Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

Abstract: An injection molding system includes a supplying unit configured to supply a flowable mixture; an injection unit communicable with the supplying unit, wherein the injection unit includes an outlet configured to discharge the flowable mixture; a molding device configured to receive the flowable mixture from the outlet and includes a mold cavity and a feeding port communicable with the mold cavity and engageable with the outlet; and a supporting device disposed between the injection unit and the molding device and configured to facilitate an engagement of the injection unit and the molding device. The supporting device includes a first element connected to the injection unit and a second element disposed on the molding device. The second element includes a slot configured to receive a protruding portion of the first element, the protruding portion of the first element is slidable within and along the slot of the second element.

Abstract: The present disclosure provides a circuit board including a first circuit layer, a dielectric layer on the first circuit layer, and a seed layer on the dielectric layer and directly contacting the first circuit layer, in which a top surface of the seed layer includes a levelled portion. The circuit board also includes a second circuit layer on the levelled portion of the seed layer, in which a grain boundary density of the second circuit layer is lower than that of a portion of the seed layer directly contacting the first circuit layer.

Abstract: A method of wireless signal transmission management includes transmitting a plurality of data packets to tethering equipment from user equipment to tethering equipment, determining a size of each of the plurality of data packets by the tethering equipment, designating data packets of the plurality of data packets having a specific range of sizes as control signal packets by the tethering equipment, and prioritizing in transmitting the control signal packets to a cellular network by the tethering equipment.

Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A molding device includes a mold cavity defined by an upper mold, a lower mold and a middle mold being moveably attached to the lower mold; a position control mechanism configured to move the middle mold; and a gas discharging mechanism disposed adjacent to the mold cavity and including a gas conduit and a slit jointly defined by the upper mold and the lower mold when the molding device is closed, the slit is in communication with the mold cavity and the gas conduit. A molding method includes injecting a material into a mold cavity to form an article in the mold cavity; discharging at least a portion of a gas out of the mold cavity through a slit of a gas discharging mechanism adjacent to the mold cavity after the article is formed; disengaging a upper mold from a lower mold; and detaching the article from a middle mold.

Abstract: An injection molding system and method are disclosed. The injection molding system includes a molding device and injector. The molding device defines a mold cavity and includes an inlet portion in communication with the mold cavity. The injector includes a discharging channel. An end portion of the inlet portion and an end portion of the discharging channel have non-planar end surfaces respectively, which are engageable with each other.

Abstract: A main technical feature of a method for molding and forming a flip-flop and a mold thereof provided by the invention is that when a polymer raw material is filled into a mold chamber space of the mold, the filled raw material is preferentially flowed in a direction of a strap area space used to mold a V-shaped strap portion of the flip-flop to ensure that the slender V-shaped strap portion of the flip-flop can be integrally formed.

Abstract: A molding device and a molding method are disclosed. The molding device includes an upper mold, a lower mold and a middle mold. The lower mold is disposed below the upper mold. The middle mold is disposed between the upper mold and the lower mold. The middle mold is moveably attached to the lower mold through a position control mechanism.

Abstract: A molding method includes providing a molding device, wherein the molding device includes a first mold and a second mold corresponding to the first mold; moving the first mold towards the second mold to form a first mold cavity; supplying a gas to the first mold cavity; injecting a material into the first mold cavity; and moving the first mold away from the second mold to form a second mold cavity and discharge at least a portion of the gas out of the molding device, wherein a first volume of the first mold cavity is substantially less than a second volume of the second mold cavity.

Abstract: An injection-molding system includes an extruding system configured to produce a mixture; a discharging channel communicable with the extruding system and including an outlet configured to discharge the mixture; and molding devices configured to receive the mixture. Each of the molding devices includes a hollow space, and a feeding port communicable with the hollow space and engageable with the outlet. An injection-molding method includes providing an extruding system configured to produce a mixture, a discharging channel including an outlet, and first and second molding devices; engaging the outlet with the first molding device; injecting the mixture into the first molding device; disengaging the outlet from the first molding device; moving the discharging channel away from the first molding device and toward the second molding device; engaging the outlet with the second molding device; injecting the mixture into the second molding device; and disengaging the outlet from the second molding device.

Abstract: An injection molding system includes an extruding system. The extruding system includes a mixing unit configured to receive the polymeric material from the melting unit and configured to mix a polymeric material with a blowing agent and to form a mixture, wherein the mixing unit includes a mixing rotor disposed in a hollow mixing cartridge, and a ratio of a shortest distance between an inner sidewall of the hollow mixing cartridge and the mixing rotor to a diameter of the mixing rotor is in a range of 1:1500 to 1:4500. The injection molding system further includes a discharging channel communicable with the extruding system, a molding device configured to receive the mixture from the discharging channel, and a supporting device configured to facilitate an engagement of the discharging channel and the molding device, the supporting device includes a first element protrudes from the extruding system and a second element disposed on the molding device.

Abstract: A molding device and an injection molding method thereof are provided. The molding device includes a first mold, a second mold and a sealing ring. The first mold includes a first body and at least one slide. The at least one slide is movably and detachably disposed on the first body, and has an undercut. The injection molding method includes operations of: engaging the first mold with the second mold of the molding device; filling a mold cavity defined by the first mold and the second mold with a gas, wherein the gas is blocked by the sealing ring disposed between the first mold and the second mold; injecting a molding material into the mold cavity; and opening the first mold and the second mold of the molding device.

Abstract: A molding method includes providing a molding device, wherein the molding device includes a mold cavity, a feeding port in communication with the mold cavity, and a junction point in connection with the mold cavity; engaging an outlet of an injector to the feeding port; injecting a molding material including a blowing agent into the mold cavity from the feeding port by the injector; and injecting a gas into the mold cavity through the junction point to increase a pressure inside the mold cavity to a predetermined pressure for maintaining the blowing agent in a supercritical state.

Abstract: An injection-molding system includes an extruding system configured to produce a mixture; a discharging channel communicable with the extruding system and including an outlet configured to discharge the mixture; and molding devices configured to receive the mixture. Each of the molding devices includes a hollow space, and a feeding port communicable with the hollow space and engageable with the outlet. An injection-molding method includes providing an extruding system configured to produce a mixture, a discharging channel including an outlet, and first and second molding devices; engaging the outlet with the first molding device; injecting the mixture into the first molding device; disengaging the outlet from the first molding device; moving the discharging channel away from the first molding device and toward the second molding device; engaging the outlet with the second molding device; injecting the mixture into the second molding device; and disengaging the outlet from the second molding device.

Abstract: A main technical feature of a method for molding and forming a flip-flop and a mold thereof provided by the invention is that when a polymer raw material is filled into a mold chamber space of the mold, the filled raw material is preferentially flowed in a direction of a strap area space used to mold a V-shaped strap portion of the flip-flop to ensure that the slender V-shaped strap portion of the flip-flop can be integrally formed.