Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

Abstract: A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.

Abstract: A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Abstract: A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.

Abstract: A dental tray and a method for fabricating the same are presented. The dental tray includes a thermoplastic material and a fabric bonded to the thermoplastic material. The method for fabricating a dental tray includes preparing a thermoplastic material and a fabric, and bonding the thermoplastic material to the fabric.

Abstract: An LED heat dissipation module including a heat pipe, an LED and a heat sink is provided. The heat pipe has at least a flat portion having a surface. The LED is provided at the surface of the flat portion of the heat pipe. The heat sink is coupled to the heat pipe. The heat dissipation efficiency of the LED heat dissipation module is increased.

Abstract: A heat dissipation module is disclosed. The heat dissipation module suitable to dissipates heat generating by for a heat source, and multiple fixing parts are disposed around the heat source. The heat dissipation module includes a heat sink, two first rods, and two second rods corresponding to the first rods. The first rods and the second rods are pivotally provided on the heat sink. Each first shaft rod is suitable to rotate about a first axis. Two hooks of each first rod fasten the fixing parts easily. Each second rod is suitable to rotate about a second axis and leans against the heat sink. Thus, each second rod tightly fits with each first rod, and two hooks of each first rod tightly fasten the fixing parts. The heat sink is forced by the first rods, and the heat sink and the heat source abut against each other tightly.

Abstract: A light emitting diode (LED) light source device includes a plurality of LED modules, a base and a clip. The base has a first base body, a second base body, and a third base body. The second base body and the third base body extend from two sides of the first base body and are corresponding to each other. The LED modules are provided at inside surfaces of the first base body, the second base body and the third base body. The clip holds the LED modules and fastens the second base body and the third base body to enable the LED modules to be tightly assembled at the base.

Abstract: A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.

Abstract: A light emitting diode (LED) heat dissipation module is suitable to dissipate heat for at least a LED. The LED heat dissipation module includes a heat dissipation base, at least a heat conductor, and a plurality of heat dissipation fins. The heat dissipation base has a first surface and a second surface corresponding to the first surface. The LED is provided on the first surface and the heat conductor is provided on the second surface. In addition, the heat dissipation fins are provided at the heat conductor, and the heat dissipation fins are separated from the heat dissipation base.

Abstract: A heat dissipation module is suitable to dissipate heat for a heat source on a circuit board, wherein a plurality of locking holes are disposed around the heat source. The heat dissipation module includes a heat sink, a locking rod, and two fasteners. The heat sink has a groove, and the locking rod has a rod body and two hooks extended from two ends of the rod body. The rod body is across the groove. In addition, each fastener is connected to each corresponding hook, and is fastened at the locking hole.

Abstract: A nickel cobalt phosphorus electroplating composition includes a nickel salt, a cobalt salt, a phosphite-containing compound, and a multidentate chelating agent selected from triethylene tetraamine, diethylene triamine, hydrazobenzene, and combinations thereof. An electroplating solution including the nickel cobalt phosphorus electroplating composition and a method for treating a surface of a workpiece using the electroplating solution are also disclosed.

Abstract: This invention relates to a method for forming a nickel-based layered structure and a boundary layer containing a solid solution of magnesium and an M-metal on a magnesium alloy substrate. A surface-treated magnesium alloy article made from the above method, and a cleaning solution and a surface treatment solution used in the above method are also disclosed.

Abstract: A direction-adjustable diffusive device is disclosed to include a heat sink, which has a rotating mechanism positioned on the outside of the heat sink, and a cowling, which has another rotating mechanism correspondingly coupled to the rotating mechanism of the heat sink, and a wind-guiding channel comprising a first wind-guiding hole facing the heat sink. The cowling uses the other rotating mechanism and the rotating mechanism for allowing the cowling to be turned about the heat sink to adjust a heat dissipation direction of the heat sink. Therefore, the cowling can use the other rotating mechanism and the rotating mechanism to rotate relatively to the heat sink, which means that the direction of the cowling can be adjusted through 360° according to the requirements to dissipate heat through the heat sink.

Abstract: A heat-dissipating device includes: a base plate for disposing on a mounting surface, a plurality of cooling fins extending vertically from the base plate to define a first channel and a second channel on an upper surface of the base plate, and a fastening member. The fastening member includes a first portion disposed in the first channel and having an engaging element for engaging a lower surface of the base plate adjacent to one end thereof, a second portion disposed in the second channel and extending integrally from the first portion, and a third portion extending integrally from the second portion. The first and second portions are located in a plane, which cooperates with the third portion to define an angle. The third portion has a hook for securing the base plate onto the mounting surface.

Abstract: The invention provides a microelectronic system, which can actively carry out and control molecular biological reactions in microscopic formats. The microelectronic system is accomplished by using electrochemical detection for bulge sites in binding pairs, in order to enhance sensitivity without marking the probe with reporter groups. Together with electrical stringency control, the method can be fully automated with minimum sample preparation. The present invention is especially useful for diagnosing base pair mismatches in target sequences by using specific metal complexes for detection.

Abstract: A predistortion circuit and method provides signals to oppose and cancel an anticipated phase and frequency distortion in a coupled electrical system. The predistortion circuitry includes first and second subcircuits which include opposing diodes, providing 180 degree out-of-phase and in-phase signals to produce second, third and higher order predistortion outputs.

Abstract: An optical receiver communication system converts optical signals modulated by analog or digital waveforms to RF signals. The optical receiver contains an automatic level control circuit to adjust the electronic gain of the system across a broad bandwidth spectrum. Two impedance matching circuits are designed using broad band matching technique to expand the bandwidth for increasing the maximum receivable frequencies to 1 GHz. A RLC impedance matching circuit forms a resonant combination to maintain .+-.1 dB fluctuation between the low-and-high-frequency limits of the bandwidth, and a 75.OMEGA. impedance matching circuit creates a 180.degree. phase shift between outgoing and incoming signals to ensure low return loss.