the index, then reads a digital audio based on the index, and sends the digital audio to the audio playing device for playing.

Abstract: An audible post-it system includes a post-it note printed with an index and an optical reading and recording device having an optical module, a switch, a storage device, an audio recording device, an audio playing device and a processor. The optical reading and recording device reads an image of the index. When the optical reading and recording device is at a recoding state, the processor receives the image of the index and obtains the index, then receives a digital audio outputted by the audio recording device to match the index with the digital audio, and stores the digital audio based on the index. When the optical reading and recording device is at a playing state, the processor receives the image of an index and retrieves the index, then reads a digital audio based on the index, and sends the digital audio to the audio playing device for playing.

Abstract: The invention relates to an apparatus and a method for remote interactive amusement. The method includes: providing a first computing apparatus and a second computing apparatus; providing a remote interactive amusement apparatus; and connecting the remote interactive amusement apparatus to the first computing apparatus; and connecting the first computing apparatus and the second computing apparatus to an Internet server. When the first computing apparatus is coupled to the remote interactive amusement apparatus through a computing apparatus connecting interface and the first computing apparatus receives a first specific instruction transmitted from the second computing apparatus, the first computing apparatus transmits a second specific instruction to the remote interactive amusement apparatus through the computing apparatus connecting interface according to the first specific instruction, and the remote interactive amusement apparatus responds a specific response according to the second specific instruction.

Abstract: A manufacturing method of a multi-layer circuit board with an embedded passive component includes providing a single layer plate having a dielectric layer and a first conductive foil, heating the single layer plate to melt the dielectric layer, pressing a passive component into the second surface of melting dielectric layer, stacking the single layer plate on a core substrate, stacking a second conductive foil on single layer plate, and forming electrical pattern on the second conductive foil. The dielectric layer has a first surface and a second surface. The first conductive foil is disposed on the first surface.

Abstract: A bridging circuit is provided. The bridging circuit includes a USB interface, a USB host, a memory card interface, a buffer and a microprocessor controller. The USB host reads data from and outputs data to a USB device via the USB interface. The memory card interface reads data from and outputs data to a system device. The buffer stores the data from the USB host and/or the memory card interface. The microprocessor controller outputs control signals to the USB host, the buffer and the memory card interface to mediate the data transmission between the USB host, the buffer and the memory card interface.

Abstract: A manufacturing method of a multi-layer circuit board with an embedded passive component includes providing a single layer plate having a dielectric layer and a first conductive foil, heating the single layer plate to melt the dielectric layer, pressing a passive component into the second surface of melting dielectric layer, stacking the single layer plate on a core substrate, stacking a second conductive foil on single layer plate, and forming electrical pattern on the second conductive foil. The dielectric layer has a first surface and a second surface. The first conductive foil is disposed on the first surface.

Abstract: The embodiment of the present invention provides an USB device that can be directly connected to another USB device to allow data exchange to take place without involving a use of a computer. Further, the embodiment of the invention also exploits a MP3 codec to allow voice data to be played or recorded via the USB device of the embodiment of the invention.

Abstract: The embodiment of the present invention provides an USB device that can be directly connected to another USB device to allow data exchange to take place without involving a use of a computer. Further, the embodiment of the invention also exploits a MP3 codec to allow voice data to be played or recorded via the USB device of the embodiment of the invention.

Abstract: A manufacturing method of a multi-layer circuit board with an embedded passive component includes: providing a conductive layer which has a first surface and a second surface; forming a metal paste on the first surface to form metal joints; using a sintering process to connect a passive element to the corresponding metal joints; stacking a core substrate and an organic isolated layer on the first surface of the conductive layer; and forming electrical pattern connecting to the passive element on the second surface of the conductive layer.

Abstract: A bumping process, a bump structure, a packaging process and a package structure are described. The bump structure comprises a first solder portion, a second solder portion and a conductive layer. The second solder portion is disposed on the first solder portion and the conductive layer is disposed between the first solder portion and the second solder portion. The bumping process produces a bump structure having a greater height. The bumping process can also be applied in a package process to form a package structure having a highly reliable connection between a chip and a packaging substrate.

Abstract: An MP3 application device is provided. The MP3 application device comprises a host interface module, a playing module and a loudspeaker or a frequency modulation transmitter. Furthermore, a universal serial bus (USB) device or a memory card can be plugged into the MP3 application device. In this invention, the playing module issues a fetch instruction to read MP3 code data from the USB device or the memory card. An MP3 decoder with the playing module decodes the MP3 code data into voice data. The voice data is transmitted to the loudspeaker and broadcast. Alternatively, the voice data is sent to the frequency modulation transmitter and transmitted as wireless signals.

Abstract: The embodiment of the present invention provides an USB device that can be directly connected to another USB device to allow data exchange to take place without involving a use of a computer. Further, the embodiment of the invention also exploits a MP3 codec to allow voice data to be played or recorded via the USB device of the embodiment of the invention.