Abstract: An ink-jet print head with a chamber sidewall heating mechanism includes a substrate, an insulation layer on the substrate, a main channel penetrating through the substrate, a plurality of V-shaped micro-channels each having a diverging end linking with the main channel and a converging end linking with an ink chamber on the insulation layer, and a nozzle plate with a plurality of orifices formed on the ink chamber. The V-shaped micro-channels are perpendicular to the main channel and parallel to and arranged on the insulation layer. Each chamber sidewall includes a heater structure to evaporate ink in the chamber to form a bubble, which pushes the ink in the chamber to eject from the orifice.

Abstract: A card device includes a substrate having two long sides and two short sides, and a sweep-type fingerprint sensor embedded into the substrate. The sweep-type fingerprint sensor has an exposed fingerprint sensing surface, and is disposed in a rectangular low-stress region. The rectangular low-stress region has a dimension substantially smaller than or equal to 30 mm*22 mm. The shortest distance from the low-stress region to each long side is substantially equal to 2 mm, and the shortest distance from the low-stress region to each short side is substantially equal to 2 mm.

Abstract: An ink-jet print head with a chamber sidewall heating mechanism includes a substrate, an insulation layer on the substrate, a main channel penetrating through the substrate, a plurality of V-shaped micro-channels each having a diverging end linking with the main channel and a converging end linking with an ink chamber on the insulation layer, and a nozzle plate with a plurality of orifices formed on the ink chamber. The V-shaped micro-channels are perpendicular to the main channel and parallel to and arranged on the insulation layer. Each chamber sidewall includes a heater structure to evaporate ink in the chamber to form a bubble, which pushes the ink in the chamber to eject from the orifice.

Abstract: A card device includes a substrate having two long sides and two short sides, and a sweep-type fingerprint sensor embedded into the substrate. The sweep-type fingerprint sensor has an exposed fingerprint sensing surface, and is disposed in a rectangular low-stress region. The rectangular low-stress region has a dimension substantially smaller than or equal to 30 mm*22 mm. The shortest distance from the low-stress region to each long side is substantially equal to 2 mm, and the shortest distance from the low-stress region to each short side is substantially equal to 2 mm.

Abstract: A method for manufacturing a bidirectionally vertical motion actuator includes the steps of: providing a silicon-on-insulator (SOI) wafer, which comprises a first silicon wafer, an insulation layer on a top surface of the first silicon wafer, and a second silicon wafer; forming a dielectric layer on the SOI wafer by way of deposition; depositing a conductive layer on the dielectric layer; etching the conductive layer, the dielectric layer and the second silicon wafer simultaneously to form a proper top trench; and forming an anisotropic etching groove on a backside of the SOI wafer. A bidirectionally vertical motion actuator formed using the method is also disclosed.