Abstract: A glass composition includes, based on 100 wt % of the glass composition, silicon dioxide present in an amount ranging from 45 wt % to 61 wt %, aluminum oxide present in an amount (A) ranging from 15 wt % to 22 wt %, calcium oxide present in an amount (C) ranging from 0.1 wt % to 6 wt %, magnesium oxide present in an amount (M) of greater than 0 wt % and lower than 2 wt %, zinc oxide present in an amount of greater than 0 wt % and lower than 8 wt %, copper oxide present in an amount of greater than 0 wt % and lower than 7 wt %, and boron oxide present in an amount of greater than 6 wt % and lower than 18 wt %. A glass fiber including the glass composition, and an electronic product including the glass fiber are also provided.

Abstract: A connector and a manufacturing method thereof. The connector includes at least one circuit substrate, at least one contact and a first elastic body. The at least one circuit substrate has a first surface. The at least one contact includes a fixed part and a first contact part that are connected to each other. The fixed part is disposed on the at least one circuit substrate. The first contact part protrudes out of the first surface and covers a part of the first surface. The first elastic body is disposed on the first surface and is electrically insulated. At least a part of the first elastic body is located between the first contact part and the first surface.

Abstract: An LED driver, an LED lighting system and an operating method thereof are provided. The LED driver is for driving an LED light source and includes a strobe circuit and a DC-DC converter. The strobe circuit generates a low-frequency modulation signal. The DC-DC converter is coupled to the strobe circuit and is configured to provide an adjustable operating current to the LED light source according to a DC signal and the low-frequency modulation signal. The operating current includes a DC current signal and a low-frequency AC current signal corresponding to the DC signal and the low-frequency modulation signal respectively. A frequency of the low-frequency AC current signal is between 25 Hz and 100 Hz, and a current ripple factor, equaling a difference of a maximum value and a minimum value of the operating current divided by a sum of the maximum value and the minimum value, is less than 8%.

Abstract: An improved cylindrical white laser diode packaging structure in which a blue laser beam is projected by a blue-light laser chip and the blue laser beam with the fluorescent powder of the ceramic fluorescent powder to generate physical excitation characteristics to reflect the white laser beam. Mainly a base with a concave groove in the middle for fixing a ceramic florescent powder, and the base has a seat bar protruding adjacent to the concave groove, and the front of the seat bar is in a vertical plane or an oblique plane for fixing a blue-light laser chip, and a cover body with a light transmissive mouth on the top surface is fixed to the base to form a cylindrical white light laser diode.

Abstract: A ring focus spectacle lens (1) for controlling the progression of myopia, and a manufacturing method therefor. The ring focus spectacle lens (1) can provide clear vision for a patient, and also has a plurality of ring-shaped defocusing zones to provide an optical defocusing effect. Since there is no joint between successive concentric rings of different optical powers that are tangent to each other, the ring focus spectacle lens (1) is as aesthetic as a common spectacle lens. In the manufacturing method, three front mold cores (71), a rear mold core (72), and a planar rear mold core are used to manufacture a series of ring focus spectacle lenses (1) having different powers, thereby reducing the number of mold cores and the production cost.

Abstract: An operating method of a fully homomorphic encrypted neural network model is provided, wherein the fully homomorphic encrypted neural network model includes a plurality of layers, and the method performed by a processor includes: for one of the plurality of layers, encrypting a plaintext input with a first encryption algorithm to generate a ciphertext vector, performing a convolution operation according to the ciphertext vector to generate a result vector, transforming the result vector into a plurality of result ciphertexts adopting a second encryption algorithm, inputting the plurality of result ciphertexts into an activation function to generate a plurality of encrypted activation values, and repacking the plurality of encrypted activation values to generate an output vector adopting the first encryption algorithm.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: An optical engine module configured to receive an illumination beam includes a casing, a light uniforming element, an optical lens element, an elastic member, and a light valve. The casing has an accommodating space. The light uniforming element, the optical lens element, and the elastic member are disposed in the accommodating space. The optical lens element is disposed adjacent to a light exit end of the light uniforming element. The elastic member surrounds at least part of an outer periphery of the optical lens element. The elastic member is sealingly disposed in a gap between the optical lens element and the casing to separate the accommodating space into a first chamber and a second chamber, in which the light uniforming element is positioned in the first chamber. The illumination beam passes through the light uniforming element and the optical lens element sequentially and is transmitted to the light valve.

Abstract: An electronic package is provided and includes: a thermally conductive chip; a circuit structure having a circuit layer; and an electronic component disposed between the circuit structure and the thermally conductive chip and electrically connected to the circuit layer, so as to dissipate the heat generated during the operation of the electronic component via the thermally conductive chip. A method of manufacturing the electronic package is further provided.

Abstract: A three-dimensional integrated circuit stack comprises a first integrated circuit structure, a second integrated circuit structure bonding to the first integrated circuit structure, and a redistribution structure. The first integrated circuit structure comprises a first semiconductor device, a first buffer structure, a first interconnect structure, a first conductive via, and a first through via. The first semiconductor device is located between the first buffer structure and the first interconnect structure. The first conductive via is extending through the first buffer structure and in contact with the first semiconductor device. The first through via is extending from the first buffer structure to the first interconnect structure. The redistribution structure is disposed on the first buffer structure, electrically connected to the first semiconductor device through the first conductive via, and electrically connected to the first interconnect structure through the first through via.

Abstract: A system for expense management including an expense management apparatus. The expense management apparatus configured to receive, from a client device, at least one parameter associated with an event, construct at least one query based on the at least one parameter, transmit the at least one query to a database, receive, from the database, responsive data responding to the at least one query, construct a benchmark, using a processing arrangement, associated with the at least one parameter, and transmit the benchmark to the client device.

Abstract: Source/drain silicide that improves performance and methods for fabricating such are disclosed herein. An exemplary device includes a first channel layer disposed over a substrate, a second channel layer disposed over the first channel layer, and a gate stack that surrounds the first channel layer and the second channel layer. A source/drain feature disposed adjacent the first channel layer, second channel layer, and gate stack. The source/drain feature is disposed over first facets of the first channel layer and second facets of the second channel layer. The first facets and the second facets have a (111) crystallographic orientation. An inner spacer disposed between the gate stack and the source/drain feature and between the first channel layer and the second channel layer. A silicide feature is disposed over the source/drain feature where the silicide feature extends into the source/drain feature towards the substrate to a depth of the first channel layer.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A spring lock for a skate wheel includes a housing including opposite first and second holes, and a third hole; a pin through the first and second holes and including first and second grooves; a button on the third hole; a back plate on a back of the housing; a first biasing member secured to the back plate; a stop member secured to the first groove; a sliding member having one end urging against the first biasing member and the other end contacting the button to slidably dispose on the second groove, the sliding member including small and large holes; and a second biasing member on the pin and having one end urging against an inner surface of the housing and the other end urging against the stop member. In a locked state, the pin extends into an elongated hole of between two spokes of the wheel.

Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.

Abstract: An LED power supply is provided. The LED power supply adopts constant-voltage/constant-current control, supplies power to an LED device, and includes an isolated DC-DC conversion circuit having primary and secondary sides and a control module. The control module includes a control unit, a feedback circuit, first and second switches and an optocoupler. The control unit is electrically connected to the primary side and controls operation of the conversion circuit. The optocoupler is configured for signal transmission with electrical isolation and includes a transmitter and a receiver electrically connected to the secondary side and the control unit respectively. When the output voltage is lower than a threshold voltage, the first switch is turned off, the second switch is turned on to trigger the optocoupler to generate a trigger signal at the receiver, and the control unit controls the isolated DC-DC conversion circuit to stop operating based on the trigger signal.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.